KR20040037027A - 폴리머 발광 다이오드 디스플레이, 인쇄 회로 기판 등을위한 산업용 미세 증착 시스템 - Google Patents
폴리머 발광 다이오드 디스플레이, 인쇄 회로 기판 등을위한 산업용 미세 증착 시스템 Download PDFInfo
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- KR20040037027A KR20040037027A KR10-2003-7015742A KR20037015742A KR20040037027A KR 20040037027 A KR20040037027 A KR 20040037027A KR 20037015742 A KR20037015742 A KR 20037015742A KR 20040037027 A KR20040037027 A KR 20040037027A
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- Prior art keywords
- microdeposition
- head
- substrate
- nozzle
- nozzle firing
- Prior art date
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/04—Heads using conductive ink
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/09—Ink jet technology used for manufacturing optical filters
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- H05K1/02—Details
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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Abstract
Description
Claims (61)
- 기판상에 정확한 양의 유체 물질을 증착하기 위한 미세 증착 시스템에 있어서,복수개의 이격된 노즐을 포함하는 미세 증착 헤드와,상기 기판에 관해 상기 미세 증착 헤드의 위치를 제어하는 위치 설정 장치와,상기 위치 설정 장치와 통신하며 상기 위치 설정 장치를 위한 위치 제어 신호들을 발생시키는 위치 설정 모듈과, 상기 미세 증착 헤드와 통신하며 전기 장치의 피처를 정의하는 방울을 형성하기 위하여 상기 노즐을 발화시키는 노즐 발화 명령들을 선택적으로 발생시키는 노즐 발화 모듈을 포함하는 콘트롤러를 포함하는 미세 증착 시스템.
- 제 1 항에 있어서, 상기 전기 장치는 폴리머 발광 다이오드, 광 패널 및 인쇄 회로 기판 중 하나인 미세 증착 시스템.
- 제 1 항에 있어서, 상기 유체 물질이 상기 기판상에서 건조될 때, 상기 건조된 유체 물질은 광 방출기, 전기적 도전체, 전기적 트레이스, 절연체, 캐패시터 및 레지스터 중 적어도 하나를 형성하는 미세 증착 시스템.
- 제 1 항에 있어서, 상기 헤드에 접속된 헤드 어셈블리를 더 포함하며, 상기 헤드 위치 설정 모듈은 상기 헤드 어셈블리를 회전시킴으로써 상기 헤드의 피치를 조정하는 미세 증착 시스템.
- 제 4 항에 있어서, 상기 콘트롤러는 피처 해상도를 증가시키는 오버-클록킹 신호를 발생하는 미세 증착 시스템.
- 제 5 항에 있어서, 상기 노즐 발화 모듈은 상기 피치의 변화를 보상하기 위하여 상기 오버-클록킹 신호를 이용하여 상기 노즐 발화 명령들의 타이밍을 조정하는 미세 증착 시스템.
- 제 1 항에 있어서,상기 방울의 디지털 이미지를 생성하는 제 1 카메라와,상기 방울의 형태, 크기, 위치 및 속도 중 적어도 하나를 분석하기 위하여 광학 문자 인식(optical character recognition)을 이용하며 적어도 하나의 노즐 발화 파라미터를 조정하는 방울 분석 모듈을 더 포함하는 미세 증착 시스템.
- 제 7 항에 있어서, 상기 노즐 발화 파라미터는 타이밍, 진폭, 지속기간, 상승 기울기 및 하강 기울기 중 적어도 하나를 포함하는 미세 증착 시스템.
- 제 4 항에 있어서, 상기 위치 설정 장치는,상기 헤드 어셈블리의 피치를 조정하는 회전 모터와,상기 콘트롤러와 통신하며 상기 미세 증착 헤드의 상기 피치에 기초한 회전 위치 신호를 발생시키는 회전 센서를 포함하는 미세 증착 시스템.
- 제 9 항에 있어서, 상기 위치 설정 장치는,제 1 축을 따라 상기 미세 증착 헤드 어셈블리를 이동시키는 제 1 수평 모터와,상기 콘트롤러와 통신하며 상기 제 1 축상의 상기 미세 증착 헤드의 위치에 기초한 제 1 위치 신호를 발생시키는 제 1 위치 센서를 더 포함하는 미세 증착 시스템.
- 제 10 항에 있어서, 상기 위치 설정 장치는,상기 제 1 축과 일반적으로 직각을 이루는 제 2 축을 따라 상기 기판을 이동시키는 제 2 수평 모터와,상기 콘트롤러와 통신하며 제 2 축상의 상기 기판의 위치에 기초한 제 2 위치 신호를 발생시키는 제 2 위치 센서를 더 포함하는 미세 증착 시스템.
- 제 1 항에 있어서, 미세 증착 동안 상기 기판을 선택적으로 맞물리게(engage)하는 기판 위치 설정 장치를 더 포함하는 미세 증착 시스템.
- 제 12 항에 있어서, 상기 기판 위치 설정 장치는 진공을 이용하여 상기 기판을 맞물리게 하는 미세 증착 시스템.
- 제 13 항에 있어서, 상기 기판의 온도를 제어가능하도록 조정하는 온도 콘트롤러를 더 포함하는 미세 증착 시스템.
- 제 1 항에 있어서, 증착된 유체 물질을 경화시키기 위하여 상기 기판상으로 자외선을 보내는(direct) 자외광원을 더 포함하는 미세 증착 시스템.
- 제 4 항에 있어서, 상기 헤드 어셈블리는 다른 개수의(second) 복수개의 노즐을 갖는 제 2 미세 증착 헤드를 포함하는 미세 증착 시스템.
- 제 1 항에 있어서, 상기 미세 증착 헤드의 상기 노즐은 행으로 형성되며 균일하게 이격되어 있는 미세 증착 시스템.
