SE0202247D0 - Jetting device and method at a jetting device - Google Patents

Jetting device and method at a jetting device

Info

Publication number
SE0202247D0
SE0202247D0 SE0202247A SE0202247A SE0202247D0 SE 0202247 D0 SE0202247 D0 SE 0202247D0 SE 0202247 A SE0202247 A SE 0202247A SE 0202247 A SE0202247 A SE 0202247A SE 0202247 D0 SE0202247 D0 SE 0202247D0
Authority
SE
Sweden
Prior art keywords
viscous medium
droplets
jetting
adjusted
nozzle
Prior art date
Application number
SE0202247A
Other languages
English (en)
Swedish (sv)
Inventor
William Holm
Kenth Nilsson
Johan Berg
Johan Kronstedt
Haakan Sandell
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE0202247A priority Critical patent/SE0202247D0/xx
Publication of SE0202247D0 publication Critical patent/SE0202247D0/xx
Priority to CNB038171554A priority patent/CN100441070C/zh
Priority to KR1020057000716A priority patent/KR101065566B1/ko
Priority to AU2003239066A priority patent/AU2003239066A1/en
Priority to JP2004522878A priority patent/JP4675105B2/ja
Priority to EP03733781A priority patent/EP1552731B1/de
Priority to AT03733781T priority patent/ATE528976T1/de
Priority to US10/521,566 priority patent/US7767266B2/en
Priority to PCT/SE2003/001063 priority patent/WO2004010753A1/en
Priority to US12/842,716 priority patent/US8215535B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Percussion Or Vibration Massage (AREA)
  • Treatment Of Fiber Materials (AREA)
SE0202247A 2002-07-18 2002-07-18 Jetting device and method at a jetting device SE0202247D0 (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE0202247A SE0202247D0 (sv) 2002-07-18 2002-07-18 Jetting device and method at a jetting device
CNB038171554A CN100441070C (zh) 2002-07-18 2003-06-23 喷射装置和应用该喷射装置的方法
KR1020057000716A KR101065566B1 (ko) 2002-07-18 2003-06-23 분사 장치 및 분사 장치의 동작 방법
AU2003239066A AU2003239066A1 (en) 2002-07-18 2003-06-23 Jetting device and method at a jetting device
JP2004522878A JP4675105B2 (ja) 2002-07-18 2003-06-23 噴射装置及び噴射装置の方法
EP03733781A EP1552731B1 (de) 2002-07-18 2003-06-23 Jetting-einrichtung und verfahren in einer jetting-einrichtung
AT03733781T ATE528976T1 (de) 2002-07-18 2003-06-23 Jetting-einrichtung und verfahren in einer jetting-einrichtung
US10/521,566 US7767266B2 (en) 2002-07-18 2003-06-23 Jetting device and method at a jetting device
PCT/SE2003/001063 WO2004010753A1 (en) 2002-07-18 2003-06-23 Jetting device and method at a jetting device
US12/842,716 US8215535B2 (en) 2002-07-18 2010-07-23 Jetting device and method at a jetting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0202247A SE0202247D0 (sv) 2002-07-18 2002-07-18 Jetting device and method at a jetting device

Publications (1)

Publication Number Publication Date
SE0202247D0 true SE0202247D0 (sv) 2002-07-18

Family

ID=20288567

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0202247A SE0202247D0 (sv) 2002-07-18 2002-07-18 Jetting device and method at a jetting device

Country Status (9)

