KR100912008B1 - 미세증착 장치 - Google Patents
미세증착 장치 Download PDFInfo
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- KR100912008B1 KR100912008B1 KR1020037015746A KR20037015746A KR100912008B1 KR 100912008 B1 KR100912008 B1 KR 100912008B1 KR 1020037015746 A KR1020037015746 A KR 1020037015746A KR 20037015746 A KR20037015746 A KR 20037015746A KR 100912008 B1 KR100912008 B1 KR 100912008B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/188—Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
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- B41J2/04505—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting alignment
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- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
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- B41J2/04506—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting manufacturing tolerances
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- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/0451—Control methods or devices therefor, e.g. driver circuits, control circuits for detecting failure, e.g. clogging, malfunctioning actuator
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- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/04558—Control methods or devices therefor, e.g. driver circuits, control circuits detecting presence or properties of a dot on paper
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- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/0456—Control methods or devices therefor, e.g. driver circuits, control circuits detecting drop size, volume or weight
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04573—Timing; Delays
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04575—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of acoustic type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
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- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04581—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on piezoelectric elements
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- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04588—Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/0459—Height of the driving signal being adjusted
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04591—Width of the driving signal being adjusted
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04593—Dot-size modulation by changing the size of the drop
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04596—Non-ejecting pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/54—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed with two or more sets of type or printing elements
- B41J3/543—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed with two or more sets of type or printing elements with multiple inkjet print heads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/04—Heads using conductive ink
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/09—Ink jet technology used for manufacturing optical filters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Abstract
Description
Claims (56)
- 기판상에 유체 제조물질을 증착시키기 위한 장치에 있어서, 상기 장치는노즐 어셈블리를 포함하고 상기 노즐 어셈블리로부터 상기 기판상으로 상기 유체 제조물질의 방울을 방출하도록 회전가능한 미세증착 헤드와,상기 기판을 안전하게 수용하고 상기 미세증착 헤드에 대하여 상기 기판을 이동시키도록 구성된 스테이지와,상기 스테이지 위에 상기 미세증착 헤드를 착탈식으로 장착시키는(removably mounting) 헤드 지지부와,상기 스테이지에 대한 상기 노즐 어셈블리의 피치를 제어하고 상기 기판상에 상기 노즐 어셈블리로부터 방출되는 상기 유체 제조물질의 방울 증착을 제어하기 위해 상기 미세증착 헤드 및 상기 기판과 통신하는 제어 시스템을 포함하고,여기서, 상기 스테이지 및 상기 미세증착 헤드는 서로에 대해 상대적으로 이동되고, 상기 제어 시스템은 상기 기판상의 선정된 위치들에 방울들을 증착시킴으로써 기판상에 구조물을 형성하기 위해 이러한 이동을 조정하는 하는 것을 특징으로 하는 장치.
- 제1항에 있어서, 상기 제어 시스템은 상기 회전가능한 미세증착 헤드에 대한 상기 기판의 정렬을 확인하기 위한 정렬 센서를 포함하는 것을 특징으로 하는 장치.
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- 제1항에 있어서, 상기 제어 시스템은 상기 노즐 어셈블리로부터 방출되는 방울 특성을 측정하기 위한 방울 진단 센서(droplet diagnostic sensor)를 포함하는 것을 특징으로 하는 장치.
- 제4항에 있어서, 상기 방울 진단 센서는 적어도 하나의 광학카메라를 포함하는 것을 특징으로 하는 장치.
- 제1항에 있어서, 상기 제어 시스템은 상기 노즐 어셈블리로부터 방출되는 방울의 특성을 제어하기 위해 구성된 노즐 제어 요소를 포함하는 것을 특징으로 하는 장치.
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- 제1항에 있어서, 상기 스테이지는 상기 미세증착 헤드가 상기 기판상에 유체 물질을 증착시키는 동안 상기 회전 가능한 미세증착 헤드에 대하여 상기 기판을 이동시키도록 하는 것을 특징으로 하는 장치.
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- 제1항에 있어서, 상기 스테이지는 상기 회전가능한 미세증착 헤드에 대하여 적어도 하나의 수평방향 및 적어도 하나의 수직방향으로 기판을 이동시키는 것을 특징으로 하는 장치.
- 제1항에 있어서, 상기 헤드 지지부는 상기 스테이지에 대하여 상기 회전가능한 미세증착 헤드를 회전시키는 터릿(turret)을 포함하는 것을 특징으로 하는 장치.
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- 제1항에 있어서, 상기 회전가능한 미세증착 헤드에 연결되어 상기 미세증착 헤드에 유체 제조물질을 공급하는 유체 제조물질 공급 시스템을 더 포함하는 것을 특징으로 하는 장치.
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- 제1항에 있어서, 상기 헤드 지지부는 고정 받침대에 장착되는 것을 특징으로하는 장치.
- 제1항에 있어서, 상기 헤드 지지부는 지지빔에 연결된 선형 베어링 어셈블리에 장착되는 것을 특징으로 하는 장치.
- 제1항에 있어서, 상기 회전가능한 미세증착 헤드는, 발광 폴리머, 플라스틱, 컨덕터, 크리스탈, 금속, 왁스(waxes), 솔더, 솔더 페이스트, 산(acid), 포토 레지스트, 용해제, 접착제, 에폭시 및 생의학적 요소로 구성된 그룹으로부터 선택되는 유체 물질의 방울을 방출하는 것을 특징으로 하는 장치.
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- 제1항에 있어서, 상기 회전가능한 미세증착 헤드는 다수의 미세증착 헤드이고 상기 헤드 지지부는 상기 다수의 회전가능한 미세증착 헤드들을 교체 고정할 수 있는 것을 특징으로 하는 장치.
- 제1항에 있어서, 상기 미세증착 헤드는 10 피코리터(picoliter) 크기의 방울들을 방출하는 것을 특징으로 하는 장치.
- 기판상에 유체 물질을 증착시키기 위한 미세증착 기계장치에 있어서,상기 기판을 고정시키기 위해 적합한 스테이지와,상기 스테이지보다 위에 배치되는 받침대와,적어도 하나의 노즐을 포함하고 상기 적어도 하나의 노즐로부터 유체 물질 방울을 증착시키기 위해 작동될 수 있는 미세증착 헤드- 상기 미세증착 헤드는 상기 스테이지에 대한 상대적인 위치에서 상기 받침대에 의해 지지되고, 상기 스테이지에 대하여 상기 노즐 어셈블리의 피치를 조정하기 위해 작동될 수 있음-와,상기 스테이지 및 상기 미세증착 헤드와 통신하여 상기 적어도 하나의 노즐로부터 상기 기판상으로 방출되는 유체 물질의 증착을 제어하는 제어 시스템을 포함하고,여기서, 상기 스테이지 및 상기 미세증착 헤드는 서로에 대해 상대적으로 이동되고, 상기 제어 시스템은 상기 기판상의 선정된 위치들에 방울들을 증착시킴으로써 기판상에 구조물을 형성하기 위해 이러한 이동을 조정하는 것을 특징으로 하는 미세증착 기계장치.
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- 제37항에 있어서, 독립적으로 작동되고 독립적으로 제어되는 복수개의 미세증착 헤드들을 더 포함하고, 상기 제어 시스템은 상기 복수개의 미세증착 헤드들의 동작을 조정하는 것을 특징으로 하는 미세증착 기계장치.
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- 제37항에 있어서, 상기 받침대는 상기 미세증착 헤드를 착탈식으로 고정시키기 위한 장착 선반을 포함하고, 상기 장착 선반은 상기 받침대에 회전가능하게 연결되는 것을 특징으로 하는 미세증착 기계장치.
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- 제37항에 있어서, 상기 제어 시스템과 통신하여 상기 적어도 하나의 노즐로부터 상기 적어도 하나의 방울이 방출된 후에 상기 적어도 하나의 방울 특성을 측정하기 위해 구성된 방울 진단 시스템을 더 포함하는 것을 특징으로 하는 미세증착 기계장치.
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- 기판상에 유체 제조물질을 증착하는 방법에 있어서,노즐 어셈블리를 포함하는 회전가능한 미세증착 헤드로부터 상기 기판상으로 상기 유체 제조물질의 방울들을 방출하기 위해 스테이지상에 상기 기판을 고정시키는 단계와,상기 기판과 상기 미세증착헤드를 서로에 대하여 이동시키는 단계와,상기 미세증착 헤드의 피치 및 상기 노즐 어셈블리로부터 상기 기판상에 방출되는 유체 제조물질의 방울 증착을 제어하는 단계를 포함하는 방법.
- 제48항에 있어서,상기 회전가능한 미세증착 헤드에 대하여 상기 기판을 정렬시키는 단계를 더 포함하는 방법.
- 제48항에 있어서, 상기 노즐 어셈블리로부터 방출되는 상기 방울들의 특성을 측정하고 제어하는 단계를 더 포함하는 방법.
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- 제50항에 있어서, 상기 제어되는 방출된 방울들의 특성은 부피, 속도, 낙하 각도 및 테일링(tailing)중 적어도 하나를 포함하는 방법.
- 제48항에 있어서, 상기 노즐 어셈블리를 세정하는 단계를 더 포함하는 방법.
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- 2002-05-31 JP JP2003502865A patent/JP2004528978A/ja active Pending
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2009
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Patent Citations (4)
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US5505777A (en) * | 1992-11-19 | 1996-04-09 | Asymptotic Technologies, Inc. | Computer controlled viscous fluid dispensing system |
US5932012A (en) * | 1995-06-23 | 1999-08-03 | Hitachi Techno Engineering Co., Ltd. | Paste applicator having positioning means |
US5681757A (en) * | 1996-04-29 | 1997-10-28 | Microfab Technologies, Inc. | Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process |
US6007631A (en) * | 1997-11-10 | 1999-12-28 | Speedline Technologies, Inc. | Multiple head dispensing system and method |
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