SG156592A1 - Semiconductor wafer protective film - Google Patents
Semiconductor wafer protective filmInfo
- Publication number
- SG156592A1 SG156592A1 SG200902706-1A SG2009027061A SG156592A1 SG 156592 A1 SG156592 A1 SG 156592A1 SG 2009027061 A SG2009027061 A SG 2009027061A SG 156592 A1 SG156592 A1 SG 156592A1
- Authority
- SG
- Singapore
- Prior art keywords
- resin
- parts
- mass
- semiconductor wafer
- protective film
- Prior art date
Links
Abstract
The present invention provides a semiconductor wafer protective film including a substrate film and a protective layer provided on one side of the substrate film, the protective layer containing: (A) 100 parts by mass of at least one resin selected from the group consisting of a phenoxy resin, a polyimide resin and a (meth)acrylic resin, (B) from 5 to 200 parts by mass of an epoxy resin, (C) from 100 to 400 parts by mass of a filler, and (D) a catalytic amount of an epoxy resin curing catalyst, wherein a silicon rubber fine particle coated with a polyorganosilsesquioxane resin accounts for 10 to 100 parts by mass out of the filler. NO SUITABLE FIGURE
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008115503 | 2008-04-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG156592A1 true SG156592A1 (en) | 2009-11-26 |
Family
ID=41283438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200902706-1A SG156592A1 (en) | 2008-04-25 | 2009-04-21 | Semiconductor wafer protective film |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5233032B2 (en) |
KR (1) | KR101485612B1 (en) |
CN (1) | CN101567340B (en) |
MY (1) | MY162618A (en) |
SG (1) | SG156592A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5298913B2 (en) * | 2009-02-12 | 2013-09-25 | 信越化学工業株式会社 | Adhesive composition and protective sheet for semiconductor wafer using the same |
JP5123341B2 (en) * | 2010-03-15 | 2013-01-23 | 信越化学工業株式会社 | Adhesive composition, semiconductor wafer protective film forming sheet |
JP6159050B2 (en) * | 2010-07-26 | 2017-07-05 | 東京応化工業株式会社 | Adhesive composition and adhesive film |
JP2012033637A (en) * | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
JP2012049388A (en) * | 2010-08-27 | 2012-03-08 | Shin Etsu Chem Co Ltd | Sheet for forming semiconductor wafer protective film |
JP5385247B2 (en) * | 2010-12-03 | 2014-01-08 | 信越化学工業株式会社 | Wafer mold material and semiconductor device manufacturing method |
TWI608062B (en) * | 2011-05-31 | 2017-12-11 | 住友電木股份有限公司 | Resin composition, semiconductor device using said resin composition, and method of producing semiconductor device |
JP5648617B2 (en) * | 2011-10-24 | 2015-01-07 | 信越化学工業株式会社 | Thermally conductive adhesive composition, adhesive sheet and thermal conductive dicing die attach film using the same |
KR101393895B1 (en) * | 2011-11-02 | 2014-05-13 | (주)엘지하우시스 | Adhesive film for protecting surfase of semiconductorwafer which has excellent cutting property |
JP6001273B2 (en) * | 2012-02-13 | 2016-10-05 | 信越化学工業株式会社 | Protective film for semiconductor wafer and method for manufacturing semiconductor chip |
JP5931700B2 (en) * | 2012-11-13 | 2016-06-08 | 信越化学工業株式会社 | Protective film for semiconductor wafer and method for manufacturing semiconductor chip |
CN103242797B (en) * | 2013-05-23 | 2014-06-18 | 江苏亚宝绝缘材料股份有限公司 | Polyimide adhesive |
KR102355113B1 (en) * | 2014-03-28 | 2022-01-24 | 린텍 가부시키가이샤 | Protective-film-forming film and protective-film-equipped semiconductor chip production method |
