ATE528976T1 - Jetting-einrichtung und verfahren in einer jetting-einrichtung - Google Patents
Jetting-einrichtung und verfahren in einer jetting-einrichtungInfo
- Publication number
- ATE528976T1 ATE528976T1 AT03733781T AT03733781T ATE528976T1 AT E528976 T1 ATE528976 T1 AT E528976T1 AT 03733781 T AT03733781 T AT 03733781T AT 03733781 T AT03733781 T AT 03733781T AT E528976 T1 ATE528976 T1 AT E528976T1
- Authority
- AT
- Austria
- Prior art keywords
- viscous medium
- droplets
- jetting
- adjusted
- nozzle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Percussion Or Vibration Massage (AREA)
- Treatment Of Fiber Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0202247A SE0202247D0 (sv) | 2002-07-18 | 2002-07-18 | Jetting device and method at a jetting device |
PCT/SE2003/001063 WO2004010753A1 (en) | 2002-07-18 | 2003-06-23 | Jetting device and method at a jetting device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE528976T1 true ATE528976T1 (de) | 2011-10-15 |
Family
ID=20288567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03733781T ATE528976T1 (de) | 2002-07-18 | 2003-06-23 | Jetting-einrichtung und verfahren in einer jetting-einrichtung |
Country Status (9)
Country | Link |
---|---|
US (2) | US7767266B2 (de) |
EP (1) | EP1552731B1 (de) |
JP (1) | JP4675105B2 (de) |
KR (1) | KR101065566B1 (de) |
CN (1) | CN100441070C (de) |
AT (1) | ATE528976T1 (de) |
AU (1) | AU2003239066A1 (de) |
SE (1) | SE0202247D0 (de) |
WO (1) | WO2004010753A1 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101356425B (zh) * | 2005-11-14 | 2011-01-26 | 麦德塔自动化股份有限公司 | 喷射装置和改善喷射装置性能的方法 |
US20070145164A1 (en) * | 2005-12-22 | 2007-06-28 | Nordson Corporation | Jetting dispenser with multiple jetting nozzle outlets |
US7980197B2 (en) * | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
CN101646502B (zh) * | 2007-03-08 | 2013-02-20 | 武藏工业株式会社 | 液滴排出装置及方法 |
GB0809876D0 (en) * | 2008-05-30 | 2008-07-09 | The Technology Partnership Plc | Spray generator |
US8757511B2 (en) | 2010-01-11 | 2014-06-24 | AdvanJet | Viscous non-contact jetting method and apparatus |
CN101811585B (zh) * | 2010-03-19 | 2011-08-17 | 天津群创科技发展有限公司 | 锡膏自动供给装置 |
JP5553795B2 (ja) * | 2010-05-21 | 2014-07-16 | Tdk株式会社 | 液体滴下装置 |
EP2632730B1 (de) * | 2010-10-27 | 2019-08-07 | Matthews International Corporation | Ventildüsendrucker mit einer trägen kolbenspitze |
JP5779353B2 (ja) | 2011-01-19 | 2015-09-16 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、塗布装置およびプログラム |
US9346075B2 (en) * | 2011-08-26 | 2016-05-24 | Nordson Corporation | Modular jetting devices |
US8708246B2 (en) | 2011-10-28 | 2014-04-29 | Nordson Corporation | Positive displacement dispenser and method for dispensing discrete amounts of liquid |
US9254642B2 (en) | 2012-01-19 | 2016-02-09 | AdvanJet | Control method and apparatus for dispensing high-quality drops of high-viscosity material |
CN102848042A (zh) * | 2012-07-25 | 2013-01-02 | 昆山微容电子企业有限公司 | 安规陶瓷电容器引线粘锡装置 |
