KR100891066B1 - 미세 전자 접속체, 미세 전자 접속체의 제조 방법, 반도체 장치 및 접속 구조물 - Google Patents

미세 전자 접속체, 미세 전자 접속체의 제조 방법, 반도체 장치 및 접속 구조물 Download PDF

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KR100891066B1
KR100891066B1 KR1020057019047A KR20057019047A KR100891066B1 KR 100891066 B1 KR100891066 B1 KR 100891066B1 KR 1020057019047 A KR1020057019047 A KR 1020057019047A KR 20057019047 A KR20057019047 A KR 20057019047A KR 100891066 B1 KR100891066 B1 KR 100891066B1
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substrate
trace
compliant pad
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KR20050118723A (ko
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이고르 케이. 칸드로스
찰스 에이. 밀러
스튜어트 더블유. 웬젤
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폼팩터, 인크.
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Multi-Conductor Connections (AREA)
  • Connecting Device With Holders (AREA)
KR1020057019047A 2003-04-10 2004-04-12 미세 전자 접속체, 미세 전자 접속체의 제조 방법, 반도체 장치 및 접속 구조물 Expired - Fee Related KR100891066B1 (ko)

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US20040201074A1 (en) 2004-10-14
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WO2004093164A2 (en) 2004-10-28
CN101256973A (zh) 2008-09-03
US20060138677A1 (en) 2006-06-29
EP1616353A2 (en) 2006-01-18
TW200503206A (en) 2005-01-16
CN101256973B (zh) 2010-11-10
CN1802743A (zh) 2006-07-12
WO2004093164A3 (en) 2005-02-17

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