ATE458555T1 - Übertakten bei einem mikroabscheidungssteuersystem zur verbesserung der auflösung - Google Patents

Übertakten bei einem mikroabscheidungssteuersystem zur verbesserung der auflösung

Info

Publication number
ATE458555T1
ATE458555T1 AT02739640T AT02739640T ATE458555T1 AT E458555 T1 ATE458555 T1 AT E458555T1 AT 02739640 T AT02739640 T AT 02739640T AT 02739640 T AT02739640 T AT 02739640T AT E458555 T1 ATE458555 T1 AT E458555T1
Authority
AT
Austria
Prior art keywords
microdeposition
positioning device
overclocking
substrate
control system
Prior art date
Application number
AT02739640T
Other languages
English (en)
Inventor
Charles Edwards
David Albertalli
James Middleton
Howard Bielich
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Application granted granted Critical
Publication of ATE458555T1 publication Critical patent/ATE458555T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/188—Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04505—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04506—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting manufacturing tolerances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0451—Control methods or devices therefor, e.g. driver circuits, control circuits for detecting failure, e.g. clogging, malfunctioning actuator
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04558—Control methods or devices therefor, e.g. driver circuits, control circuits detecting presence or properties of a dot on paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0456—Control methods or devices therefor, e.g. driver circuits, control circuits detecting drop size, volume or weight
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04573—Timing; Delays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04575—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of acoustic type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04581—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04588—Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0459—Height of the driving signal being adjusted
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04591—Width of the driving signal being adjusted
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04593—Dot-size modulation by changing the size of the drop
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04596—Non-ejecting pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/54—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed with two or more sets of type or printing elements
    • B41J3/543—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed with two or more sets of type or printing elements with multiple inkjet print heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/04—Heads using conductive ink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/09—Ink jet technology used for manufacturing optical filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
AT02739640T 2001-06-01 2002-05-31 Übertakten bei einem mikroabscheidungssteuersystem zur verbesserung der auflösung ATE458555T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29510001P 2001-06-01 2001-06-01
US29511801P 2001-06-01 2001-06-01
PCT/US2002/017521 WO2002098575A1 (en) 2001-06-01 2002-05-31 Over-clocking in a microdeposition control system to improve resolution

Publications (1)

Publication Number Publication Date
ATE458555T1 true ATE458555T1 (de) 2010-03-15

Family

ID=26968921

Family Applications (3)

Application Number Title Priority Date Filing Date
AT02739639T ATE486662T1 (de) 2001-06-01 2002-05-31 Mikroabscheidungsvorrichtung
AT02756113T ATE486663T1 (de) 2001-06-01 2002-05-31 Wellengenerator für ein mikroabscheidungs- steuersystem
AT02739640T ATE458555T1 (de) 2001-06-01 2002-05-31 Übertakten bei einem mikroabscheidungssteuersystem zur verbesserung der auflösung

Family Applications Before (2)

Application Number Title Priority Date Filing Date
AT02739639T ATE486662T1 (de) 2001-06-01 2002-05-31 Mikroabscheidungsvorrichtung
AT02756113T ATE486663T1 (de) 2001-06-01 2002-05-31 Wellengenerator für ein mikroabscheidungs- steuersystem

Country Status (9)