- 제 1 항에 있어서, 상기 미세 증착 헤드의 상기 노즐은,진동판과,상기 진동판을 변형시키는 압변환기와,견고한 벽과,노즐 개구를 포함하는 노즐판과,상기 견고한 벽, 상기 진동판 및 상기 노즐판 사이에 형성되는 유체 통로를 포함하며,상기 노즐 발화 명령신호들이 수신될 때 음파가 상기 노즐 개구로부터 상기 방울을 발화시키는 미세 증착 시스템.
- 제 1 항에 있어서, 상기 미세 증착 헤드는 열 미세 증착 헤드, 버블 미세 증착 헤드, 연속 방울 미세 증착 헤드, 압변환기 밸브, 및 마이크로전자기계 밸브로 구성되는 그룹으로부터 선택되는 미세 증착 시스템.
- 제 4 항에 있어서,상기 헤드 어셈블리상에 위치된 제 2 미세 증착 헤드와,상기 미세 증착 헤드의 위치를 조정하기 위한 제 1 작동기와,상기 제 2 미세 증착 헤드의 위치를 조정하기 위한 제 2 작동기를 더 포함하는 미세 증착 시스템.
- 제 1 항에 있어서, 상기 노즐 각각에 대해 적어도 하나의 노즐 발화 파형을 조정하도록 하는 파형 발생기를 더 포함하는 미세 증착 시스템.
- 제 1 항에 있어서, 상기 파형 발생기는 상기 노즐의 작동 상태에 기초하여 상기 노즐 각각에 대한 복수개의 노즐 발화 파형들 중 하나를 선택하는 선택기를 포함하는 미세 증착 시스템.
- 제 4 항에 있어서, 상기 헤드 어셈블리 및 레이저 헤드 어셈블리 중 하나에 장착되며 피처 해상도를 증가시키는데 이용되는 레이저를 더 포함하는 미세 증착 시스템.
- 기판상에 정확한 양의 유체 물질을 미세 증착하기 위한 방법에 있어서,복수개의 이격된 노즐을 포함하는 미세 증착 헤드를 제공하는 단계와,상기 기판에 적합한 상기 미세 증착 헤드의 위치를 제어하는 단계와,전기 장치의 피처를 정의하는 방울을 형성하기 위하여 상기 노즐을 발화시키는 노즐 발화 명령들을 발생시키는 단계를 포함하는 미세 증착 방법.
- 제 24 항에 있어서, 상기 전기 장치는 폴리머 발광 다이오드, 광 패널 및 인쇄 회로 기판 중 하나인 미세 증착 방법.
- 제 24 항에 있어서, 상기 유체 물질이 상기 기판상에서 건조될 때, 상기 건조된 유체 물질은 광 방출기, 전기적 도전체, 전기적 트레이스, 절연체, 캐패시터 및 레지스터 중 적어도 하나를 형성하는 미세 증착 방법.
- 제 24 항에 있어서,헤드 어셈블리상에 상기 헤드를 장착하는 단계와,상기 헤드 어셈블리를 회전시킴으로써 피치를 조정하는 단계를 더 포함하는 미세 증착 방법.
- 제 27 항에 있어서, 피처 해상도를 향상시키기 위하여 오버-클록킹 신호를 발생시키는 단계를 더 포함하는 미세 증착 방법.
- 제 28 항에 있어서, 상기 피치의 변화를 보상하기 위하여 상기 오버-클록킹 신호를 이용하여 상기 노즐 발화 명령들의 타이밍을 조정하는 단계를 더 포함하는 미세 증착 방법.
- 제 24 항에 있어서,상기 방울의 디지털 이미지를 생성하는 단계와,상기 방울의 형태, 크기, 위치 및 속도 중 적어도 하나를 분석하기 위하여 광학 문자 인식을 이용하는 단계와,방울 분석에 기초하여 적어도 하나의 노즐 발화 파라미터를 조정하는 단계를 더 포함하는 미세 증착 방법.
- 제 30 항에 있어서, 상기 노즐 발화 파라미터들은 타이밍, 진폭, 지속기간, 상승 기울기 및 하강 기울기 중 적어도 하나를 포함하는 미세 증착 방법.
- 제 27 항에 있어서,상기 헤드 어셈블리를 회전시키는 단계와,상기 미세 증착 헤드의 회전 위치에 기초한 회전 위치 신호를 발생시키는 단계를 더 포함하는 미세 증착 방법.
- 제 32 항에 있어서,제 1 축을 따라 상기 미세 증착 헤드 어셈블리를 이동시키는 단계와,상기 제 1 축상의 상기 미세 증착 헤드의 위치에 기초한 제 1 위치 신호를 발생시키는 단계를 더 포함하는 미세 증착 방법.
- 제 33 항에 있어서,상기 제 1 축에 일반적으로 직각을 이루는 제 2 축을 따라 상기 기판을 이동시키는 단계와,상기 제 2 축상의 상기 기판의 위치에 기초한 제 2 위치 신호를 발생시키는 단계를 더 포함하는 미세 증착 방법.
- 제 24 항에 있어서, 미세 증착 동안 상기 기판을 맞물리게하는 단계를 더 포함하는 미세 증착 방법.
- 제 35 항에 있어서, 상기 맞물림 단계는 진공에서 수행되는 미세 증착 방법.
- 제 36 항에 있어서, 상기 기판의 온도를 조정하는 단계를 더 포함하는 미세 증착 방법.
- 제 24 항에 있어서, 증착된 유체 물질을 경화시키기 위하여 상기 기판상으로 자외선을 보내는(direct) 단계를 더 포함하는 미세 증착 방법.
- 제 27 항에 있어서, 다른 개수의(second) 복수개의 노즐을 가진 제 2 미세 증착 헤드를 상기 헤드 어셈블리상에 제공하는 단계를 더 포함하는 미세 증착 방법.
- 제 24 항에 있어서, 상기 미세 증착 헤드의 상기 노즐은 하나의 행으로 형성되며 균일하게 이격되는 미세 증착 방법.
