JP5145259B2 - マイクロデポジション装置 - Google Patents
マイクロデポジション装置 Download PDFInfo
- Publication number
- JP5145259B2 JP5145259B2 JP2009014785A JP2009014785A JP5145259B2 JP 5145259 B2 JP5145259 B2 JP 5145259B2 JP 2009014785 A JP2009014785 A JP 2009014785A JP 2009014785 A JP2009014785 A JP 2009014785A JP 5145259 B2 JP5145259 B2 JP 5145259B2
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- pmd
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- head
- pmd head
- droplet
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- Expired - Lifetime
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/04—Heads using conductive ink
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/09—Ink jet technology used for manufacturing optical filters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Optical Filters (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Physical Vapour Deposition (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Networks Using Active Elements (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Gripping On Spindles (AREA)
- Air Bags (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Telephone Function (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ink Jet (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Control Of High-Frequency Heating Circuits (AREA)
- Radiation-Therapy Devices (AREA)
- Electrophonic Musical Instruments (AREA)
Description
基板上に小液滴を放出する複数のノズルを有するヘッドと、
基板を保持するステージと、
前記ヘッドと前記ステージ上の基板の相対的な位置を変更する位置合せ手段と、
放出された前記小液滴を飛翔中に撮影し画像を形成するカメラと、
前記小液滴の前記画像から、滴下量、滴下速度、滴下ノズル位置、滴下偏角、分離液滴(衛星)の有無の少なくともいずれかを分析する液滴分析手段と、
を有し、
前記液滴分析手段の分析結果により誤りを検出し、自動的に、
前記滴下量の修正は、前記ヘッドに送られる電圧又は波長を変化させ、
前記滴下速度の修正は、発射時刻を変化させ、
前記滴下ノズル位置と滴下偏角の修正は、実際に落下するであろう場所を計算して前記ヘッドと基板の位置関係もしくは発射時刻を変化させ、
前記分離滴液の修正は、前記ヘッドの電圧及びパルスを変化させる、もしくは自動保守機能により詰めをなくす
ことを特徴としている。
Claims (4)
- 基板上に小液滴を放出する複数のノズルを有するヘッドと、
基板を保持するステージと、
前記ヘッドと前記ステージ上の基板の相対的な位置を変更する位置合せ手段と、
放出された前記小液滴を飛翔中に撮影し画像を形成するカメラと、
前記小液滴の前記画像から、滴下量、滴下速度、滴下ノズル位置、滴下偏角、分離液滴(衛星)の有を分析する液滴分析手段と、
を有し、
前記液滴分析手段の分析結果により誤りを検出し、自動的に、
前記滴下量の修正は、前記ヘッドに送られる電圧又は波長を変化させる方法と、液滴の数及び頻度を変更する方法とをおこない、
前記滴下速度の修正は、前記滴下速度と前記基板からの距離から発射時刻の調整量を計算して発射時刻を変更し、
前記滴下ノズル位置と前記滴下偏角の修正は、実際に落下するであろう場所を計算して前記ヘッドと基板の位置関係もしくは発射時刻を変化させ、
前記分離滴液の修正は、前記ヘッドの電圧及びパルスを変化させる、もしくは自動保守機能により詰まりをなくすように構成した
ことを特徴とするマイクロデポジション装置。 - 前記カメラは、前記ノズルから放出される小液滴の二つの直角画像を撮影する請求項1に記載のマイクロデポジション装置。
- 前記カメラは、二つの直角に配置されたカメラを用いて単一の小液滴の二つの画像を同時に撮影する請求項2に記載のマイクロデポジション装置。
- 前記カメラは、前記ヘッドから発射された第一の小液滴と、前記ヘッドを90°回転し、同じ前記ヘッドから発射された第二の小液滴を撮影することで前記二つの直角画像を撮影する請求項2に記載のマイクロデポジション装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29511801P | 2001-06-01 | 2001-06-01 | |
US29510001P | 2001-06-01 | 2001-06-01 | |
US60/295,100 | 2001-06-01 | ||
US60/295,118 | 2001-06-01 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003501605A Division JP4328614B2 (ja) | 2001-06-01 | 2002-05-31 | マイクロデポジション装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009113040A JP2009113040A (ja) | 2009-05-28 |
JP5145259B2 true JP5145259B2 (ja) | 2013-02-13 |
Family
ID=26968921
Family Applications (9)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003501606A Expired - Fee Related JP4342302B2 (ja) | 2001-06-01 | 2002-05-31 | 基板上に精確な量の流動材料を堆積する方法 |
JP2003502863A Pending JP2004533121A (ja) | 2001-06-01 | 2002-05-31 | 圧電マイクロデポジションを用いた印刷回路基板構造の形成 |
JP2003502864A Pending JP2005515052A (ja) | 2001-06-01 | 2002-05-31 | 多数の流体材料のマイクロデポジション用装置 |
JP2003502865A Pending JP2004528978A (ja) | 2001-06-01 | 2002-05-31 | 互換性マイクロデポジションヘッド装置及び方法 |
JP2003501604A Expired - Fee Related JP4342301B2 (ja) | 2001-06-01 | 2002-05-31 | マイクロデポジションシステム及びマイクロデポジションシステムの動作方法 |
JP2003501607A Expired - Fee Related JP4342303B2 (ja) | 2001-06-01 | 2002-05-31 | マイクロデポジションシステム |
JP2003501605A Expired - Fee Related JP4328614B2 (ja) | 2001-06-01 | 2002-05-31 | マイクロデポジション装置 |
JP2009014781A Expired - Fee Related JP4880708B2 (ja) | 2001-06-01 | 2009-01-26 | マイクロデポジション装置 |
JP2009014785A Expired - Lifetime JP5145259B2 (ja) | 2001-06-01 | 2009-01-26 | マイクロデポジション装置 |
Family Applications Before (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003501606A Expired - Fee Related JP4342302B2 (ja) | 2001-06-01 | 2002-05-31 | 基板上に精確な量の流動材料を堆積する方法 |
JP2003502863A Pending JP2004533121A (ja) | 2001-06-01 | 2002-05-31 | 圧電マイクロデポジションを用いた印刷回路基板構造の形成 |
JP2003502864A Pending JP2005515052A (ja) | 2001-06-01 | 2002-05-31 | 多数の流体材料のマイクロデポジション用装置 |
JP2003502865A Pending JP2004528978A (ja) | 2001-06-01 | 2002-05-31 | 互換性マイクロデポジションヘッド装置及び方法 |
JP2003501604A Expired - Fee Related JP4342301B2 (ja) | 2001-06-01 | 2002-05-31 | マイクロデポジションシステム及びマイクロデポジションシステムの動作方法 |
JP2003501607A Expired - Fee Related JP4342303B2 (ja) | 2001-06-01 | 2002-05-31 | マイクロデポジションシステム |
JP2003501605A Expired - Fee Related JP4328614B2 (ja) | 2001-06-01 | 2002-05-31 | マイクロデポジション装置 |
JP2009014781A Expired - Fee Related JP4880708B2 (ja) | 2001-06-01 | 2009-01-26 | マイクロデポジション装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7270712B2 (ja) |
EP (7) | EP1399951A4 (ja) |
JP (9) | JP4342302B2 (ja) |
KR (8) | KR100938810B1 (ja) |
CN (7) | CN1630939A (ja) |
AT (3) | ATE486663T1 (ja) |
AU (4) | AU2002314894A1 (ja) |
DE (3) | DE60235458D1 (ja) |
WO (8) | WO2002099848A2 (ja) |
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