Country Link
US (1) US7270712B2 (de)
EP (7) EP1569757A4 (de)
JP (9) JP2005515052A (de)
KR (8) KR100882520B1 (de)
CN (7) CN1630939A (de)
AT (3) ATE486662T1 (de)
AU (4) AU2002346740A1 (de)
DE (3) DE60238190D1 (de)
WO (8) WO2002099850A2 (de)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4971560B2 (ja) * 2001-08-06 2012-07-11 キヤノン株式会社 インクジェット記録装置、ヘッドユニット及びカラーフィルタ製造装置
CN1685238A (zh) * 2002-09-27 2005-10-19 株式会社岛津制作所 用于液体分注的方法及装置
US7964237B2 (en) * 2003-08-21 2011-06-21 International Business Machines Corporation Fully automated paste dispense process for dispensing small dots and lines
TWI220076B (en) * 2003-08-27 2004-08-01 Au Optronics Corp Light-emitting device
KR101026935B1 (ko) 2003-12-10 2011-04-04 엘지디스플레이 주식회사 디스펜서 정렬장치 및 그 방법
JP4195366B2 (ja) * 2003-12-19 2008-12-10 シャープ株式会社 薬液塗布方法および薬液塗布装置
WO2005078533A1 (en) * 2004-02-10 2005-08-25 Zebra Imaging, Inc. Deposition of photosensitive media for digital hologram recording
US7354845B2 (en) 2004-08-24 2008-04-08 Otb Group B.V. In-line process for making thin film electronic devices
NL1026013C2 (nl) 2004-04-23 2005-10-25 Otb Group Bv Werkwijze en inrichting voor het nauwkeurig aanbrengen van structuren op een substraat.
US8101244B2 (en) * 2004-06-09 2012-01-24 Smithkline Beecham Corporation Apparatus and method for producing or processing a product or sample
TWI356036B (en) 2004-06-09 2012-01-11 Smithkline Beecham Corp Apparatus and method for pharmaceutical production
US20060092218A1 (en) * 2004-11-04 2006-05-04 Applied Materials, Inc. Methods and apparatus for inkjet printing
JP2006137124A (ja) * 2004-11-15 2006-06-01 Konica Minolta Holdings Inc 液体吐出装置及び液体吐出方法
CN1939095B (zh) * 2004-12-14 2010-12-08 株式会社爱发科 涂敷装置、有机材料薄膜的形成方法、有机el面板制造装置
JP2006175727A (ja) * 2004-12-22 2006-07-06 Konica Minolta Holdings Inc 液滴吐出制御装置
WO2006074016A2 (en) 2004-12-30 2006-07-13 Fujifilm Dimatix, Inc. Ink jet printing
WO2006076607A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of passive electricalcomponents
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2006076605A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Circuit modeling and selective deposition
TW200642785A (en) 2005-01-14 2006-12-16 Cabot Corp Metal nanoparticle compositions
WO2006076609A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076604A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
WO2006076608A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
JP2006195863A (ja) * 2005-01-17 2006-07-27 Fujitsu Ten Ltd エラー検出装置
US20060163563A1 (en) * 2005-01-24 2006-07-27 Kurt Ulmer Method to form a thin film resistor
WO2007004627A1 (ja) * 2005-07-05 2007-01-11 Konica Minolta Holdings, Inc. パターニング装置、有機エレクトロルミネッセンス素子とその製造方法及び有機エレクトロルミネッセンス表示装置
JP5509509B2 (ja) * 2005-09-30 2014-06-04 コニカミノルタ株式会社 液滴吐出装置、液滴速度調整方法、液滴速度検出装置、液滴速度検出方法、プログラム及び記録媒体
CN101282842B (zh) * 2005-10-07 2010-09-01 皇家飞利浦电子股份有限公司 用于将物质小滴受控地定位到基底上的喷墨装置和方法
TWI287828B (en) 2005-12-30 2007-10-01 Ind Tech Res Inst Method for printing a pattern and data processing method thereof
JP4058453B2 (ja) * 2006-05-08 2008-03-12 シャープ株式会社 液滴塗布装置
TWI318176B (en) 2006-11-08 2009-12-11 Ind Tech Res Inst Printing method
TWI320754B (en) 2006-11-10 2010-02-21 Ind Tech Res Inst A print data processing mothod and device therefor
US7988247B2 (en) 2007-01-11 2011-08-02 Fujifilm Dimatix, Inc. Ejection of drops having variable drop size from an ink jet printer