DE102012109123A1 (de) | 2012-09-27 | 2014-03-27 | Vermes Microdispensing GmbH | Dosiersystem, Dosierverfahren und Herstellungsverfahren |
DE102012109124A1 (de) * | 2012-09-27 | 2014-03-27 | Vermes Microdispensing GmbH | Dosiersystem, Dosierverfahren und Herstellungsverfahren |
GB201222620D0 (en) * | 2012-12-14 | 2013-01-30 | Conpart As | Method of applying a conductive adhesive |
WO2014139568A1 (en) * | 2013-03-13 | 2014-09-18 | Micronic Mydata AB | Method and device for jetting droplets |
WO2014139569A1 (en) * | 2013-03-13 | 2014-09-18 | Micronic Mydata AB | Methods for jetting viscous medium on workpiece |
US9398697B2 (en) * | 2013-03-13 | 2016-07-19 | Mycronic AB | Methods and devices for jetting viscous medium on workpiece |
DE102013102693A1 (de) | 2013-03-15 | 2014-09-18 | Vermes Microdispensing GmbH | Dosierventil und Dosierverfahren |
DE202013101134U1 (de) | 2013-03-15 | 2014-06-17 | Vermes Microdispensing GmbH | Dosierventil |
KR102376975B1 (ko) * | 2013-03-15 | 2022-03-18 | 마이크로닉 아베 | 워크피스 상에 점성 매체를 분사하기 위한 장치 및 방법 |
US9808822B2 (en) | 2013-03-15 | 2017-11-07 | Mycronic AB | Methods and devices for jetting viscous medium on workpieces |
WO2015187385A1 (en) * | 2014-06-04 | 2015-12-10 | Boston Scientific Scimed, Inc. | Pressure sensing guidewire systems with reduced pressure offsets |
US10272463B2 (en) | 2014-08-28 | 2019-04-30 | Nordson Corporation | Non-impact jetting dispensing module and method |
JP2017535066A (ja) * | 2014-09-09 | 2017-11-24 | マイクロニック アーベーMycronic Ab | はんだペーストフラックスを塗布するための方法および装置 |
CN116651632A (zh) * | 2016-05-26 | 2023-08-29 | 迈康尼股份公司 | 用于通过位移测量来控制喷射分配的方法和设备 |
JP6935688B2 (ja) * | 2017-06-29 | 2021-09-15 | セイコーエプソン株式会社 | 液体吐出装置および液体吐出方法 |
TWI748116B (zh) * | 2017-08-08 | 2021-12-01 | 美商伊利諾工具工程公司 | 錫膏噴嘴、工作臺和加錫膏裝置 |
CN107716195A (zh) * | 2017-10-27 | 2018-02-23 | 肇庆市高新区晓靖科技有限公司 | 一种超声雾化喷枪 |
WO2019108508A1 (en) * | 2017-11-28 | 2019-06-06 | Nordson Corporation | Synchronous motion selective soldering apparatus and method |
US20190366460A1 (en) * | 2018-06-01 | 2019-12-05 | Progress Y&Y Corp. | Soldering apparatus and solder nozzle module thereof |
CN113226569B (zh) * | 2018-12-21 | 2023-06-20 | 迈康尼股份公司 | 控制喷射器的方法和相关系统 |
CN111215296B (zh) * | 2019-11-21 | 2020-11-27 | 绍兴市秀臻新能源科技有限公司 | 一种自动固定并可调节出料量的蓄电池极板涂膏装置 |
KR20220127920A (ko) * | 2020-01-28 | 2022-09-20 | 마이크로닉 아베 | 가요성 토출 노즐을 갖는 토출 장치들 |
US11446750B2 (en) | 2020-02-03 | 2022-09-20 | Io Tech Group Ltd. | Systems for printing solder paste and other viscous materials at high resolution |
US11622451B2 (en) | 2020-02-26 | 2023-04-04 | Io Tech Group Ltd. | Systems and methods for solder paste printing on components |
CN111359843B (zh) * | 2020-04-14 | 2021-08-13 | 姜伟 | 一种光学数位转换器点胶装置 |
US11497124B2 (en) | 2020-06-09 | 2022-11-08 | Io Tech Group Ltd. | Methods for printing conformal materials on component edges at high resolution |