- 제 24 항에 있어서, 상기 미세 증착 헤드는 열 미세 증착 헤드들, 버블 미세 증착 헤드들, 연속 방울 미세 증착 헤드들, 압변환기 밸브들 및 마이크로전자기계 밸브들로 구성되는 그룹으로부터 선택되는 미세 증착 방법.
- 제 27 항에 있어서,상기 헤드 어셈블리상에 위치된 제 2 미세 증착 헤드를 제공하는 단계와,상기 미세 증착 헤드의 위치를 조정하기 위한 제 1 작동기를 제공하는 단계와,상기 제 2 미세 증착 헤드의 위치를 조정하기 위한 제 2 작동기를 제공하는 단계를 더 포함하는 미세 증착 방법.
- 제 24 항에 있어서, 상기 노즐 각각에 대해 적어도 하나의 노즐 발화 파형을 조정하도록 허용하는 단계를 더 포함하는 미세 증착 방법.
- 제 24 항에 있어서, 상기 노즐의 작동 상태에 기초하여 상기 노즐 각각에 대해 복수개의 노즐 발화 파형들 중 하나를 선택하는 단계를 더 포함하는 미세 증착 방법.
- 제 27 항에 있어서, 피처 해상도를 증가시키기 위하여 레이저를 사용하는 단계를 더 포함하는 미세 증착 방법.
- 기판상에 정확한 양의 유체 물질을 증착하기 위한 미세 증착 시스템에 있어서,복수개의 이격된 노즐을 포함하는 미세 증착 헤드와,상기 기판에 적절하게 상기 미세 증착 헤드의 위치를 제어하는 위치 설정 장치와,상기 위치 설정 장치와 통신하며 상기 위치 설정 장치를 위한 위치 제어 신호들을 발생시키는 위치 설정 모듈과, 상기 미세 증착 헤드와 통신하며 전기 장치의 피처를 정의하는 방울을 형성하기 위하여 상기 노즐을 발화시키는 노즐 발화 명령들을 선택적으로 발생시키는 노즐 발화 모듈과, 상기 노즐 각각에 대해 노즐 발화 파형들을 조정할 수 있는 파형 발생기를 포함하는 콘트롤러를 포함하는 미세 증착 시스템.
- 제 46 항에 있어서, 상기 미세 증착 시스템에 의해 생산된 장치는 폴리머 발광 다이오드, 광 패널 및 인쇄 회로 기판 중 하나인 미세 증착 시스템.
- 제 46 항에 있어서, 상기 방울은 광 방출기, 전기적 도전체, 전기적 트레이스, 절연체, 캐패시터 및 레지스터 중 적어도 하나를 형성하는 미세 증착 시스템.
- 기판상에 정확한 양의 유체 물질을 증착하기 위한 미세 증착 시스템에 있어서,복수개의 이격된 노즐을 포함하는 미세 증착 헤드와,상기 기판에 적절하게 상기 미세 증착 헤드의 위치와 피치를 제어하는 위치 설정 장치와,상기 위치 설정 장치와 통신하며 상기 위치 설정 장치를 위한 위치 제어 신호들을 발생시키는 위치 설정 모듈과, 상기 미세 증착 헤드와 통신하며 전기 장치의 피처를 정의하는 방울을 형성하기 위하여 상기 노즐을 발화시키는 노즐 발화 명령들을 선택적으로 발생시키는 노즐 발화 모듈을 포함하는 콘트롤러를 포함하는 미세 증착 시스템.
- 제 49 항에 있어서, 상기 노즐 각각에 대해 노즐 발화 파형들을 조정할 수 있는 파형 발생기를 더 포함하는 미세 증착 시스템.
- 제 49 항에 있어서, 상기 미세 증착 시스템에 의해 제조된 장치는 폴리머 발광 다이오드, 광 패널 및 인쇄 회로 기판 중 하나인 미세 증착 시스템.
- 제 49 항에 있어서, 상기 방울 물질은 상기 기판상에서 건조되며, 상기 건조된 유체 물질은 광 방출기, 전기적 도전체, 전기적 트레이스, 절연체, 캐패시터 및 레지스터 중 적어도 하나를 형성하는 미세 증착 시스템.
- 기판상에 정확한 양의 유체 물질을 증착하기 위한 미세 증착 시스템에 있어서,복수개의 이격된 노즐을 포함하는 미세 증착 헤드와,상기 기판에 적절하게 상기 미세 증착 헤드의 위치를 제어하는 위치 설정 장치와,상기 위치 설정 장치와 통신하며 상기 위치 설정 장치를 위한 위치 제어 신호들을 발생시키는 위치 설정 모듈과, 상기 미세 증착 헤드와 통신하며 전기 장치의 피처를 정의하는 방울을 형성하기 위하여 상기 노즐을 발화시키는 노즐 발화 명령들을 선택적으로 발생시키는 노즐 발화 모듈을 포함하는 콘트롤러를 포함하며,상기 콘트롤러는 피처 해상도를 개선하는 오버-클록킹 신호를 발생하는 미세 증착 시스템.
- 제 53 항에 있어서, 상기 노즐 발화 모듈은 상기 피치의 변화를 보상하기 위하여 상기 오버-클록킹 신호를 이용하여 상기 노즐 발화 명령들의 타이밍을 조정하는 미세 증착 시스템.
- 제 53 항에 있어서, 상기 노즐 각각에 대한 노즐 발화 파형들을 조정할 수 있는 파형 발생기를 더 포함하는 미세 증착 시스템.
- 제 53 항에 있어서, 상기 미세 증착 시스템에 의해 생산된 장치는 폴리머 발광 다이오드, 광 패널 및 인쇄 회로 기판 중 하나인 미세 증착 시스템.
- 제 53 항에 있어서, 상기 방울은 광 방출기, 전기적 도전체, 전기적 트레이스, 절연체, 캐패시터 및 레지스터 중 적어도 하나를 형성하는 미세 증착 시스템.
