KR100912280B1 - 기판처리시스템 - Google Patents
기판처리시스템 Download PDFInfo
- Publication number
- KR100912280B1 KR100912280B1 KR1020020075426A KR20020075426A KR100912280B1 KR 100912280 B1 KR100912280 B1 KR 100912280B1 KR 1020020075426 A KR1020020075426 A KR 1020020075426A KR 20020075426 A KR20020075426 A KR 20020075426A KR 100912280 B1 KR100912280 B1 KR 100912280B1
- Authority
- KR
- South Korea
- Prior art keywords
- unit
- substrate
- pass
- processing
- units
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 235
- 238000012545 processing Methods 0.000 title claims abstract description 131
- 238000010438 heat treatment Methods 0.000 claims abstract description 98
- 230000007246 mechanism Effects 0.000 claims abstract description 61
- 239000000872 buffer Substances 0.000 claims abstract description 58
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 27
- 238000012546 transfer Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 86
- 230000008569 process Effects 0.000 claims description 69
- 238000001816 cooling Methods 0.000 claims description 25
- 238000011282 treatment Methods 0.000 claims description 14
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000007669 thermal treatment Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 37
- 238000000576 coating method Methods 0.000 description 25
- 239000011248 coating agent Substances 0.000 description 13
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000011161 development Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 238000004042 decolorization Methods 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 101150048270 DHPS gene Proteins 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001367010A JP3911624B2 (ja) | 2001-11-30 | 2001-11-30 | 処理システム |
JPJP-P-2001-00367010 | 2001-11-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030044881A KR20030044881A (ko) | 2003-06-09 |
KR100912280B1 true KR100912280B1 (ko) | 2009-08-17 |
Family
ID=19176824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020075426A KR100912280B1 (ko) | 2001-11-30 | 2002-11-29 | 기판처리시스템 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3911624B2 (zh) |
KR (1) | KR100912280B1 (zh) |
CN (1) | CN1249776C (zh) |
TW (1) | TWI248657B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101074388B1 (ko) | 2004-12-22 | 2011-10-17 | 엘지디스플레이 주식회사 | 액정표시장치용 제조 장비 |
CN101273312B (zh) * | 2005-01-28 | 2012-07-04 | 应用材料公司 | 增强衬底载具搬运器操作的方法和装置 |
JP4745040B2 (ja) * | 2005-12-05 | 2011-08-10 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理装置 |
US7690881B2 (en) * | 2006-08-30 | 2010-04-06 | Asm Japan K.K. | Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus |
JP4560022B2 (ja) | 2006-09-12 | 2010-10-13 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体 |
JP6339057B2 (ja) * | 2015-09-29 | 2018-06-06 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラム |
CN106044229A (zh) * | 2016-07-22 | 2016-10-26 | 京东方科技集团股份有限公司 | 一种掩模板搬运设备及曝光机组系统 |
JP6601360B2 (ja) * | 2016-09-30 | 2019-11-06 | 株式会社ダイフク | 物品搬送設備 |
CN110140092B (zh) * | 2017-01-13 | 2022-05-13 | 株式会社富士 | 生产管理装置 |
JP6655689B1 (ja) * | 2018-09-21 | 2020-02-26 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP7142566B2 (ja) * | 2018-12-27 | 2022-09-27 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297258A (ja) * | 1994-04-26 | 1995-11-10 | Tokyo Electron Ltd | 板状体の搬送装置 |
JPH11260883A (ja) * | 1998-03-09 | 1999-09-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11274265A (ja) * | 1998-03-26 | 1999-10-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2001117064A (ja) * | 1999-10-19 | 2001-04-27 | Tokyo Electron Ltd | 搬送装置の位置合わせ機構および位置合わせ方法、ならびに基板処理装置 |
KR20010084137A (ko) * | 2000-02-24 | 2001-09-06 | 구본준, 론 위라하디락사 | 인라인 형태로 구성된 액정표시소자의 검사장치 |
JP2001291664A (ja) * | 2000-02-01 | 2001-10-19 | Tokyo Electron Ltd | 基板処理装置 |
-
2001
- 2001-11-30 JP JP2001367010A patent/JP3911624B2/ja not_active Expired - Fee Related
-
2002
- 2002-11-22 TW TW091134095A patent/TWI248657B/zh not_active IP Right Cessation
- 2002-11-29 CN CNB021518696A patent/CN1249776C/zh not_active Expired - Fee Related
- 2002-11-29 KR KR1020020075426A patent/KR100912280B1/ko not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297258A (ja) * | 1994-04-26 | 1995-11-10 | Tokyo Electron Ltd | 板状体の搬送装置 |
JPH11260883A (ja) * | 1998-03-09 | 1999-09-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11274265A (ja) * | 1998-03-26 | 1999-10-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2001117064A (ja) * | 1999-10-19 | 2001-04-27 | Tokyo Electron Ltd | 搬送装置の位置合わせ機構および位置合わせ方法、ならびに基板処理装置 |
JP2001291664A (ja) * | 2000-02-01 | 2001-10-19 | Tokyo Electron Ltd | 基板処理装置 |
KR20010084137A (ko) * | 2000-02-24 | 2001-09-06 | 구본준, 론 위라하디락사 | 인라인 형태로 구성된 액정표시소자의 검사장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20030044881A (ko) | 2003-06-09 |
CN1249776C (zh) | 2006-04-05 |
CN1426087A (zh) | 2003-06-25 |
JP2003168713A (ja) | 2003-06-13 |
TW200302540A (en) | 2003-08-01 |
JP3911624B2 (ja) | 2007-05-09 |
TWI248657B (en) | 2006-02-01 |
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