TW201713507A (en) * | 2015-10-14 | 2017-04-16 | 達邁科技股份有限公司 | Thin polyimide film, and manufacture and assemble of the polyimide film containing polysiloxane polymer from 5wt% to 40wt% with a peeling strength of 0.004-0.1kgf/cm |
JP6763139B2 (en) * | 2015-12-25 | 2020-09-30 | 信越化学工業株式会社 | Solvent-free silicone-modified polyimide resin composition |
JP6579996B2 (en) * | 2016-05-10 | 2019-09-25 | 日東電工株式会社 | Sheet, tape, and semiconductor device manufacturing method |
CN108148535B (en) * | 2017-12-18 | 2020-08-28 | 兰陵杰森装饰材料有限公司 | Hot vulcanization adhesive and preparation method thereof |
KR102419283B1 (en) * | 2021-01-27 | 2022-07-11 | 회명산업 주식회사 | Photocurable glass surface protection paste composition |
CN113150730B (en) * | 2021-05-13 | 2022-07-29 | 湖北三选科技有限公司 | Protective adhesive for wafer cutting |
CN114015055B (en) * | 2021-11-17 | 2023-04-14 | 江西晨光新材料股份有限公司 | Synthesis method and application of functional silane terminated polysiloxane |
EP4303656A1 (en) | 2022-07-08 | 2024-01-10 | Morphotonics Holding B.V. | Removable textured layer |
CN115216264B (en) * | 2022-08-17 | 2024-03-29 | 株洲时代新材料科技股份有限公司 | Preparation method of polyamide acid coating adhesive for power semiconductor packaging |
CN116496738B (en) * | 2023-05-04 | 2024-01-30 | 深圳市安伯斯科技有限公司 | Low-viscosity underfill capable of being quickly cured at low temperature and preparation method thereof |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2832143B2 (en) * | 1993-12-28 | 1998-12-02 | 信越化学工業株式会社 | Silicone fine particles and method for producing the same |
MY131961A (en) * | 2000-03-06 | 2007-09-28 | Hitachi Chemical Co Ltd | Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof |
JP4789080B2 (en) | 2000-06-20 | 2011-10-05 | 日本アエロジル株式会社 | Method for producing amorphous fine silica particles |
JP3954330B2 (en) * | 2001-06-18 | 2007-08-08 | 信越化学工業株式会社 | Liquid resin composition and material for protecting semiconductor device formed by curing the same |
JP4318872B2 (en) * | 2001-07-18 | 2009-08-26 | 電気化学工業株式会社 | Method for producing fine spherical silica powder |
JP4387085B2 (en) * | 2002-05-27 | 2009-12-16 | 住友ベークライト株式会社 | Die attach paste and semiconductor device |
JP4401625B2 (en) * | 2002-07-04 | 2010-01-20 | 日立化成工業株式会社 | Adhesive sheet |
JP4776189B2 (en) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | Wafer processing tape |
JP4776188B2 (en) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | Semiconductor device manufacturing method and wafer processing tape |
JP5040247B2 (en) | 2006-10-06 | 2012-10-03 | 東レ株式会社 | Adhesive composition for semiconductor, semiconductor device using the same, and method for manufacturing semiconductor device |
JPWO2008047610A1 (en) * | 2006-10-06 | 2010-02-25 | 住友ベークライト株式会社 | Film for semiconductor, method for manufacturing semiconductor film, and semiconductor device |
-
2009
- 2009-02-16 KR KR20090012401A patent/KR101485612B1/en not_active IP Right Cessation
- 2009-04-20 JP JP2009101992A patent/JP5233032B2/en not_active Expired - Fee Related
- 2009-04-21 SG SG200902706-1A patent/SG156592A1/en unknown
- 2009-04-23 MY MYPI20091649A patent/MY162618A/en unknown
- 2009-04-27 CN CN2009101377201A patent/CN101567340B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR101485612B1 (en) | 2015-01-22 |
CN101567340B (en) | 2012-07-04 |
JP2009283927A (en) | 2009-12-03 |
MY162618A (en) | 2017-06-30 |
KR20090113178A (en) | 2009-10-29 |
CN101567340A (en) | 2009-10-28 |
JP5233032B2 (en) | 2013-07-10 |
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