- 기판상에 정확한 양의 유체 물질을 증착하기 위한 미세 증착 시스템에 있어서,복수개의 이격된 노즐을 포함하는 미세 증착 헤드와,상기 기판에 적절하게 상기 미세 증착 헤드의 위치를 제어하는 위치 설정 장치와,상기 위치 설정 장치와 통신하며 상기 위치 설정 장치를 위한 위치 제어 신호들을 발생시키는 위치 설정 모듈과, 상기 미세 증착 헤드와 통신하며 상기 기판상의 피처를 정의하는 방울을 형성하기 위하여 상기 노즐을 발화시키는 노즐 발화 명령들을 선택적으로 발생시키는 노즐 발화 모듈을 포함하는 콘트롤러와,상기 방울의 디지털 이미지를 발생시키는 제 1 카메라와,방울의 형태, 크기, 위치 및 속도 중 적어도 하나를 분석하기 위하여 광학문자 인식을 이용하며 방울 분석에 기초하여 적어도 하나의 노즐 발화 파라미터를 조정하는 방울 분석 모듈을 포함하는 미세 증착 시스템.
- 제 58 항에 있어서, 상기 노즐 발화 파라미터들은 타이밍, 진폭, 지속기간, 상승 기울기 및 하강 기울기 중 적어도 하나를 포함하는 미세 증착 시스템.
- 제 58 항에 있어서, 상기 미세 증착에 의해 생산된 장치는 폴리머 발광 다이오드, 광 패널, 및 인쇄 회로 기판 중 하나인 미세 증착 시스템.
- 제 58 항에 있어서, 상기 방울은 광 방출기, 전기적 도전체, 전기적 트레이스, 절연체, 캐패시터 및 레지스터 중 적어도 하나를 형성하는 미세 증착 시스템.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US60/295,100 | 2001-06-01 | ||
US60/295,118 | 2001-06-01 | ||
PCT/US2002/017523 WO2002098576A1 (en) | 2001-06-01 | 2002-05-31 | Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040037027A true KR20040037027A (ko) | 2004-05-04 |
KR100924002B1 KR100924002B1 (ko) | 2009-10-28 |
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Family Applications (8)
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KR10-2003-7015754A KR20040038915A (ko) | 2001-06-01 | 2002-05-31 | 복수의 유체 물질의 미세증착을 위한 장치 |
KR1020097020246A KR100998171B1 (ko) | 2001-06-01 | 2002-05-31 | 미세 증착 제어 장치를 위한 파형 발생기 |
KR10-2003-7015748A KR20040026659A (ko) | 2001-06-01 | 2002-05-31 | 교환가능 미세증착 헤드 장치 및 방법 |
KR10-2003-7015752A KR20040024558A (ko) | 2001-06-01 | 2002-05-31 | 압전 미세증착을 이용한 인쇄회로보드 구조물의 형성 |
KR1020037015742A KR100924002B1 (ko) | 2001-06-01 | 2002-05-31 | 폴리머 발광 다이오드 디스플레이, 인쇄 회로 기판 등을 위한 산업용 미세 증착 장치 |
KR1020037015746A KR100912008B1 (ko) | 2001-06-01 | 2002-05-31 | 미세증착 장치 |
KR1020037015744A KR100882520B1 (ko) | 2001-06-01 | 2002-05-31 | 해상도를 개선하기 위한 미세 증착 제어 시스템에서의오버-클록킹 |
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KR10-2003-7015754A KR20040038915A (ko) | 2001-06-01 | 2002-05-31 | 복수의 유체 물질의 미세증착을 위한 장치 |
KR1020097020246A KR100998171B1 (ko) | 2001-06-01 | 2002-05-31 | 미세 증착 제어 장치를 위한 파형 발생기 |
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Country Status (9)
Country | Link |
---|---|
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CN (7) | CN1630939A (ko) |
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Families Citing this family (99)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4971560B2 (ja) * | 2001-08-06 | 2012-07-11 | キヤノン株式会社 | インクジェット記録装置、ヘッドユニット及びカラーフィルタ製造装置 |
KR100646279B1 (ko) * | 2002-09-27 | 2006-11-23 | 시마쯔 코퍼레이션 | 액체 분주를 위한 방법 및 장치 |
US7964237B2 (en) * | 2003-08-21 | 2011-06-21 | International Business Machines Corporation | Fully automated paste dispense process for dispensing small dots and lines |
TWI220076B (en) * | 2003-08-27 | 2004-08-01 | Au Optronics Corp | Light-emitting device |
KR101026935B1 (ko) | 2003-12-10 | 2011-04-04 | 엘지디스플레이 주식회사 | 디스펜서 정렬장치 및 그 방법 |
JP4195366B2 (ja) | 2003-12-19 | 2008-12-10 | シャープ株式会社 | 薬液塗布方法および薬液塗布装置 |
US7271940B2 (en) * | 2004-02-10 | 2007-09-18 | Zebra Imaging, Inc. | Deposition of photosensitive media for digital hologram recording |
NL1026013C2 (nl) * | 2004-04-23 | 2005-10-25 | Otb Group Bv | Werkwijze en inrichting voor het nauwkeurig aanbrengen van structuren op een substraat. |
US7354845B2 (en) | 2004-08-24 | 2008-04-08 | Otb Group B.V. | In-line process for making thin film electronic devices |
US8101244B2 (en) * | 2004-06-09 | 2012-01-24 | Smithkline Beecham Corporation | Apparatus and method for producing or processing a product or sample |
TWI428271B (zh) | 2004-06-09 | 2014-03-01 | Smithkline Beecham Corp | 生產藥物之裝置及方法 |
US20060092218A1 (en) * | 2004-11-04 | 2006-05-04 | Applied Materials, Inc. | Methods and apparatus for inkjet printing |
JP2006137124A (ja) * | 2004-11-15 | 2006-06-01 | Konica Minolta Holdings Inc | 液体吐出装置及び液体吐出方法 |
CN1939095B (zh) * | 2004-12-14 | 2010-12-08 | 株式会社爱发科 | 涂敷装置、有机材料薄膜的形成方法、有机el面板制造装置 |
JP2006175727A (ja) * | 2004-12-22 | 2006-07-06 | Konica Minolta Holdings Inc | 液滴吐出制御装置 |
KR20070087223A (ko) * | 2004-12-30 | 2007-08-27 | 후지필름 디마틱스, 인크. | 잉크 분사 프린팅 |
WO2006076607A1 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Ink-jet printing of passive electricalcomponents |
WO2006076605A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Circuit modeling and selective deposition |
US20060189113A1 (en) | 2005-01-14 | 2006-08-24 | Cabot Corporation | Metal nanoparticle compositions |
US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
