SE0202247D0 - Jetting device and method at a jetting device - Google Patents
Jetting device and method at a jetting deviceInfo
- Publication number
- SE0202247D0 SE0202247D0 SE0202247A SE0202247A SE0202247D0 SE 0202247 D0 SE0202247 D0 SE 0202247D0 SE 0202247 A SE0202247 A SE 0202247A SE 0202247 A SE0202247 A SE 0202247A SE 0202247 D0 SE0202247 D0 SE 0202247D0
- Authority
- SE
- Sweden
- Prior art keywords
- viscous medium
- droplets
- jetting
- adjusted
- nozzle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Percussion Or Vibration Massage (AREA)
- Treatment Of Fiber Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0202247A SE0202247D0 (sv) | 2002-07-18 | 2002-07-18 | Jetting device and method at a jetting device |
JP2004522878A JP4675105B2 (ja) | 2002-07-18 | 2003-06-23 | 噴射装置及び噴射装置の方法 |
KR1020057000716A KR101065566B1 (ko) | 2002-07-18 | 2003-06-23 | 분사 장치 및 분사 장치의 동작 방법 |
EP03733781A EP1552731B1 (en) | 2002-07-18 | 2003-06-23 | Jetting device and method at a jetting device |
CNB038171554A CN100441070C (zh) | 2002-07-18 | 2003-06-23 | 喷射装置和应用该喷射装置的方法 |
AT03733781T ATE528976T1 (de) | 2002-07-18 | 2003-06-23 | Jetting-einrichtung und verfahren in einer jetting-einrichtung |
US10/521,566 US7767266B2 (en) | 2002-07-18 | 2003-06-23 | Jetting device and method at a jetting device |
PCT/SE2003/001063 WO2004010753A1 (en) | 2002-07-18 | 2003-06-23 | Jetting device and method at a jetting device |
AU2003239066A AU2003239066A1 (en) | 2002-07-18 | 2003-06-23 | Jetting device and method at a jetting device |
US12/842,716 US8215535B2 (en) | 2002-07-18 | 2010-07-23 | Jetting device and method at a jetting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0202247A SE0202247D0 (sv) | 2002-07-18 | 2002-07-18 | Jetting device and method at a jetting device |
Publications (1)
Publication Number | Publication Date |
---|---|
SE0202247D0 true SE0202247D0 (sv) | 2002-07-18 |
Family
ID=20288567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0202247A SE0202247D0 (sv) | 2002-07-18 | 2002-07-18 | Jetting device and method at a jetting device |
Country Status (9)
Country | Link |
---|---|
US (2) | US7767266B2 (xx) |
EP (1) | EP1552731B1 (xx) |
JP (1) | JP4675105B2 (xx) |
KR (1) | KR101065566B1 (xx) |
CN (1) | CN100441070C (xx) |
AT (1) | ATE528976T1 (xx) |
AU (1) | AU2003239066A1 (xx) |
SE (1) | SE0202247D0 (xx) |
WO (1) | WO2004010753A1 (xx) |
Families Citing this family (43)
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EP1952099A1 (en) * | 2005-11-14 | 2008-08-06 | Mydata Automation AB | A jetting apparatus and method of improving the performance of a jetting apparatus |
US20070145164A1 (en) * | 2005-12-22 | 2007-06-28 | Nordson Corporation | Jetting dispenser with multiple jetting nozzle outlets |
US7980197B2 (en) * | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
KR101600432B1 (ko) * | 2007-03-08 | 2016-03-08 | 무사시 엔지니어링 가부시키가이샤 | 액적 토출 장치 및 방법 |
GB0809876D0 (en) * | 2008-05-30 | 2008-07-09 | The Technology Partnership Plc | Spray generator |
US8757511B2 (en) | 2010-01-11 | 2014-06-24 | AdvanJet | Viscous non-contact jetting method and apparatus |
CN101811585B (zh) * | 2010-03-19 | 2011-08-17 | 天津群创科技发展有限公司 | 锡膏自动供给装置 |
JP5553795B2 (ja) * | 2010-05-21 | 2014-07-16 | Tdk株式会社 | 液体滴下装置 |
WO2012058373A2 (en) * | 2010-10-27 | 2012-05-03 | Matthews Resources, Inc. | Valve jet printer with inert plunger tip |