Country Link
US (2) US7767266B2 (de)
EP (1) EP1552731B1 (de)
JP (1) JP4675105B2 (de)
KR (1) KR101065566B1 (de)
CN (1) CN100441070C (de)
AT (1) ATE528976T1 (de)
AU (1) AU2003239066A1 (de)
SE (1) SE0202247D0 (de)
WO (1) WO2004010753A1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101356425B (zh) * 2005-11-14 2011-01-26 麦德塔自动化股份有限公司 喷射装置和改善喷射装置性能的方法
US20070145164A1 (en) * 2005-12-22 2007-06-28 Nordson Corporation Jetting dispenser with multiple jetting nozzle outlets
US7980197B2 (en) * 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
CN101646502B (zh) * 2007-03-08 2013-02-20 武藏工业株式会社 液滴排出装置及方法
GB0809876D0 (en) * 2008-05-30 2008-07-09 The Technology Partnership Plc Spray generator
US8757511B2 (en) 2010-01-11 2014-06-24 AdvanJet Viscous non-contact jetting method and apparatus
CN101811585B (zh) * 2010-03-19 2011-08-17 天津群创科技发展有限公司 锡膏自动供给装置
JP5553795B2 (ja) * 2010-05-21 2014-07-16 Ｔｄｋ株式会社 液体滴下装置
EP2632730B1 (de) * 2010-10-27 2019-08-07 Matthews International Corporation Ventildüsendrucker mit einer trägen kolbenspitze
JP5779353B2 (ja) 2011-01-19 2015-09-16 武蔵エンジニアリング株式会社 液体材料の塗布方法、塗布装置およびプログラム
US9346075B2 (en) * 2011-08-26 2016-05-24 Nordson Corporation Modular jetting devices
US8708246B2 (en) 2011-10-28 2014-04-29 Nordson Corporation Positive displacement dispenser and method for dispensing discrete amounts of liquid
US9254642B2 (en) 2012-01-19 2016-02-09 AdvanJet Control method and apparatus for dispensing high-quality drops of high-viscosity material
CN102848042A (zh) * 2012-07-25 2013-01-02 昆山微容电子企业有限公司 安规陶瓷电容器引线粘锡装置
DE102012109123A1 (de) 2012-09-27 2014-03-27 Vermes Microdispensing GmbH Dosiersystem, Dosierverfahren und Herstellungsverfahren
DE102012109124A1 (de) * 2012-09-27 2014-03-27 Vermes Microdispensing GmbH Dosiersystem, Dosierverfahren und Herstellungsverfahren
GB201222620D0 (en) * 2012-12-14 2013-01-30 Conpart As Method of applying a conductive adhesive
WO2014139568A1 (en) * 2013-03-13 2014-09-18 Micronic Mydata AB Method and device for jetting droplets
WO2014139569A1 (en) * 2013-03-13 2014-09-18 Micronic Mydata AB Methods for jetting viscous medium on workpiece
US9398697B2 (en) * 2013-03-13 2016-07-19 Mycronic AB Methods and devices for jetting viscous medium on workpiece
DE102013102693A1 (de) 2013-03-15 2014-09-18 Vermes Microdispensing GmbH Dosierventil und Dosierverfahren
DE202013101134U1 (de) 2013-03-15 2014-06-17 Vermes Microdispensing GmbH Dosierventil
KR102376975B1 (ko) * 2013-03-15 2022-03-18 마이크로닉 아베 워크피스 상에 점성 매체를 분사하기 위한 장치 및 방법
US9808822B2 (en) 2013-03-15 2017-11-07 Mycronic AB Methods and devices for jetting viscous medium on workpieces
WO2015187385A1 (en) * 2014-06-04 2015-12-10 Boston Scientific Scimed, Inc. Pressure sensing guidewire systems with reduced pressure offsets
US10272463B2 (en) 2014-08-28 2019-04-30 Nordson Corporation Non-impact jetting dispensing module and method
JP2017535066A (ja) * 2014-09-09 2017-11-24 マイクロニック アーベーＭｙｃｒｏｎｉｃ Ａｂ はんだペーストフラックスを塗布するための方法および装置
CN116651632A (zh) * 2016-05-26 2023-08-29 迈康尼股份公司 用于通过位移测量来控制喷射分配的方法和设备
JP6935688B2 (ja) * 2017-06-29 2021-09-15 セイコーエプソン株式会社 液体吐出装置および液体吐出方法
TWI748116B (zh) * 2017-08-08 2021-12-01 美商伊利諾工具工程公司 錫膏噴嘴、工作臺和加錫膏裝置
CN107716195A (zh) * 2017-10-27 2018-02-23 肇庆市高新区晓靖科技有限公司 一种超声雾化喷枪
WO2019108508A1 (en) * 2017-11-28 2019-06-06 Nordson Corporation Synchronous motion selective soldering apparatus and method
US20190366460A1 (en) * 2018-06-01 2019-12-05 Progress Y&Y Corp. Soldering apparatus and solder nozzle module thereof
CN113226569B (zh) * 2018-12-21 2023-06-20 迈康尼股份公司 控制喷射器的方法和相关系统
CN111215296B (zh) * 2019-11-21 2020-11-27 绍兴市秀臻新能源科技有限公司 一种自动固定并可调节出料量的蓄电池极板涂膏装置
KR20220127920A (ko) * 2020-01-28 2022-09-20 마이크로닉 아베 가요성 토출 노즐을 갖는 토출 장치들
US11446750B2 (en) 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
US11622451B2 (en) 2020-02-26 2023-04-04 Io Tech Group Ltd. Systems and methods for solder paste printing on components
CN111359843B (zh) * 2020-04-14 2021-08-13 姜伟 一种光学数位转换器点胶装置
US11497124B2 (en) 2020-06-09 2022-11-08 Io Tech Group Ltd. Methods for printing conformal materials on component edges at high resolution
US11691332B2 (en) 2020-08-05 2023-07-04 Io Tech Group Ltd. Systems and methods for 3D printing with vacuum assisted laser printing machine
EP4197786A1 (de) * 2021-12-16 2023-06-21 Quantica GmbH Verfahren und system für selbstwartung und wiederherstellendes system für einen druckkopf

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266232A (en) * 1979-06-29 1981-05-05 International Business Machines Corporation Voltage modulated drop-on-demand ink jet method and apparatus
US4721252A (en) * 1985-02-22 1988-01-26 Slautterback Corporation Hot-melt sputtering apparatus
JPH0449108A (ja) * 1990-06-18 1992-02-18 Iwashita Eng Kk スクリュー式吐出装置
US5229016A (en) * 1991-08-08 1993-07-20 Microfab Technologies, Inc. Method and apparatus for dispensing spherical-shaped quantities of liquid solder
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
JPH06174399A (ja) * 1991-12-27 1994-06-24 Nippon Oil & Fats Co Ltd 爆薬装填装置
US5581286A (en) * 1991-12-31 1996-12-03 Compaq Computer Corporation Multi-channel array actuation system for an ink jet printhead
US5267986A (en) * 1992-04-06 1993-12-07 Self-Instill & Co., Inc. Cartridge for applying medicament to an eye from a dispenser
US5495270A (en) * 1993-07-30 1996-02-27 Tektronix, Inc. Method and apparatus for producing dot size modulated ink jet printing
GB9322203D0 (en) 1993-10-28 1993-12-15 Xaar Ltd Droplet deposition apparatus
EP0752294B1 (de) * 1995-07-01 2000-06-21 Esec Sa Verfahren und Einrichtung zum Austragen von flüssigem Lot
US5938102A (en) * 1995-09-25 1999-08-17 Muntz; Eric Phillip High speed jet soldering system
US5747102A (en) * 1995-11-16 1998-05-05 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
JPH09181434A (ja) * 1995-12-21 1997-07-11 M & M Prod Kk クリーム半田塗布装置
US6015083A (en) * 1995-12-29 2000-01-18 Microfab Technologies, Inc. Direct solder bumping of hard to solder substrate
US5756155A (en) * 1996-01-22 1998-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Combination nozzle and vacuum hood that is self cleaning
JP3289624B2 (ja) * 1996-11-25 2002-06-10 ミノルタ株式会社 インクジェットヘッドの駆動装置
US5876615A (en) * 1997-01-02 1999-03-02 Hewlett-Packard Company Molten solder drop ejector
US6020905A (en) 1997-01-24 2000-02-01 Lexmark International, Inc. Ink jet printhead for drop size modulation
JPH1128410A (ja) * 1997-07-14 1999-02-02 Meruto Giken Kk ホットメルト接着剤の溶融供給装置
US6029896A (en) * 1997-09-30 2000-02-29 Microfab Technologies, Inc. Method of drop size modulation with extended transition time waveform
SE513527C2 (sv) * 1998-06-11 2000-09-25 Mydata Automation Ab Anordning och förfarande för utskjutning av små droppar
US6305773B1 (en) 1998-07-29 2001-10-23 Xerox Corporation Apparatus and method for drop size modulated ink jet printing
JP4142800B2 (ja) * 1999-04-07 2008-09-03 株式会社ルネサステクノロジ バンプ形成装置及びバンプ形成方法
SE9901253D0 (sv) * 1999-04-08 1999-04-08 Mydata Automation Ab Dispensing assembly
US6589791B1 (en) * 1999-05-20 2003-07-08 Cartesian Technologies, Inc. State-variable control system
JP2001046940A (ja) * 1999-08-06 2001-02-20 Juki Corp 塗布装置
JP2001113212A (ja) 1999-10-20 2001-04-24 Noiberuku Kk 液体吐出装置
US6629739B2 (en) 1999-12-17 2003-10-07 Xerox Corporation Apparatus and method for drop size switching in ink jet printing
JP2001217529A (ja) * 2000-02-04 2001-08-10 Osaka Asahi Kagaku Kk 電気的噴射制御方式によるフラックスの塗布方法と半田付け方法
US6520402B2 (en) * 2000-05-22 2003-02-18 The Regents Of The University Of California High-speed direct writing with metallic microspheres
JP2002021715A (ja) * 2000-07-10 2002-01-23 Matsushita Electric Ind Co Ltd 流体供給装置及び流体供給方法
SE0003647D0 (sv) * 2000-10-09 2000-10-09 Mydata Automation Ab Method, apparatus and use
JP4681126B2 (ja) * 2000-12-13 2011-05-11 富士機械製造株式会社 高粘性流体塗布装置
SE0101503D0 (sv) * 2001-04-27 2001-04-27 Mydata Automation Ab Method device and use of the device
JP4136477B2 (ja) * 2001-06-16 2008-08-20 武蔵エンジニアリング株式会社 液体の定量吐出装置
SE0104210D0 (sv) 2001-12-14 2001-12-14 Mydata Automation Ab Viscous medium feeder
JP3979353B2 (ja) * 2002-08-02 2007-09-19 セイコーエプソン株式会社 塗布方法
SE0302985D0 (sv) * 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program

Also Published As

Publication number Publication date
KR101065566B1 (ko) 2011-09-19
CN100441070C (zh) 2008-12-03
CN1669373A (zh) 2005-09-14
EP1552731A1 (de) 2005-07-13
US20050167519A1 (en) 2005-08-04
KR20050019874A (ko) 2005-03-03
AU2003239066A1 (en) 2004-02-09
WO2004010753A1 (en) 2004-01-29
JP2005532906A (ja) 2005-11-04
US7767266B2 (en) 2010-08-03
JP4675105B2 (ja) 2011-04-20
ATE528976T1 (de) 2011-10-15
EP1552731B1 (de) 2011-10-12
US20110017841A1 (en) 2011-01-27
US8215535B2 (en) 2012-07-10

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