WO2006076604A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Processes for planarizing substrates and encapsulating printable electronic features |
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
US8334464B2 (en) | 2005-01-14 | 2012-12-18 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
WO2006076608A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
JP2006195863A (ja) * | 2005-01-17 | 2006-07-27 | Fujitsu Ten Ltd | エラー検出装置 |
US20060163563A1 (en) * | 2005-01-24 | 2006-07-27 | Kurt Ulmer | Method to form a thin film resistor |
WO2007004627A1 (ja) * | 2005-07-05 | 2007-01-11 | Konica Minolta Holdings, Inc. | パターニング装置、有機エレクトロルミネッセンス素子とその製造方法及び有機エレクトロルミネッセンス表示装置 |
JP5509509B2 (ja) * | 2005-09-30 | 2014-06-04 | コニカミノルタ株式会社 | 液滴吐出装置、液滴速度調整方法、液滴速度検出装置、液滴速度検出方法、プログラム及び記録媒体 |
CN101282842B (zh) * | 2005-10-07 | 2010-09-01 | 皇家飞利浦电子股份有限公司 | 用于将物质小滴受控地定位到基底上的喷墨装置和方法 |
TWI287828B (en) | 2005-12-30 | 2007-10-01 | Ind Tech Res Inst | Method for printing a pattern and data processing method thereof |
JP4058453B2 (ja) * | 2006-05-08 | 2008-03-12 | シャープ株式会社 | 液滴塗布装置 |
TWI318176B (en) | 2006-11-08 | 2009-12-11 | Ind Tech Res Inst | Printing method |
TWI320754B (en) | 2006-11-10 | 2010-02-21 | Ind Tech Res Inst | A print data processing mothod and device therefor |
US7988247B2 (en) | 2007-01-11 | 2011-08-02 | Fujifilm Dimatix, Inc. | Ejection of drops having variable drop size from an ink jet printer |
JP2008201018A (ja) * | 2007-02-21 | 2008-09-04 | Toppan Printing Co Ltd | インクジェットヘッドのアライメント装置 |
JP5391524B2 (ja) * | 2007-03-23 | 2014-01-15 | 凸版印刷株式会社 | インクジェットヘッド管理装置 |
US8186790B2 (en) * | 2008-03-14 | 2012-05-29 | Purdue Research Foundation | Method for producing ultra-small drops |
DE102008057005A1 (de) * | 2008-11-11 | 2010-05-12 | Jonas & Redmann Automationstechnik Gmbh | Verfahren zum Positionieren und/oder Führen mindestens eines beliebigen Prozesskopfes für die Metallisierung von dünnen Substraten in einem definierten Abstand über der Substratoberfläche |
CN101462414B (zh) * | 2008-11-28 | 2011-03-23 | 江苏康众数字医疗设备有限公司 | 用于电子元件集成的印刷装置及印刷方法 |
ATE550170T1 (de) * | 2008-12-19 | 2012-04-15 | Agfa Graphics Nv | Bildverarbeitungsverfahren für dreidimensionales drucken |
US20100156768A1 (en) * | 2008-12-22 | 2010-06-24 | Fletcher Ii James Douglas | Display media, method of forming display media, and printer for printing on display media |
JP5401163B2 (ja) * | 2009-04-30 | 2014-01-29 | パナソニック株式会社 | インクジェット印刷装置 |
US20100300355A1 (en) * | 2009-06-01 | 2010-12-02 | Moser Baer India Limited | Printing material profiles onto substrates |
US20130099666A1 (en) * | 2011-10-21 | 2013-04-25 | Almax Rp Corp. | Selectively controlling the resistance of resistive traces printed on a substrate to supply equal current to an array of light sources |
JP6057406B2 (ja) * | 2012-01-06 | 2017-01-11 | 住友重機械工業株式会社 | 薄膜形成装置及び薄膜形成方法 |
FR2990055B1 (fr) * | 2012-04-30 | 2014-12-26 | Total Sa | Matrice de depot d'au moins un fluide conducteur sur un substrat, ainsi que dispositif comprenant cette matrice et procede de depot |
JP5750414B2 (ja) * | 2012-08-27 | 2015-07-22 | 東芝テック株式会社 | インクジェットヘッド駆動装置 |
CN102862402B (zh) * | 2012-10-17 | 2015-07-22 | 佛山市智巢电子科技有限公司 | 一种阵列式精密喷印设备的喷印控制方法与系统 |
US9832428B2 (en) | 2012-12-27 | 2017-11-28 | Kateeva, Inc. | Fast measurement of droplet parameters in industrial printing system |
US11673155B2 (en) | 2012-12-27 | 2023-06-13 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US9700908B2 (en) | 2012-12-27 | 2017-07-11 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
KR20230169406A (ko) | 2012-12-27 | 2023-12-15 | 카티바, 인크. | 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법 |
US11141752B2 (en) | 2012-12-27 | 2021-10-12 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US9352561B2 (en) | 2012-12-27 | 2016-05-31 | Kateeva, Inc. | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances |
EP3003692A1 (en) * | 2013-05-31 | 2016-04-13 | Johnson Controls Technology Company | System and method for forming a vehicle trim component via additive manufacturing, and vehicle trim component |
KR20160098376A (ko) | 2013-12-12 | 2016-08-18 | 카티바, 인크. | 두께를 제어하기 위해 하프토닝을 이용하는 잉크-기반 층 제조 |
US20150197062A1 (en) * | 2014-01-12 | 2015-07-16 | Zohar SHINAR | Method, device, and system of three-dimensional printing |
EP2902206B1 (en) | 2014-01-31 | 2021-06-09 | HP Scitex Ltd | Printhead arrangement on a printbar beam member |
