JP2006525672A - 層状の超小型電子コンタクトおよびその製造方法 - Google Patents

層状の超小型電子コンタクトおよびその製造方法 Download PDF

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JP2006525672A
JP2006525672A JP2006509900A JP2006509900A JP2006525672A JP 2006525672 A JP2006525672 A JP 2006525672A JP 2006509900 A JP2006509900 A JP 2006509900A JP 2006509900 A JP2006509900 A JP 2006509900A JP 2006525672 A JP2006525672 A JP 2006525672A
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substrate
contact
trace
plastic pad
pad
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JP2006525672A5 (enExample
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イゴール ケー. カンドロス,
チャールズ エー. ミラー,
スチュアート ダブリュー. ウェンツェル,
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フォームファクター, インコーポレイテッド
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/4007Surface contacts, e.g. bumps
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    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Multi-Conductor Connections (AREA)
  • Connecting Device With Holders (AREA)
JP2006509900A 2003-04-10 2004-04-12 層状の超小型電子コンタクトおよびその製造方法 Pending JP2006525672A (ja)

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WO2004093164A3 (en) 2005-02-17
EP1616353A2 (en) 2006-01-18
US20040201074A1 (en) 2004-10-14
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