KR100912051B1 - 인쇄기판 및 인쇄기판의 제조방법 - Google Patents

인쇄기판 및 인쇄기판의 제조방법

Info

Publication number
KR100912051B1
KR100912051B1 KR1020077012939A KR20077012939A KR100912051B1 KR 100912051 B1 KR100912051 B1 KR 100912051B1 KR 1020077012939 A KR1020077012939 A KR 1020077012939A KR 20077012939 A KR20077012939 A KR 20077012939A KR 100912051 B1 KR100912051 B1 KR 100912051B1
Authority
KR
South Korea
Prior art keywords
carbon
insulating material
heat
layer
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077012939A
Other languages
English (en)
Korean (ko)
Other versions
KR20070085917A (ko
Inventor
마사노리 다께자키
마사유키 고마루
하루키 니타
다카후미 야기
요시유키 미즈노
Original Assignee
유-아이 덴시 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유-아이 덴시 가부시키가이샤 filed Critical 유-아이 덴시 가부시키가이샤
Publication of KR20070085917A publication Critical patent/KR20070085917A/ko
Application granted granted Critical
Publication of KR100912051B1 publication Critical patent/KR100912051B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
KR1020077012939A 2004-12-08 2007-06-08 인쇄기판 및 인쇄기판의 제조방법 Expired - Fee Related KR100912051B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004355203A JP4316483B2 (ja) 2004-12-08 2004-12-08 プリント基板の製造方法及びプリント基板
JPJP-P-2004-00355203 2004-12-08

Publications (2)

Publication Number Publication Date
KR20070085917A KR20070085917A (ko) 2007-08-27
KR100912051B1 true KR100912051B1 (ko) 2009-08-12

Family

ID=36577746

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077012939A Expired - Fee Related KR100912051B1 (ko) 2004-12-08 2007-06-08 인쇄기판 및 인쇄기판의 제조방법

Country Status (7)

Country Link
US (2) US7479013B2 (enExample)
EP (1) EP1821586B1 (enExample)
JP (1) JP4316483B2 (enExample)
KR (1) KR100912051B1 (enExample)
CN (1) CN101103654A (enExample)
DE (1) DE602005017183D1 (enExample)
WO (1) WO2006061916A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1360067B1 (en) 2000-12-12 2007-02-21 C-Core Technologies Inc. Lightweight circuit board with conductive constraining cores
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
CN103298243B (zh) 2006-07-14 2016-05-11 斯塔布科尔技术公司 具有构成电路一部分的核心层的增层印刷线路板衬底
US7738249B2 (en) * 2007-10-25 2010-06-15 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal cooling structure and electrical assembly utilizing same
JP5076196B2 (ja) * 2007-10-29 2012-11-21 三菱電機株式会社 プリント配線板およびその製造方法
JP5262188B2 (ja) * 2008-02-29 2013-08-14 富士通株式会社 基板
JP5581218B2 (ja) * 2008-12-25 2014-08-27 三菱電機株式会社 プリント配線板の製造方法
US7787249B2 (en) * 2009-02-03 2010-08-31 Honeywell International Inc. Systems and methods for printed board assembly isolated heat exchange
JP2011166029A (ja) * 2010-02-12 2011-08-25 Panasonic Corp 配線基板、それを用いた電子装置、及び配線基板の製造方法
CN102036472A (zh) * 2011-01-05 2011-04-27 倪新军 一种微波高频金属基电路板
US8569631B2 (en) * 2011-05-05 2013-10-29 Tangitek, Llc Noise dampening energy efficient circuit board and method for constructing and using same
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
JP5440650B2 (ja) * 2012-05-07 2014-03-12 富士通株式会社 基板の製造方法
KR101399980B1 (ko) * 2012-12-28 2014-05-29 하이쎌(주) 탄소 섬유 기판을 이용한 led용 방열 플렉서블 모듈 및 이의 제조 방법
KR101391187B1 (ko) * 2013-01-24 2014-05-07 하이쎌(주) 방열특성이 향상된 플렉서블 모듈 및 이의 제조 방법
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
KR102253473B1 (ko) * 2014-09-30 2021-05-18 삼성전기주식회사 회로기판
KR102374256B1 (ko) 2015-02-23 2022-03-15 삼성전기주식회사 회로기판 및 회로기판 제조방법
WO2016143688A1 (ja) * 2015-03-06 2016-09-15 京セラ株式会社 巻回体および基板用シート
KR102411999B1 (ko) * 2015-04-08 2022-06-22 삼성전기주식회사 회로기판
KR102538908B1 (ko) * 2015-09-25 2023-06-01 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN109417855A (zh) 2016-06-29 2019-03-01 奥特斯奥地利科技与系统技术有限公司 通过介电壳体内的碳结构冷却部件承载件材料
KR102149794B1 (ko) * 2018-11-26 2020-08-31 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008186A (ja) * 2001-06-21 2003-01-10 Sony Corp 半導体装置
JP2004289006A (ja) * 2003-03-24 2004-10-14 Mitsubishi Electric Corp カーボンアルミ芯基板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812792A (en) 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
US4859189A (en) * 1987-09-25 1989-08-22 Minnesota Mining And Manufacturing Company Multipurpose socket
US5261155A (en) * 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
GB9225260D0 (en) 1992-12-03 1993-01-27 Int Computers Ltd Cooling electronic circuit assemblies
JPH07235781A (ja) 1994-02-23 1995-09-05 Matsushita Electric Ind Co Ltd プリント基板取付け装置
JPH0823183A (ja) 1994-07-06 1996-01-23 Matsushita Electric Ind Co Ltd 部材の冷却構造
US5929375A (en) 1996-05-10 1999-07-27 Ford Motor Company EMI protection and CTE control of three-dimensional circuitized substrates
JPH1140902A (ja) 1997-07-18 1999-02-12 Cmk Corp プリント配線板及びその製造方法
US6257329B1 (en) 1998-08-17 2001-07-10 Alfiero Balzano Thermal management system
JP4365061B2 (ja) 1999-06-21 2009-11-18 三菱電機株式会社 回路形成基板製造方法及び回路形成基板
JP2004179257A (ja) 2002-11-25 2004-06-24 Alps Electric Co Ltd 放熱構造を備えた半導体装置
JP2004228410A (ja) * 2003-01-24 2004-08-12 Kyocera Corp 配線基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008186A (ja) * 2001-06-21 2003-01-10 Sony Corp 半導体装置
JP2004289006A (ja) * 2003-03-24 2004-10-14 Mitsubishi Electric Corp カーボンアルミ芯基板

Also Published As

Publication number Publication date
EP1821586A4 (en) 2008-01-02
DE602005017183D1 (de) 2009-11-26
US20080076276A1 (en) 2008-03-27
KR20070085917A (ko) 2007-08-27
US20080282538A1 (en) 2008-11-20
JP2006165299A (ja) 2006-06-22
EP1821586A1 (en) 2007-08-22
CN101103654A (zh) 2008-01-09
JP4316483B2 (ja) 2009-08-19
EP1821586B1 (en) 2009-10-14
WO2006061916A1 (ja) 2006-06-15
US7479013B2 (en) 2009-01-20

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