US10391705B2 (en) * | 2014-05-09 | 2019-08-27 | Nike, Inc. | System and method for forming three-dimensional structures |
US9387671B2 (en) | 2014-05-14 | 2016-07-12 | Ricoh Company, Ltd. | Head driving device, recording head unit, and image forming apparatus |
US9147875B1 (en) | 2014-09-10 | 2015-09-29 | Cellink Corporation | Interconnect for battery packs |
US10211443B2 (en) | 2014-09-10 | 2019-02-19 | Cellink Corporation | Battery interconnects |
CN104385592B (zh) * | 2014-10-14 | 2016-12-07 | 秦皇岛天秦三维数字化技术有限公司 | 3d打印机机电控制系统及方法 |
JP6296960B2 (ja) * | 2014-10-31 | 2018-03-20 | 株式会社東芝 | インクジェットヘッド、及び、印刷装置 |
CN105643921B (zh) * | 2014-11-11 | 2018-09-25 | 三纬国际立体列印科技股份有限公司 | 立体打印装置与立体打印方法 |
KR20180031626A (ko) * | 2015-02-03 | 2018-03-28 | 셀링크 코포레이션 | 조합된 열 및 전기 에너지 전달을 위한 시스템 및 방법 |
US10029425B2 (en) * | 2015-04-07 | 2018-07-24 | Sartorius Stedim Biotech Gmbh | Container for accommodating at least one of at least one biologically active fluid and at least one preparatory fluid, and a method therefor |
JP6479555B2 (ja) * | 2015-04-27 | 2019-03-06 | 住友重機械工業株式会社 | 膜形成装置 |
JP6640375B2 (ja) * | 2015-12-21 | 2020-02-05 | ワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG | 3d印刷デバイスを使用することにより物体を製造するための方法およびデバイス |
JP6387955B2 (ja) * | 2015-12-25 | 2018-09-12 | セイコーエプソン株式会社 | ヘッドユニット制御回路 |
CN109890619B (zh) * | 2016-07-27 | 2021-01-26 | 哈佛学院院长及董事 | 用于声泳打印的设备和方法 |
CN107952958B (zh) * | 2016-10-16 | 2020-01-10 | 北京煜鼎增材制造研究院有限公司 | 沉积轴、增材制造设备及对沉积轴行程进行调节的方法 |
DE102016014943A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Druckkopf mit Temperiereinrichtung |
DE102016014951A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Beschichtungseinrichtung und zugehöriges Betriebsverfahren |
DE102016014952A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Beschichtungseinrichtung zur Beschichtung von Bauteilen |
DE102016014919A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Applikationsvorrichtung und Verfahren zum Applizieren eines Beschichtungsmittels |
DE102016014956A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Beschichtungseinrichtung und zugehöriges Betriebsverfahren |
DE102016014946A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Druckkopf zur Applikation eines Beschichtungsmittels auf ein Bauteil |
DE102016014953A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Lackieranlage und entsprechendes Lackierverfahren |
DE102016014944A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Beschichtungsverfahren und entsprechende Beschichtungseinrichtung |
DE102016014955A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Beschichtungseinrichtung und entsprechendes Beschichtungsverfahren |
DE102016014948A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Druckkopf und zugehöriges Betriebsverfahren |
DE102016014947A1 (de) | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Druckkopf zur Applikation eines Beschichtungsmittels |
DE102016014920A1 (de) * | 2016-12-14 | 2018-06-14 | Dürr Systems Ag | Druckkopf mit Verschiebe- und/oder Drehmechanik für zumindest eine Düsenreihe |
JP6999317B2 (ja) * | 2017-07-21 | 2022-01-18 | 東芝テック株式会社 | インクジェットヘッド及びインクジェットプリンタ |
WO2019084348A1 (en) * | 2017-10-27 | 2019-05-02 | Nordson Corporation | SYSTEMS AND METHODS FOR CONTROLLING THE SPEED OF A CLOSED LOOP LIQUID FOR EJECTION |
WO2019140423A1 (en) * | 2018-01-15 | 2019-07-18 | Tokyo Electron Limited | System and method for fluid dispense and coverage control |
FR3080998B1 (fr) * | 2018-05-14 | 2020-04-24 | Reydel Automotive B.V. | Procede de traitement de surface d'une piece et installation associee |
EP3588099B1 (en) * | 2018-06-26 | 2024-09-25 | Tecan Trading Ag | Positioning assembly for a laboratory apparatus |
CN110271288B (zh) * | 2019-07-05 | 2020-05-22 | 深圳市华星光电半导体显示技术有限公司 | Oled喷墨打印喷头及其打印装置 |
CN110424032A (zh) * | 2019-09-10 | 2019-11-08 | 江苏师范大学 | 一种用于压力机主轴修复的射流电沉积装置及其方法 |
CN111231316A (zh) * | 2020-03-02 | 2020-06-05 | 爱司达智能制造(江苏)有限公司 | 一种增材设备的流道结构 |
CN111286699B (zh) * | 2020-03-25 | 2022-04-05 | 中国工程物理研究院激光聚变研究中心 | 一种挡板修正方法、镀膜方法和装置 |
CN111653184B (zh) * | 2020-07-10 | 2022-05-10 | 宿迁市规划测绘院有限公司 | 一种拥有多功能放置台的3d地图批量喷绘控制系统 |
JP2024512188A (ja) | 2021-03-24 | 2024-03-19 | セルリンク コーポレーション | 多層フレキシブルバッテリー相互接続及びその製造方法 |
CN113245102B (zh) * | 2021-06-07 | 2022-02-25 | 苏州微知电子科技有限公司 | 一种纤维器件喷涂机 |
CN114161707B (zh) * | 2021-12-10 | 2024-09-20 | 苏州华星光电技术有限公司 | 打印设备及打印方法 |
CN114474718A (zh) * | 2021-12-28 | 2022-05-13 | 郭超 | 一种3d打印检测方法、装置、设备及3d打印系统 |