JP5779353B2 (ja) * | 2011-01-19 | 2015-09-16 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、塗布装置およびプログラム |
US9346075B2 (en) | 2011-08-26 | 2016-05-24 | Nordson Corporation | Modular jetting devices |
US8708246B2 (en) | 2011-10-28 | 2014-04-29 | Nordson Corporation | Positive displacement dispenser and method for dispensing discrete amounts of liquid |
US9254642B2 (en) | 2012-01-19 | 2016-02-09 | AdvanJet | Control method and apparatus for dispensing high-quality drops of high-viscosity material |
CN102848042A (zh) * | 2012-07-25 | 2013-01-02 | 昆山微容电子企业有限公司 | 安规陶瓷电容器引线粘锡装置 |
DE102012109123A1 (de) | 2012-09-27 | 2014-03-27 | Vermes Microdispensing GmbH | Dosiersystem, Dosierverfahren und Herstellungsverfahren |
DE102012109124A1 (de) * | 2012-09-27 | 2014-03-27 | Vermes Microdispensing GmbH | Dosiersystem, Dosierverfahren und Herstellungsverfahren |
GB201222620D0 (en) * | 2012-12-14 | 2013-01-30 | Conpart As | Method of applying a conductive adhesive |
CN105189004B (zh) * | 2013-03-13 | 2018-01-05 | 麦克罗尼克迈达塔有限责任公司 | 将粘性介质喷射在工件上的方法 |
US9398697B2 (en) * | 2013-03-13 | 2016-07-19 | Mycronic AB | Methods and devices for jetting viscous medium on workpiece |
JP6412025B2 (ja) * | 2013-03-13 | 2018-10-24 | マイクロニック アーベーMycronic Ab | 液滴噴射方法及び液滴噴射装置 |
DE202013101134U1 (de) | 2013-03-15 | 2014-06-17 | Vermes Microdispensing GmbH | Dosierventil |
CN105188957B (zh) * | 2013-03-15 | 2018-04-06 | 麦克罗尼克迈达塔有限责任公司 | 用于将粘性介质喷射在工件上的方法和装置 |
DE102013102693A1 (de) | 2013-03-15 | 2014-09-18 | Vermes Microdispensing GmbH | Dosierventil und Dosierverfahren |
US9808822B2 (en) | 2013-03-15 | 2017-11-07 | Mycronic AB | Methods and devices for jetting viscous medium on workpieces |
WO2015187385A1 (en) * | 2014-06-04 | 2015-12-10 | Boston Scientific Scimed, Inc. | Pressure sensing guidewire systems with reduced pressure offsets |
WO2016032746A1 (en) | 2014-08-28 | 2016-03-03 | Nordson Corporation | Non-impact jetting dispensing module and method |
KR20170092529A (ko) * | 2014-09-09 | 2017-08-11 | 마이크로닉 아베 | 솔더 페이스트 플럭스를 도포하기 위한 방법 및 디바이스 |
CN116651632A (zh) * | 2016-05-26 | 2023-08-29 | 迈康尼股份公司 | 用于通过位移测量来控制喷射分配的方法和设备 |
JP6935688B2 (ja) * | 2017-06-29 | 2021-09-15 | セイコーエプソン株式会社 | 液体吐出装置および液体吐出方法 |
TWI748116B (zh) * | 2017-08-08 | 2021-12-01 | 美商伊利諾工具工程公司 | 錫膏噴嘴、工作臺和加錫膏裝置 |
CN107716195A (zh) * | 2017-10-27 | 2018-02-23 | 肇庆市高新区晓靖科技有限公司 | 一种超声雾化喷枪 |
CN111356550A (zh) * | 2017-11-28 | 2020-06-30 | 诺信公司 | 同步运动选择性焊接装置和方法 |
US20190366460A1 (en) * | 2018-06-01 | 2019-12-05 | Progress Y&Y Corp. | Soldering apparatus and solder nozzle module thereof |
CN113226569B (zh) * | 2018-12-21 | 2023-06-20 | 迈康尼股份公司 | 控制喷射器的方法和相关系统 |
WO2020222090A1 (en) | 2019-05-01 | 2020-11-05 | Io Tech Group Ltd. | Method to electrically connect chip with top connectors using 3d printing |
CN111215296B (zh) * | 2019-11-21 | 2020-11-27 | 绍兴市秀臻新能源科技有限公司 | 一种自动固定并可调节出料量的蓄电池极板涂膏装置 |
CN114945429B (zh) * | 2020-01-28 | 2024-09-03 | 迈康尼股份公司 | 具有柔性喷嘴的喷射装置 |
US11446750B2 (en) | 2020-02-03 | 2022-09-20 | Io Tech Group Ltd. | Systems for printing solder paste and other viscous materials at high resolution |
US11622451B2 (en) | 2020-02-26 | 2023-04-04 | Io Tech Group Ltd. | Systems and methods for solder paste printing on components |
CN111359843B (zh) * | 2020-04-14 | 2021-08-13 | 姜伟 | 一种光学数位转换器点胶装置 |