JP2008201018A (ja) * 2007-02-21 2008-09-04 Toppan Printing Co Ltd インクジェットヘッドのアライメント装置
JP5391524B2 (ja) * 2007-03-23 2014-01-15 凸版印刷株式会社 インクジェットヘッド管理装置
US8186790B2 (en) * 2008-03-14 2012-05-29 Purdue Research Foundation Method for producing ultra-small drops
DE102008057005A1 (de) * 2008-11-11 2010-05-12 Jonas & Redmann Automationstechnik Gmbh Verfahren zum Positionieren und/oder Führen mindestens eines beliebigen Prozesskopfes für die Metallisierung von dünnen Substraten in einem definierten Abstand über der Substratoberfläche
CN101462414B (zh) * 2008-11-28 2011-03-23 江苏康众数字医疗设备有限公司 用于电子元件集成的印刷装置及印刷方法
EP2199065B1 (de) * 2008-12-19 2012-03-21 Agfa Graphics N.V. Bildverarbeitungsverfahren für dreidimensionales Drucken
US20100156768A1 (en) * 2008-12-22 2010-06-24 Fletcher Ii James Douglas Display media, method of forming display media, and printer for printing on display media
JP5401163B2 (ja) * 2009-04-30 2014-01-29 パナソニック株式会社 インクジェット印刷装置
US20100300355A1 (en) * 2009-06-01 2010-12-02 Moser Baer India Limited Printing material profiles onto substrates
US20130099666A1 (en) * 2011-10-21 2013-04-25 Almax Rp Corp. Selectively controlling the resistance of resistive traces printed on a substrate to supply equal current to an array of light sources
JP6057406B2 (ja) * 2012-01-06 2017-01-11 住友重機械工業株式会社 薄膜形成装置及び薄膜形成方法
FR2990055B1 (fr) * 2012-04-30 2014-12-26 Total Sa Matrice de depot d'au moins un fluide conducteur sur un substrat, ainsi que dispositif comprenant cette matrice et procede de depot
JP5750414B2 (ja) * 2012-08-27 2015-07-22 東芝テック株式会社 インクジェットヘッド駆動装置
CN102862402B (zh) * 2012-10-17 2015-07-22 佛山市智巢电子科技有限公司 一种阵列式精密喷印设备的喷印控制方法与系统
US11141752B2 (en) 2012-12-27 2021-10-12 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US9700908B2 (en) 2012-12-27 2017-07-11 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US9832428B2 (en) 2012-12-27 2017-11-28 Kateeva, Inc. Fast measurement of droplet parameters in industrial printing system
US9352561B2 (en) 2012-12-27 2016-05-31 Kateeva, Inc. Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances
KR20230106718A (ko) 2012-12-27 2023-07-13 카티바, 인크. 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피제어를 위한 기법
WO2014193961A1 (en) * 2013-05-31 2014-12-04 Johnson Controls Technology Company System and method for forming a vehicle trim component via additive manufacturing, and vehicle trim component
KR20230084334A (ko) 2013-12-12 2023-06-12 카티바, 인크. 두께를 제어하기 위해 하프토닝을 이용하는 잉크-기반 층 제조
US20150197062A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Method, device, and system of three-dimensional printing
EP2902206B1 (de) * 2014-01-31 2021-06-09 HP Scitex Ltd Druckkopfanordnung auf einem Druckstangenträgerelement
US10391705B2 (en) * 2014-05-09 2019-08-27 Nike, Inc. System and method for forming three-dimensional structures
US9387671B2 (en) 2014-05-14 2016-07-12 Ricoh Company, Ltd. Head driving device, recording head unit, and image forming apparatus
US9147875B1 (en) 2014-09-10 2015-09-29 Cellink Corporation Interconnect for battery packs
US10211443B2 (en) 2014-09-10 2019-02-19 Cellink Corporation Battery interconnects
CN104385592B (zh) * 2014-10-14 2016-12-07 秦皇岛天秦三维数字化技术有限公司 3d打印机机电控制系统及方法
JP6296960B2 (ja) * 2014-10-31 2018-03-20 株式会社東芝 インクジェットヘッド、及び、印刷装置