Family Cites Families (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3572400A (en) * | 1967-08-31 | 1971-03-23 | Western Electric Co | Dispensing of fluids to small areas |
US4037830A (en) * | 1976-09-07 | 1977-07-26 | International Business Machines Corporation | Wafer handler |
JPS5590806A (en) * | 1978-12-29 | 1980-07-09 | Ricoh Co Ltd | Apparatus for measuring diameter of ink jet particle |
US4795518A (en) * | 1984-02-17 | 1989-01-03 | Burr-Brown Corporation | Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus |
US4575330A (en) * | 1984-08-08 | 1986-03-11 | Uvp, Inc. | Apparatus for production of three-dimensional objects by stereolithography |
US4835704A (en) * | 1986-12-29 | 1989-05-30 | General Electric Company | Adaptive lithography system to provide high density interconnect |
US5002008A (en) * | 1988-05-27 | 1991-03-26 | Tokyo Electron Limited | Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state |
US5229016A (en) * | 1991-08-08 | 1993-07-20 | Microfab Technologies, Inc. | Method and apparatus for dispensing spherical-shaped quantities of liquid solder |
JPH05149769A (ja) * | 1991-11-29 | 1993-06-15 | Canon Inc | インクジエツト記録ヘツドのインク噴射体積測定方法および測定装置 |
US5320250A (en) * | 1991-12-02 | 1994-06-14 | Asymptotic Technologies, Inc. | Method for rapid dispensing of minute quantities of viscous material |
US5738165A (en) * | 1993-05-07 | 1998-04-14 | Nikon Corporation | Substrate holding apparatus |
US5403617A (en) * | 1993-09-15 | 1995-04-04 | Mobium Enterprises Corporation | Hybrid pulsed valve for thin film coating and method |
US5736195A (en) * | 1993-09-15 | 1998-04-07 | Mobium Enterprises Corporation | Method of coating a thin film on a substrate |
JPH07101062A (ja) * | 1993-09-30 | 1995-04-18 | Canon Inc | インクジェット記録装置及びその記録方法 |
US5498444A (en) * | 1994-02-28 | 1996-03-12 | Microfab Technologies, Inc. | Method for producing micro-optical components |
JPH07323550A (ja) * | 1994-05-31 | 1995-12-12 | Canon Inc | インクジェットプリント装置の制御方法およびインクジェットプリント装置 |
JP3241251B2 (ja) * | 1994-12-16 | 2001-12-25 | キヤノン株式会社 | 電子放出素子の製造方法及び電子源基板の製造方法 |
US5920331A (en) * | 1995-04-12 | 1999-07-06 | Eastman Kodak Company | Method and apparatus for accurate control of temperature pulses in printing heads |
JPH091797A (ja) * | 1995-06-15 | 1997-01-07 | Toyo Electric Mfg Co Ltd | インクの着弾位置制御方法 |
US5932012A (en) * | 1995-06-23 | 1999-08-03 | Hitachi Techno Engineering Co., Ltd. | Paste applicator having positioning means |
DE69637838D1 (de) * | 1995-10-13 | 2009-04-02 | Nordson Corp | System und Verfahren zur Beschichtung der Unterseite von Flip-Chips |
JP3627078B2 (ja) * | 1995-12-22 | 2005-03-09 | 富士写真フイルム株式会社 | インクジェット装置 |
US5906683A (en) * | 1996-04-16 | 1999-05-25 | Applied Materials, Inc. | Lid assembly for semiconductor processing chamber |
US5681757A (en) * | 1996-04-29 | 1997-10-28 | Microfab Technologies, Inc. | Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process |
US5779971A (en) * | 1996-06-07 | 1998-07-14 | Hewlett-Packard Company | Solder jet printhead |
JP3349891B2 (ja) * | 1996-06-11 | 2002-11-25 | 富士通株式会社 | 圧電型インクジェットヘッドの駆動方法 |
JPH1050769A (ja) * | 1996-07-30 | 1998-02-20 | Toshiba Corp | 半導体パッケージの製造装置および製造方法 |
US5756157A (en) * | 1996-10-02 | 1998-05-26 | Silicon Valley Group | Method for processing flat panel displays and large wafers |
US6132809A (en) * | 1997-01-16 | 2000-10-17 | Precision Valve & Automation, Inc. | Conformal coating using multiple applications |
US6224180B1 (en) * | 1997-02-21 | 2001-05-01 | Gerald Pham-Van-Diep | High speed jet soldering system |
JPH10260307A (ja) * | 1997-03-17 | 1998-09-29 | Seiko Epson Corp | カラーフィルタの製造装置およびその方法 |
JPH10284360A (ja) * | 1997-04-02 | 1998-10-23 | Hitachi Ltd | 基板温度制御装置及び方法 |
SG81234A1 (en) * | 1997-07-04 | 2001-06-19 | Toyko Electron Ltd | Process solution supplying apparatus |
JP3695150B2 (ja) * | 1997-07-08 | 2005-09-14 | セイコーエプソン株式会社 | インクジェット記録装置及びその駆動波形制御方法 |
US6193346B1 (en) * | 1997-07-22 | 2001-02-27 | Ricoh Company, Ltd. | Ink-jet recording apparatus |
JPH1158735A (ja) * | 1997-08-18 | 1999-03-02 | Nec Niigata Ltd | インクジェット記録装置 |
JPH11138820A (ja) * | 1997-09-05 | 1999-05-25 | Ricoh Co Ltd | 液滴の噴射特性測定方法およびシステム |
JPH1177991A (ja) * | 1997-09-12 | 1999-03-23 | Seiko Epson Corp | インクジェット記録装置 |
DE69840914D1 (de) * | 1997-10-14 | 2009-07-30 | Patterning Technologies Ltd | Methode zur Herstellung eines elektrischen Kondensators |
US6007631A (en) * | 1997-11-10 | 1999-12-28 | Speedline Technologies, Inc. | Multiple head dispensing system and method |
JPH11157055A (ja) * | 1997-11-28 | 1999-06-15 | Sony Corp | インクジェットプリンタ、ならびにインクジェットプリンタ用記録ヘッドの駆動装置および方法 |
US6019164A (en) * | 1997-12-31 | 2000-02-01 | Temptronic Corporation | Workpiece chuck |
GB9808182D0 (en) * | 1998-04-17 | 1998-06-17 | The Technology Partnership Plc | Liquid projection apparatus |
JP3381776B2 (ja) * | 1998-05-19 | 2003-03-04 | 東京エレクトロン株式会社 | 処理装置および処理方法 |
JP3611177B2 (ja) * | 1998-07-22 | 2005-01-19 | セイコーエプソン株式会社 | インクジェット式記録装置及び記録方法 |
US6129872A (en) * | 1998-08-29 | 2000-10-10 | Jang; Justin | Process and apparatus for creating a colorful three-dimensional object |
JP2000071437A (ja) * | 1998-09-02 | 2000-03-07 | Ricoh Co Ltd | インクジェット記録装置及び記憶媒体並びに制御テーブル作成方法 |
US6190727B1 (en) * | 1998-10-30 | 2001-02-20 | Georgia-Pacific Corporation | Liquid coating spray applicator and method providing automatic spread rate control |
JP4468500B2 (ja) * | 1998-11-16 | 2010-05-26 | ブラザー工業株式会社 | 移動物体の検出方法及びその装置 |
US6318828B1 (en) * | 1999-02-19 | 2001-11-20 | Hewlett-Packard Company | System and method for controlling firing operations of an inkjet printhead |
US6209964B1 (en) * | 1999-03-03 | 2001-04-03 | Jose Pinto | Dump truck vibrator |
JP4208332B2 (ja) * | 1999-03-19 | 2009-01-14 | キヤノン株式会社 | インクジェットヘッドユニットの調整装置及び調整方法及びカラーフィルタの製造方法及び液晶表示パネルの製造方法 |
GB2350321A (en) * | 1999-05-27 | 2000-11-29 | Patterning Technologies Ltd | Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition |
AU5090400A (en) * | 1999-05-27 | 2001-03-05 | Jetmask Limited | Method of forming a masking pattern on a surface |
DE60045362D1 (de) * | 1999-09-30 | 2011-01-27 | Seiko Epson Corp | Flüssigkeitsstrahlvorrichtung |
JP3446686B2 (ja) * | 1999-10-21 | 2003-09-16 | セイコーエプソン株式会社 | インクジェット式記録装置 |
US6420202B1 (en) * | 2000-05-16 | 2002-07-16 | Agere Systems Guardian Corp. | Method for shaping thin film resonators to shape acoustic modes therein |
US6596239B2 (en) * | 2000-12-12 | 2003-07-22 | Edc Biosystems, Inc. | Acoustically mediated fluid transfer methods and uses thereof |
-
2002
- 2002-05-31 AU AU2002314894A patent/AU2002314894A1/en not_active Abandoned
- 2002-05-31 JP JP2003501606A patent/JP4342302B2/ja not_active Expired - Fee Related
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- 2002-05-31 CN CNA028133110A patent/CN1630939A/zh active Pending
- 2002-05-31 JP JP2003502863A patent/JP2004533121A/ja active Pending
- 2002-05-31 EP EP02752023A patent/EP1399951A4/en not_active Withdrawn
- 2002-05-31 WO PCT/US2002/017369 patent/WO2002099848A2/en not_active Application Discontinuation
- 2002-05-31 CN CNB028148223A patent/CN1329130C/zh not_active Expired - Fee Related
- 2002-05-31 KR KR1020037015750A patent/KR100938810B1/ko active IP Right Grant
- 2002-05-31 WO PCT/US2002/017370 patent/WO2002099849A2/en not_active Application Discontinuation
- 2002-05-31 JP JP2003502864A patent/JP2005515052A/ja active Pending
- 2002-05-31 AU AU2002346738A patent/AU2002346738A1/en not_active Abandoned
- 2002-05-31 JP JP2003502865A patent/JP2004528978A/ja active Pending
- 2002-05-31 DE DE60235458T patent/DE60235458D1/de not_active Expired - Lifetime
- 2002-05-31 CN CNA028133021A patent/CN1635949A/zh active Pending
- 2002-05-31 EP EP02739640A patent/EP1392449B1/en not_active Expired - Lifetime
- 2002-05-31 WO PCT/US2002/017375 patent/WO2002098573A1/en active Application Filing
- 2002-05-31 JP JP2003501604A patent/JP4342301B2/ja not_active Expired - Fee Related
- 2002-05-31 KR KR10-2003-7015754A patent/KR20040038915A/ko not_active Application Discontinuation
- 2002-05-31 CN CNB028111400A patent/CN1285420C/zh not_active Expired - Fee Related
- 2002-05-31 KR KR1020097020246A patent/KR100998171B1/ko active IP Right Grant
- 2002-05-31 CN CNB028111397A patent/CN1289207C/zh not_active Expired - Fee Related
- 2002-05-31 DE DE60238189T patent/DE60238189D1/de not_active Expired - Lifetime
- 2002-05-31 CN CNB028148231A patent/CN1280025C/zh not_active Expired - Fee Related
- 2002-05-31 EP EP02739639A patent/EP1399267B1/en not_active Expired - Lifetime
- 2002-05-31 AU AU2002346740A patent/AU2002346740A1/en not_active Abandoned
- 2002-05-31 AT AT02739639T patent/ATE486662T1/de not_active IP Right Cessation
- 2002-05-31 AT AT02739640T patent/ATE458555T1/de not_active IP Right Cessation
- 2002-05-31 WO PCT/US2002/017522 patent/WO2002099851A2/en not_active Application Discontinuation
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