SG156592A1 - Semiconductor wafer protective film - Google Patents

Semiconductor wafer protective film

Info

Publication number
SG156592A1
SG156592A1 SG200902706-1A SG2009027061A SG156592A1 SG 156592 A1 SG156592 A1 SG 156592A1 SG 2009027061 A SG2009027061 A SG 2009027061A SG 156592 A1 SG156592 A1 SG 156592A1
Authority
SG
Singapore
Prior art keywords
resin
parts
mass
semiconductor wafer
protective film
Prior art date
Application number
SG200902706-1A
Inventor
Nobuhiro Ichiroku
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of SG156592A1 publication Critical patent/SG156592A1/en

Links

Abstract

The present invention provides a semiconductor wafer protective film including a substrate film and a protective layer provided on one side of the substrate film, the protective layer containing: (A) 100 parts by mass of at least one resin selected from the group consisting of a phenoxy resin, a polyimide resin and a (meth)acrylic resin, (B) from 5 to 200 parts by mass of an epoxy resin, (C) from 100 to 400 parts by mass of a filler, and (D) a catalytic amount of an epoxy resin curing catalyst, wherein a silicon rubber fine particle coated with a polyorganosilsesquioxane resin accounts for 10 to 100 parts by mass out of the filler. NO SUITABLE FIGURE
SG200902706-1A 2008-04-25 2009-04-21 Semiconductor wafer protective film SG156592A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008115503 2008-04-25

Publications (1)

Publication Number Publication Date
SG156592A1 true SG156592A1 (en) 2009-11-26

Family

ID=41283438

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200902706-1A SG156592A1 (en) 2008-04-25 2009-04-21 Semiconductor wafer protective film

Country Status (5)

Country Link
JP (1) JP5233032B2 (en)
KR (1) KR101485612B1 (en)
CN (1) CN101567340B (en)
MY (1) MY162618A (en)
SG (1) SG156592A1 (en)

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Publication number Priority date Publication date Assignee Title
JP5298913B2 (en) * 2009-02-12 2013-09-25 信越化学工業株式会社 Adhesive composition and protective sheet for semiconductor wafer using the same
JP5123341B2 (en) * 2010-03-15 2013-01-23 信越化学工業株式会社 Adhesive composition, semiconductor wafer protective film forming sheet
JP6159050B2 (en) * 2010-07-26 2017-07-05 東京応化工業株式会社 Adhesive composition and adhesive film
JP2012033637A (en) * 2010-07-29 2012-02-16 Nitto Denko Corp Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device
JP2012049388A (en) * 2010-08-27 2012-03-08 Shin Etsu Chem Co Ltd Sheet for forming semiconductor wafer protective film
JP5385247B2 (en) * 2010-12-03 2014-01-08 信越化学工業株式会社 Wafer mold material and semiconductor device manufacturing method
TWI608062B (en) * 2011-05-31 2017-12-11 住友電木股份有限公司 Resin composition, semiconductor device using said resin composition, and method of producing semiconductor device
JP5648617B2 (en) * 2011-10-24 2015-01-07 信越化学工業株式会社 Thermally conductive adhesive composition, adhesive sheet and thermal conductive dicing die attach film using the same
KR101393895B1 (en) * 2011-11-02 2014-05-13 (주)엘지하우시스 Adhesive film for protecting surfase of semiconductorwafer which has excellent cutting property
JP6001273B2 (en) * 2012-02-13 2016-10-05 信越化学工業株式会社 Protective film for semiconductor wafer and method for manufacturing semiconductor chip
JP5931700B2 (en) * 2012-11-13 2016-06-08 信越化学工業株式会社 Protective film for semiconductor wafer and method for manufacturing semiconductor chip
CN103242797B (en) * 2013-05-23 2014-06-18 江苏亚宝绝缘材料股份有限公司 Polyimide adhesive
KR102355113B1 (en) * 2014-03-28 2022-01-24 린텍 가부시키가이샤 Protective-film-forming film and protective-film-equipped semiconductor chip production method
TW201713507A (en) * 2015-10-14 2017-04-16 達邁科技股份有限公司 Thin polyimide film, and manufacture and assemble of the polyimide film containing polysiloxane polymer from 5wt% to 40wt% with a peeling strength of 0.004-0.1kgf/cm
JP6763139B2 (en) * 2015-12-25 2020-09-30 信越化学工業株式会社 Solvent-free silicone-modified polyimide resin composition
JP6579996B2 (en) * 2016-05-10 2019-09-25 日東電工株式会社 Sheet, tape, and semiconductor device manufacturing method
CN108148535B (en) * 2017-12-18 2020-08-28 兰陵杰森装饰材料有限公司 Hot vulcanization adhesive and preparation method thereof
KR102419283B1 (en) * 2021-01-27 2022-07-11 회명산업 주식회사 Photocurable glass surface protection paste composition
CN113150730B (en) * 2021-05-13 2022-07-29 湖北三选科技有限公司 Protective adhesive for wafer cutting
CN114015055B (en) * 2021-11-17 2023-04-14 江西晨光新材料股份有限公司 Synthesis method and application of functional silane terminated polysiloxane
EP4303656A1 (en) 2022-07-08 2024-01-10 Morphotonics Holding B.V. Removable textured layer
CN115216264B (en) * 2022-08-17 2024-03-29 株洲时代新材料科技股份有限公司 Preparation method of polyamide acid coating adhesive for power semiconductor packaging
CN116496738B (en) * 2023-05-04 2024-01-30 深圳市安伯斯科技有限公司 Low-viscosity underfill capable of being quickly cured at low temperature and preparation method thereof

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JP2832143B2 (en) * 1993-12-28 1998-12-02 信越化学工業株式会社 Silicone fine particles and method for producing the same
MY131961A (en) * 2000-03-06 2007-09-28 Hitachi Chemical Co Ltd Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
JP4789080B2 (en) 2000-06-20 2011-10-05 日本アエロジル株式会社 Method for producing amorphous fine silica particles
JP3954330B2 (en) * 2001-06-18 2007-08-08 信越化学工業株式会社 Liquid resin composition and material for protecting semiconductor device formed by curing the same
JP4318872B2 (en) * 2001-07-18 2009-08-26 電気化学工業株式会社 Method for producing fine spherical silica powder
JP4387085B2 (en) * 2002-05-27 2009-12-16 住友ベークライト株式会社 Die attach paste and semiconductor device
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JP4776188B2 (en) * 2004-08-03 2011-09-21 古河電気工業株式会社 Semiconductor device manufacturing method and wafer processing tape
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JPWO2008047610A1 (en) * 2006-10-06 2010-02-25 住友ベークライト株式会社 Film for semiconductor, method for manufacturing semiconductor film, and semiconductor device

Also Published As

Publication number Publication date
KR101485612B1 (en) 2015-01-22
CN101567340B (en) 2012-07-04
JP2009283927A (en) 2009-12-03
MY162618A (en) 2017-06-30
KR20090113178A (en) 2009-10-29
CN101567340A (en) 2009-10-28
JP5233032B2 (en) 2013-07-10

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