US11497124B2 (en) | 2020-06-09 | 2022-11-08 | Io Tech Group Ltd. | Methods for printing conformal materials on component edges at high resolution |
US11691332B2 (en) | 2020-08-05 | 2023-07-04 | Io Tech Group Ltd. | Systems and methods for 3D printing with vacuum assisted laser printing machine |
EP4197786A1 (en) * | 2021-12-16 | 2023-06-21 | Quantica GmbH | Method and system for a self-maintenance and recovery system for a printhead |
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US4266232A (en) * | 1979-06-29 | 1981-05-05 | International Business Machines Corporation | Voltage modulated drop-on-demand ink jet method and apparatus |
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JPH0449108A (ja) * | 1990-06-18 | 1992-02-18 | Iwashita Eng Kk | スクリュー式吐出装置 |
US5229016A (en) * | 1991-08-08 | 1993-07-20 | Microfab Technologies, Inc. | Method and apparatus for dispensing spherical-shaped quantities of liquid solder |
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JP2001217529A (ja) | 2000-02-04 | 2001-08-10 | Osaka Asahi Kagaku Kk | 電気的噴射制御方式によるフラックスの塗布方法と半田付け方法 |
US6520402B2 (en) * | 2000-05-22 | 2003-02-18 | The Regents Of The University Of California | High-speed direct writing with metallic microspheres |
JP2002021715A (ja) * | 2000-07-10 | 2002-01-23 | Matsushita Electric Ind Co Ltd | 流体供給装置及び流体供給方法 |
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JP4681126B2 (ja) * | 2000-12-13 | 2011-05-11 | 富士機械製造株式会社 | 高粘性流体塗布装置 |
SE0101503D0 (sv) * | 2001-04-27 | 2001-04-27 | Mydata Automation Ab | Method device and use of the device |
JP4136477B2 (ja) * | 2001-06-16 | 2008-08-20 | 武蔵エンジニアリング株式会社 | 液体の定量吐出装置 |
SE0104210D0 (sv) | 2001-12-14 | 2001-12-14 | Mydata Automation Ab | Viscous medium feeder |
JP3979353B2 (ja) * | 2002-08-02 | 2007-09-19 | セイコーエプソン株式会社 | 塗布方法 |
SE0302985D0 (sv) * | 2003-11-13 | 2003-11-13 | Mydata Automation Ab | A method for generating a jetting program |
-
2002
- 2002-07-18 SE SE0202247A patent/SE0202247D0/xx unknown
-
2003
- 2003-06-23 AT AT03733781T patent/ATE528976T1/de not_active IP Right Cessation
- 2003-06-23 JP JP2004522878A patent/JP4675105B2/ja not_active Expired - Lifetime
- 2003-06-23 US US10/521,566 patent/US7767266B2/en active Active
- 2003-06-23 WO PCT/SE2003/001063 patent/WO2004010753A1/en active Application Filing
- 2003-06-23 EP EP03733781A patent/EP1552731B1/en not_active Expired - Lifetime
- 2003-06-23 AU AU2003239066A patent/AU2003239066A1/en not_active Abandoned
- 2003-06-23 CN CNB038171554A patent/CN100441070C/zh not_active Expired - Lifetime
- 2003-06-23 KR KR1020057000716A patent/KR101065566B1/ko active IP Right Grant
-
2010
- 2010-07-23 US US12/842,716 patent/US8215535B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7767266B2 (en) | 2010-08-03 |
US8215535B2 (en) | 2012-07-10 |
ATE528976T1 (de) | 2011-10-15 |
AU2003239066A1 (en) | 2004-02-09 |
EP1552731B1 (en) | 2011-10-12 |
CN1669373A (zh) | 2005-09-14 |
US20110017841A1 (en) | 2011-01-27 |
KR20050019874A (ko) | 2005-03-03 |
JP2005532906A (ja) | 2005-11-04 |
WO2004010753A1 (en) | 2004-01-29 |
KR101065566B1 (ko) | 2011-09-19 |
EP1552731A1 (en) | 2005-07-13 |
US20050167519A1 (en) | 2005-08-04 |
CN100441070C (zh) | 2008-12-03 |
JP4675105B2 (ja) | 2011-04-20 |
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