CN105643921B (zh) * 2014-11-11 2018-09-25 三纬国际立体列印科技股份有限公司 立体打印装置与立体打印方法
US9466777B2 (en) * 2015-02-03 2016-10-11 Cellink Corporation Systems and methods for combined thermal and electrical energy transfer
US10029425B2 (en) * 2015-04-07 2018-07-24 Sartorius Stedim Biotech Gmbh Container for accommodating at least one of at least one biologically active fluid and at least one preparatory fluid, and a method therefor
JP6479555B2 (ja) * 2015-04-27 2019-03-06 住友重機械工業株式会社 膜形成装置
CN108290348A (zh) * 2015-12-21 2018-07-17 瓦克化学股份公司 通过使用3d打印设备用于生产物体的方法和设备
JP6387955B2 (ja) * 2015-12-25 2018-09-12 セイコーエプソン株式会社 ヘッドユニット制御回路
CN109890619B (zh) * 2016-07-27 2021-01-26 哈佛学院院长及董事 用于声泳打印的设备和方法
CN107952958B (zh) * 2016-10-16 2020-01-10 北京煜鼎增材制造研究院有限公司 沉积轴、增材制造设备及对沉积轴行程进行调节的方法
DE102016014951A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Beschichtungseinrichtung und zugehöriges Betriebsverfahren
DE102016014946A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Druckkopf zur Applikation eines Beschichtungsmittels auf ein Bauteil
DE102016014952A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Beschichtungseinrichtung zur Beschichtung von Bauteilen
DE102016014956A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Beschichtungseinrichtung und zugehöriges Betriebsverfahren
DE102016014920A1 (de) * 2016-12-14 2018-06-14 Dürr Systems Ag Druckkopf mit Verschiebe- und/oder Drehmechanik für zumindest eine Düsenreihe
DE102016014919A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Applikationsvorrichtung und Verfahren zum Applizieren eines Beschichtungsmittels
DE102016014948A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Druckkopf und zugehöriges Betriebsverfahren
DE102016014944A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Beschichtungsverfahren und entsprechende Beschichtungseinrichtung
DE102016014947A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Druckkopf zur Applikation eines Beschichtungsmittels
DE102016014955A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Beschichtungseinrichtung und entsprechendes Beschichtungsverfahren
DE102016014943A1 (de) 2016-12-14 2018-06-14 Dürr Systems Ag Druckkopf mit Temperiereinrichtung
JP6999317B2 (ja) * 2017-07-21 2022-01-18 東芝テック株式会社 インクジェットヘッド及びインクジェットプリンタ
JP7335876B2 (ja) 2017-10-27 2023-08-30 ノードソン コーポレーション 噴射の閉ループ流体速度制御のためのシステム及び方法
KR20200100787A (ko) * 2018-01-15 2020-08-26 도쿄엘렉트론가부시키가이샤 유체 분배 및 적용 범위 제어를 위한 시스템 및 방법
FR3080998B1 (fr) * 2018-05-14 2020-04-24 Reydel Automotive B.V. Procede de traitement de surface d'une piece et installation associee
EP3588099A1 (de) * 2018-06-26 2020-01-01 Tecan Trading Ag Positionierungsanordnung für eine laborvorrichtung
CN110271288B (zh) * 2019-07-05 2020-05-22 深圳市华星光电半导体显示技术有限公司 Oled喷墨打印喷头及其打印装置
CN110424032A (zh) * 2019-09-10 2019-11-08 江苏师范大学 一种用于压力机主轴修复的射流电沉积装置及其方法
CN111231316A (zh) * 2020-03-02 2020-06-05 爱司达智能制造(江苏)有限公司 一种增材设备的流道结构
CN111286699B (zh) * 2020-03-25 2022-04-05 中国工程物理研究院激光聚变研究中心 一种挡板修正方法、镀膜方法和装置
CN111653184B (zh) * 2020-07-10 2022-05-10 宿迁市规划测绘院有限公司 一种拥有多功能放置台的3d地图批量喷绘控制系统
KR20230160239A (ko) 2021-03-24 2023-11-23 셀링크 코포레이션 다층 가요성 배터리 인터커넥트 및 이의 제조 방법
CN113245102B (zh) * 2021-06-07 2022-02-25 苏州微知电子科技有限公司 一种纤维器件喷涂机
CN114161707A (zh) * 2021-12-10 2022-03-11 苏州华星光电技术有限公司 打印设备及打印方法
CN114474718A (zh) * 2021-12-28 2022-05-13 郭超 一种3d打印检测方法、装置、设备及3d打印系统