US11691332B2 (en) | 2020-08-05 | 2023-07-04 | Io Tech Group Ltd. | Systems and methods for 3D printing with vacuum assisted laser printing machine |
EP4197786A1 (de) * | 2021-12-16 | 2023-06-21 | Quantica GmbH | Verfahren und system für selbstwartung und wiederherstellendes system für einen druckkopf |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4266232A (en) * | 1979-06-29 | 1981-05-05 | International Business Machines Corporation | Voltage modulated drop-on-demand ink jet method and apparatus |
US4721252A (en) * | 1985-02-22 | 1988-01-26 | Slautterback Corporation | Hot-melt sputtering apparatus |
JPH0449108A (ja) * | 1990-06-18 | 1992-02-18 | Iwashita Eng Kk | スクリュー式吐出装置 |
US5229016A (en) * | 1991-08-08 | 1993-07-20 | Microfab Technologies, Inc. | Method and apparatus for dispensing spherical-shaped quantities of liquid solder |
US5320250A (en) * | 1991-12-02 | 1994-06-14 | Asymptotic Technologies, Inc. | Method for rapid dispensing of minute quantities of viscous material |
JPH06174399A (ja) * | 1991-12-27 | 1994-06-24 | Nippon Oil & Fats Co Ltd | 爆薬装填装置 |
US5581286A (en) * | 1991-12-31 | 1996-12-03 | Compaq Computer Corporation | Multi-channel array actuation system for an ink jet printhead |
US5267986A (en) * | 1992-04-06 | 1993-12-07 | Self-Instill & Co., Inc. | Cartridge for applying medicament to an eye from a dispenser |
US5495270A (en) * | 1993-07-30 | 1996-02-27 | Tektronix, Inc. | Method and apparatus for producing dot size modulated ink jet printing |
GB9322203D0 (en) | 1993-10-28 | 1993-12-15 | Xaar Ltd | Droplet deposition apparatus |
EP0752294B1 (de) * | 1995-07-01 | 2000-06-21 | Esec Sa | Verfahren und Einrichtung zum Austragen von flüssigem Lot |
US5938102A (en) * | 1995-09-25 | 1999-08-17 | Muntz; Eric Phillip | High speed jet soldering system |
US5747102A (en) * | 1995-11-16 | 1998-05-05 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
JPH09181434A (ja) * | 1995-12-21 | 1997-07-11 | M & M Prod Kk | クリーム半田塗布装置 |
US6015083A (en) * | 1995-12-29 | 2000-01-18 | Microfab Technologies, Inc. | Direct solder bumping of hard to solder substrate |
US5756155A (en) * | 1996-01-22 | 1998-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Combination nozzle and vacuum hood that is self cleaning |
JP3289624B2 (ja) * | 1996-11-25 | 2002-06-10 | ミノルタ株式会社 | インクジェットヘッドの駆動装置 |
US5876615A (en) * | 1997-01-02 | 1999-03-02 | Hewlett-Packard Company | Molten solder drop ejector |
US6020905A (en) | 1997-01-24 | 2000-02-01 | Lexmark International, Inc. | Ink jet printhead for drop size modulation |
JPH1128410A (ja) * | 1997-07-14 | 1999-02-02 | Meruto Giken Kk | ホットメルト接着剤の溶融供給装置 |
US6029896A (en) * | 1997-09-30 | 2000-02-29 | Microfab Technologies, Inc. | Method of drop size modulation with extended transition time waveform |
SE513527C2 (sv) * | 1998-06-11 | 2000-09-25 | Mydata Automation Ab | Anordning och förfarande för utskjutning av små droppar |
US6305773B1 (en) | 1998-07-29 | 2001-10-23 | Xerox Corporation | Apparatus and method for drop size modulated ink jet printing |
JP4142800B2 (ja) * | 1999-04-07 | 2008-09-03 | 株式会社ルネサステクノロジ | バンプ形成装置及びバンプ形成方法 |
SE9901253D0 (sv) * | 1999-04-08 | 1999-04-08 | Mydata Automation Ab | Dispensing assembly |
US6589791B1 (en) * | 1999-05-20 | 2003-07-08 | Cartesian Technologies, Inc. | State-variable control system |
JP2001046940A (ja) * | 1999-08-06 | 2001-02-20 | Juki Corp | 塗布装置 |
JP2001113212A (ja) | 1999-10-20 | 2001-04-24 | Noiberuku Kk | 液体吐出装置 |
US6629739B2 (en) | 1999-12-17 | 2003-10-07 | Xerox Corporation | Apparatus and method for drop size switching in ink jet printing |
JP2001217529A (ja) * | 2000-02-04 | 2001-08-10 | Osaka Asahi Kagaku Kk | 電気的噴射制御方式によるフラックスの塗布方法と半田付け方法 |
US6520402B2 (en) * | 2000-05-22 | 2003-02-18 | The Regents Of The University Of California | High-speed direct writing with metallic microspheres |
JP2002021715A (ja) * | 2000-07-10 | 2002-01-23 | Matsushita Electric Ind Co Ltd | 流体供給装置及び流体供給方法 |
SE0003647D0 (sv) * | 2000-10-09 | 2000-10-09 | Mydata Automation Ab | Method, apparatus and use |
JP4681126B2 (ja) * | 2000-12-13 | 2011-05-11 | 富士機械製造株式会社 | 高粘性流体塗布装置 |
SE0101503D0 (sv) * | 2001-04-27 | 2001-04-27 | Mydata Automation Ab | Method device and use of the device |
JP4136477B2 (ja) * | 2001-06-16 | 2008-08-20 | 武蔵エンジニアリング株式会社 | 液体の定量吐出装置 |
SE0104210D0 (sv) | 2001-12-14 | 2001-12-14 | Mydata Automation Ab | Viscous medium feeder |
JP3979353B2 (ja) * | 2002-08-02 | 2007-09-19 | セイコーエプソン株式会社 | 塗布方法 |
SE0302985D0 (sv) * | 2003-11-13 | 2003-11-13 | Mydata Automation Ab | A method for generating a jetting program |
-
2002
- 2002-07-18 SE SE0202247A patent/SE0202247D0/xx unknown
-
2003
- 2003-06-23 AU AU2003239066A patent/AU2003239066A1/en not_active Abandoned
- 2003-06-23 US US10/521,566 patent/US7767266B2/en active Active
- 2003-06-23 KR KR1020057000716A patent/KR101065566B1/ko active IP Right Grant
- 2003-06-23 CN CNB038171554A patent/CN100441070C/zh not_active Expired - Lifetime
- 2003-06-23 EP EP03733781A patent/EP1552731B1/de not_active Expired - Lifetime
- 2003-06-23 WO PCT/SE2003/001063 patent/WO2004010753A1/en active Application Filing
- 2003-06-23 JP JP2004522878A patent/JP4675105B2/ja not_active Expired - Lifetime
- 2003-06-23 AT AT03733781T patent/ATE528976T1/de not_active IP Right Cessation
-
2010
- 2010-07-23 US US12/842,716 patent/US8215535B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR101065566B1 (ko) | 2011-09-19 |
CN100441070C (zh) | 2008-12-03 |
CN1669373A (zh) | 2005-09-14 |
EP1552731A1 (de) | 2005-07-13 |
US20050167519A1 (en) | 2005-08-04 |
KR20050019874A (ko) | 2005-03-03 |
AU2003239066A1 (en) | 2004-02-09 |
WO2004010753A1 (en) | 2004-01-29 |
JP2005532906A (ja) | 2005-11-04 |
US7767266B2 (en) | 2010-08-03 |
SE0202247D0 (sv) | 2002-07-18 |
JP4675105B2 (ja) | 2011-04-20 |
EP1552731B1 (de) | 2011-10-12 |
US20110017841A1 (en) | 2011-01-27 |
US8215535B2 (en) | 2012-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |