JP2006525672A5 - - Google Patents

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Publication number
JP2006525672A5
JP2006525672A5 JP2006509900A JP2006509900A JP2006525672A5 JP 2006525672 A5 JP2006525672 A5 JP 2006525672A5 JP 2006509900 A JP2006509900 A JP 2006509900A JP 2006509900 A JP2006509900 A JP 2006509900A JP 2006525672 A5 JP2006525672 A5 JP 2006525672A5
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JP
Japan
Prior art keywords
substrate
trace
plastic pad
contact
microelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006509900A
Other languages
English (en)
Japanese (ja)
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JP2006525672A (ja
Filing date
Publication date
Priority claimed from US10/410,948 external-priority patent/US7005751B2/en
Application filed filed Critical
Publication of JP2006525672A publication Critical patent/JP2006525672A/ja
Publication of JP2006525672A5 publication Critical patent/JP2006525672A5/ja
Pending legal-status Critical Current

Links

JP2006509900A 2003-04-10 2004-04-12 層状の超小型電子コンタクトおよびその製造方法 Pending JP2006525672A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/410,948 US7005751B2 (en) 2003-04-10 2003-04-10 Layered microelectronic contact and method for fabricating same
PCT/US2004/011116 WO2004093164A2 (en) 2003-04-10 2004-04-12 Layered microelectronic contact and method for fabricating same

Publications (2)

Publication Number Publication Date
JP2006525672A JP2006525672A (ja) 2006-11-09
JP2006525672A5 true JP2006525672A5 (enExample) 2007-05-31

Family

ID=33130885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006509900A Pending JP2006525672A (ja) 2003-04-10 2004-04-12 層状の超小型電子コンタクトおよびその製造方法

Country Status (7)

Country Link
US (2) US7005751B2 (enExample)
EP (1) EP1616353A2 (enExample)
JP (1) JP2006525672A (enExample)
KR (1) KR100891066B1 (enExample)
CN (2) CN1802743A (enExample)
TW (1) TW200503206A (enExample)
WO (1) WO2004093164A2 (enExample)

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JP5462732B2 (ja) * 2010-06-29 2014-04-02 モレックス インコーポレイテド シート状コネクタ、及びその製造方法
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US9887162B2 (en) 2013-12-18 2018-02-06 Taiwan Semiconductor Manufacturing Company, Ltd. Molding structure for wafer level package
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