Family Cites Families (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3572400A (en) * 1967-08-31 1971-03-23 Western Electric Co Dispensing of fluids to small areas
US4037830A (en) * 1976-09-07 1977-07-26 International Business Machines Corporation Wafer handler
JPS5590806A (en) * 1978-12-29 1980-07-09 Ricoh Co Ltd Apparatus for measuring diameter of ink jet particle
US4795518A (en) * 1984-02-17 1989-01-03 Burr-Brown Corporation Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus
US4575330A (en) * 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
US4835704A (en) * 1986-12-29 1989-05-30 General Electric Company Adaptive lithography system to provide high density interconnect
US5002008A (en) * 1988-05-27 1991-03-26 Tokyo Electron Limited Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state
US5229016A (en) * 1991-08-08 1993-07-20 Microfab Technologies, Inc. Method and apparatus for dispensing spherical-shaped quantities of liquid solder
JPH05149769A (ja) * 1991-11-29 1993-06-15 Canon Inc インクジエツト記録ヘツドのインク噴射体積測定方法および測定装置
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5738165A (en) * 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
US5736195A (en) * 1993-09-15 1998-04-07 Mobium Enterprises Corporation Method of coating a thin film on a substrate
US5403617A (en) * 1993-09-15 1995-04-04 Mobium Enterprises Corporation Hybrid pulsed valve for thin film coating and method
JPH07101062A (ja) * 1993-09-30 1995-04-18 Canon Inc インクジェット記録装置及びその記録方法
US5498444A (en) * 1994-02-28 1996-03-12 Microfab Technologies, Inc. Method for producing micro-optical components
JPH07323550A (ja) * 1994-05-31 1995-12-12 Canon Inc インクジェットプリント装置の制御方法およびインクジェットプリント装置
JP3241251B2 (ja) * 1994-12-16 2001-12-25 キヤノン株式会社 電子放出素子の製造方法及び電子源基板の製造方法
US5920331A (en) * 1995-04-12 1999-07-06 Eastman Kodak Company Method and apparatus for accurate control of temperature pulses in printing heads
JPH091797A (ja) * 1995-06-15 1997-01-07 Toyo Electric Mfg Co Ltd インクの着弾位置制御方法
US5932012A (en) * 1995-06-23 1999-08-03 Hitachi Techno Engineering Co., Ltd. Paste applicator having positioning means
CA2489818C (en) * 1995-10-13 2007-07-24 Nordson Corporation A system for dispensing a viscous material onto a substrate
JP3627078B2 (ja) * 1995-12-22 2005-03-09 富士写真フイルム株式会社 インクジェット装置
US5906683A (en) * 1996-04-16 1999-05-25 Applied Materials, Inc. Lid assembly for semiconductor processing chamber
US5681757A (en) * 1996-04-29 1997-10-28 Microfab Technologies, Inc. Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
US5779971A (en) * 1996-06-07 1998-07-14 Hewlett-Packard Company Solder jet printhead
JP3349891B2 (ja) * 1996-06-11 2002-11-25 富士通株式会社 圧電型インクジェットヘッドの駆動方法
JPH1050769A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージの製造装置および製造方法
US5756157A (en) * 1996-10-02 1998-05-26 Silicon Valley Group Method for processing flat panel displays and large wafers
US6132809A (en) * 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
US6224180B1 (en) * 1997-02-21 2001-05-01 Gerald Pham-Van-Diep High speed jet soldering system
JPH10260307A (ja) * 1997-03-17 1998-09-29 Seiko Epson Corp カラーフィルタの製造装置およびその方法
JPH10284360A (ja) * 1997-04-02 1998-10-23 Hitachi Ltd 基板温度制御装置及び方法
SG115335A1 (en) * 1997-07-04 2005-10-28 Tokyo Electron Ltd Process solution supplying apparatus
JP3695150B2 (ja) * 1997-07-08 2005-09-14 セイコーエプソン株式会社 インクジェット記録装置及びその駆動波形制御方法
US6193346B1 (en) * 1997-07-22 2001-02-27 Ricoh Company, Ltd. Ink-jet recording apparatus
JPH1158735A (ja) * 1997-08-18 1999-03-02 Nec Niigata Ltd インクジェット記録装置
JPH11138820A (ja) * 1997-09-05 1999-05-25 Ricoh Co Ltd 液滴の噴射特性測定方法およびシステム
JPH1177991A (ja) * 1997-09-12 1999-03-23 Seiko Epson Corp インクジェット記録装置
ATE434259T1 (de) * 1997-10-14 2009-07-15 Patterning Technologies Ltd Methode zur herstellung eines elektrischen kondensators
US6007631A (en) * 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
JPH11157055A (ja) * 1997-11-28 1999-06-15 Sony Corp インクジェットプリンタ、ならびにインクジェットプリンタ用記録ヘッドの駆動装置および方法
US6019164A (en) * 1997-12-31 2000-02-01 Temptronic Corporation Workpiece chuck
GB9808182D0 (en) * 1998-04-17 1998-06-17 The Technology Partnership Plc Liquid projection apparatus
JP3381776B2 (ja) * 1998-05-19 2003-03-04 東京エレクトロン株式会社 処理装置および処理方法
JP3611177B2 (ja) * 1998-07-22 2005-01-19 セイコーエプソン株式会社 インクジェット式記録装置及び記録方法
US6129872A (en) * 1998-08-29 2000-10-10 Jang; Justin Process and apparatus for creating a colorful three-dimensional object
JP2000071437A (ja) * 1998-09-02 2000-03-07 Ricoh Co Ltd インクジェット記録装置及び記憶媒体並びに制御テーブル作成方法
US6190727B1 (en) * 1998-10-30 2001-02-20 Georgia-Pacific Corporation Liquid coating spray applicator and method providing automatic spread rate control
JP4468500B2 (ja) * 1998-11-16 2010-05-26 ブラザー工業株式会社 移動物体の検出方法及びその装置
US6318828B1 (en) * 1999-02-19 2001-11-20 Hewlett-Packard Company System and method for controlling firing operations of an inkjet printhead
US6209964B1 (en) * 1999-03-03 2001-04-03 Jose Pinto Dump truck vibrator
JP4208332B2 (ja) * 1999-03-19 2009-01-14 キヤノン株式会社 インクジェットヘッドユニットの調整装置及び調整方法及びカラーフィルタの製造方法及び液晶表示パネルの製造方法
CA2375365A1 (en) * 1999-05-27 2001-02-15 Patterning Technologies Limited Method of forming a masking pattern on a surface
GB2350321A (en) * 1999-05-27 2000-11-29 Patterning Technologies Ltd Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
ATE491576T1 (de) * 1999-09-30 2011-01-15 Seiko Epson Corp Flüssigkeitsstrahlvorrichtung
JP3446686B2 (ja) * 1999-10-21 2003-09-16 セイコーエプソン株式会社 インクジェット式記録装置
US6420202B1 (en) * 2000-05-16 2002-07-16 Agere Systems Guardian Corp. Method for shaping thin film resonators to shape acoustic modes therein
US6596239B2 (en) * 2000-12-12 2003-07-22 Edc Biosystems, Inc. Acoustically mediated fluid transfer methods and uses thereof

Also Published As

Publication number Publication date
DE60238190D1 (de) 2010-12-16
JP4342303B2 (ja) 2009-10-14
JP4328614B2 (ja) 2009-09-09
AU2002346735A1 (en) 2002-12-16
CN1535186A (zh) 2004-10-06
KR20090106424A (ko) 2009-10-08
EP1399950A4 (de) 2005-08-24
CN1274425C (zh) 2006-09-13
EP1399267A4 (de) 2005-08-24
JP4342301B2 (ja) 2009-10-14
EP1569757A2 (de) 2005-09-07
EP1399951A4 (de) 2005-08-24
EP1392449A1 (de) 2004-03-03
AU2002314894A1 (en) 2002-12-16
KR20040026659A (ko) 2004-03-31
EP1399269A4 (de) 2005-08-24
CN1535185A (zh) 2004-10-06
DE60238189D1 (de) 2010-12-16
DE60235458D1 (de) 2010-04-08
JP2004530550A (ja) 2004-10-07
EP1399267A1 (de) 2004-03-24
CN1280025C (zh) 2006-10-18
KR100938810B1 (ko) 2010-01-28
KR20040037028A (ko) 2004-05-04
CN1285420C (zh) 2006-11-22
EP1399269B1 (de) 2010-11-03
WO2002099851A2 (en) 2002-12-12
CN1289207C (zh) 2006-12-13
CN1630939A (zh) 2005-06-22
JP5145259B2 (ja) 2013-02-13
KR20040038915A (ko) 2004-05-08
WO2002099850A2 (en) 2002-12-12
EP1392449A4 (de) 2005-08-24
CN1512917A (zh) 2004-07-14
JP2004535287A (ja) 2004-11-25
EP1392449B1 (de) 2010-02-24
KR20040024558A (ko) 2004-03-20
US20040261700A1 (en) 2004-12-30
JP4342302B2 (ja) 2009-10-14
KR100912008B1 (ko) 2009-08-14
WO2002099848A3 (en) 2003-07-24
WO2002098576A1 (en) 2002-12-12
JP2005515052A (ja) 2005-05-26
JP2009136871A (ja) 2009-06-25
KR20040038914A (ko) 2004-05-08
EP1569757A4 (de) 2006-11-15
JP2005502447A (ja) 2005-01-27
AU2002346740A1 (en) 2002-12-16
US7270712B2 (en) 2007-09-18
KR100998171B1 (ko) 2010-12-03
JP2005501691A (ja) 2005-01-20
EP1399268A4 (de) 2005-08-24
JP2009113040A (ja) 2009-05-28
KR100882520B1 (ko) 2009-02-06
JP2004533121A (ja) 2004-10-28
WO2002099850A3 (en) 2003-04-03
KR20040029997A (ko) 2004-04-08
WO2002099849A2 (en) 2002-12-12
CN1512918A (zh) 2004-07-14
ATE486663T1 (de) 2010-11-15
WO2002098575A1 (en) 2002-12-12
EP1399267B1 (de) 2010-11-03
ATE486662T1 (de) 2010-11-15
KR100924002B1 (ko) 2009-10-28
WO2002099851A3 (en) 2004-01-29
KR20040037027A (ko) 2004-05-04
CN1635949A (zh) 2005-07-06
JP4880708B2 (ja) 2012-02-22
WO2002099848A2 (en) 2002-12-12
CN1329130C (zh) 2007-08-01
AU2002346738A8 (en) 2005-11-17
JP2004528978A (ja) 2004-09-24
EP1399269A1 (de) 2004-03-24
CN1512919A (zh) 2004-07-14
AU2002346738A1 (en) 2002-12-16
EP1399268B1 (de) 2012-10-31
EP1399951A2 (de) 2004-03-24
EP1399950A2 (de) 2004-03-24
EP1399268A1 (de) 2004-03-24
WO2002098573A1 (en) 2002-12-12
WO2002098574A1 (en) 2002-12-12
WO2002099849A3 (en) 2005-07-07

Similar Documents

Publication Publication Date Title
ATE458555T1 (de) Übertakten bei einem mikroabscheidungssteuersystem zur verbesserung der auflösung
JP2005502447A5 (de)
US7611754B2 (en) Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors
US20090029069A1 (en) Waveform generator for microdeposition control system
TW200727994A (en) Methods and apparatus for inkjet printing on non-planar substrates
JP5936612B2 (ja) 薄膜形成方法及び薄膜形成装置
JP2004528978A5 (de)
DE602006017905D1 (de) Produktionsleitung zur Herstellung von flachen Platten auf Holzbasis mit einer bedruckten Oberfläche
JP2004535287A5 (de)
DE60107116D1 (de) Verfahren und vorrichtung für tintenstrahldruck mit uv-strahlungshärtbarer tinte
WO2002056243A3 (en) Optical mouse
ATE396051T1 (de) Tröpfchenaufzeichnungsgerät
ATE355182T1 (de) Tintenstrahlaufnahmebeschichtung
AU4669699A (en) Device and method for jetting droplets
EP1827849A1 (de) Druckverzerrungskompensation
CN102189788A (zh) 印刷装置及印刷方法
US7244310B2 (en) Over-clocking in a microdeposition control system to improve resolution
EP1926357A3 (de) Herstellungsvorrichtung für ein Funktionsgerät und damit hergestelltes Funktionsgerät
GB2262069A (en) Led array printhead optically compensated for uneven led illumination and method of making the same.
WO2004049466A3 (en) Droplet - deposition related methods and apparatus
WO2005112526A8 (en) Printed wiring board, manufacturing method and electronic device
KR20210031067A (ko) Uv 경화기를 포함하는 잉크젯 프린터 및 그의 경화 방법
WO2005011877A3 (fr) Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circuit imprime, et equipement utilisant un tel dispositif
WO2004036701A3 (en) Method and apparatus for depositing material for an electronic device
DE50101892D1 (de) Vorrichtung zum Aufbringen von Lotpaste auf eine Leiterplatte an mehreren Punkten

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties