KR100890503B1 - 예비 토출장치 - Google Patents

예비 토출장치 Download PDF

Info

Publication number
KR100890503B1
KR100890503B1 KR1020070083177A KR20070083177A KR100890503B1 KR 100890503 B1 KR100890503 B1 KR 100890503B1 KR 1020070083177 A KR1020070083177 A KR 1020070083177A KR 20070083177 A KR20070083177 A KR 20070083177A KR 100890503 B1 KR100890503 B1 KR 100890503B1
Authority
KR
South Korea
Prior art keywords
cleaning liquid
liquid
tank
squeegee
priming roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020070083177A
Other languages
English (en)
Korean (ko)
Other versions
KR20080019165A (ko
Inventor
가즈노부 야마구치
신지 다카세
아쯔오 가지마
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20080019165A publication Critical patent/KR20080019165A/ko
Application granted granted Critical
Publication of KR100890503B1 publication Critical patent/KR100890503B1/ko
Assigned to 아이메카테크 가부시키가이샤 reassignment 아이메카테크 가부시키가이샤 권리의 전부이전등록 Assignors: 도쿄 오카 고교 가부시키가이샤
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Coating Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
KR1020070083177A 2006-08-22 2007-08-20 예비 토출장치 Active KR100890503B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00225550 2006-08-22
JP2006225550A JP2008049226A (ja) 2006-08-22 2006-08-22 予備吐出装置

Publications (2)

Publication Number Publication Date
KR20080019165A KR20080019165A (ko) 2008-03-03
KR100890503B1 true KR100890503B1 (ko) 2009-03-26

Family

ID=39127682

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070083177A Active KR100890503B1 (ko) 2006-08-22 2007-08-20 예비 토출장치

Country Status (4)

Country Link
JP (1) JP2008049226A (cg-RX-API-DMAC10.html)
KR (1) KR100890503B1 (cg-RX-API-DMAC10.html)
CN (1) CN101130185A (cg-RX-API-DMAC10.html)
TW (1) TW200810842A (cg-RX-API-DMAC10.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101333395B1 (ko) * 2009-03-30 2013-11-28 도요타지도샤가부시키가이샤 도포 시공 다이 및 그것을 구비하는 도포 시공 장치
KR101062208B1 (ko) 2009-04-29 2011-09-05 주식회사 디지아이 프린터 헤드용 검사 장치
JP5154510B2 (ja) * 2009-06-05 2013-02-27 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
JP5121778B2 (ja) * 2009-06-26 2013-01-16 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
CN102707585A (zh) * 2011-11-25 2012-10-03 京东方科技集团股份有限公司 光刻胶回收系统
JP6127571B2 (ja) * 2013-02-20 2017-05-17 凸版印刷株式会社 凸版印刷装置及び有機ｅｌ素子の製造方法
CN103645607B (zh) * 2013-12-19 2016-09-07 合肥京东方光电科技有限公司 涂胶系统
CN106423755B (zh) * 2016-11-22 2019-06-25 京东方科技集团股份有限公司 涂布设备、利用其回收涂布液的方法及其清洁方法
JP7131149B2 (ja) * 2018-07-11 2022-09-06 京セラドキュメントソリューションズ株式会社 インクジェット記録装置
CN109365210B (zh) * 2018-11-29 2024-04-02 江苏远华轻化装备有限公司 一种快速定位调节的刮刀机构
CN113457917A (zh) * 2021-06-30 2021-10-01 无锡极电光能科技有限公司 涂布设备及利用该设备制备钙钛矿吸光薄膜的方法
CN114146873B (zh) * 2021-12-06 2023-02-24 中铜(昆明)铜业有限公司 一种防蜡液回流的scr连铸连轧生产线线杆涂蜡器
CN114712928B (zh) * 2022-03-23 2023-07-25 广西金茂钛业股份有限公司 一种用于处理钛白粉生产副产物的转鼓过滤机及使用方法
CN117983479A (zh) * 2024-03-01 2024-05-07 大阳(苏州)智能装备科技有限公司 用于涂布机的预涂清洗机构及其使用方法
CN118122576B (zh) * 2024-05-07 2024-08-16 德沪涂膜设备(苏州)有限公司 一种预涂布装置以及预涂布检测方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004121980A (ja) * 2002-10-02 2004-04-22 Toppan Printing Co Ltd 予備吐出装置および方法
KR20040041012A (ko) * 2002-11-07 2004-05-13 도쿄 오카 고교 가부시키가이샤 슬릿 코팅기의 예비 토출장치
KR20060047990A (ko) * 2004-05-20 2006-05-18 도쿄 오카 고교 가부시키가이샤 슬릿 코터의 예비 토출장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004121980A (ja) * 2002-10-02 2004-04-22 Toppan Printing Co Ltd 予備吐出装置および方法
KR20040041012A (ko) * 2002-11-07 2004-05-13 도쿄 오카 고교 가부시키가이샤 슬릿 코팅기의 예비 토출장치
KR20060047990A (ko) * 2004-05-20 2006-05-18 도쿄 오카 고교 가부시키가이샤 슬릿 코터의 예비 토출장치

Also Published As

Publication number Publication date
TW200810842A (en) 2008-03-01
TWI327488B (cg-RX-API-DMAC10.html) 2010-07-21
KR20080019165A (ko) 2008-03-03
CN101130185A (zh) 2008-02-27
JP2008049226A (ja) 2008-03-06

Similar Documents

Publication Publication Date Title
KR20080019165A (ko) 예비 토출장치
JP3597639B2 (ja) 基板処理装置および基板処理方法
KR100850122B1 (ko) 패널 세정기 및 세정 방법
JP6527674B2 (ja) 基板処理装置、ノズルおよび基板処理方法
JP4526288B2 (ja) スリットノズル先端の調整装置及び調整方法
KR100908361B1 (ko) 토출 노즐의 세정장치
KR20040041012A (ko) 슬릿 코팅기의 예비 토출장치
JP2006187763A (ja) スリットコーター及びこれを利用した液晶表示装置の製造方法
KR100756811B1 (ko) 토출 노즐의 세정장치
CN101927231B (zh) 启动加注处理方法以及启动加注处理装置
KR20030011463A (ko) 슬릿 코터의 예비토출장치 및 예비토출방법
KR20100028750A (ko) 약액 예비토출장치
KR20090108857A (ko) 기판세정장치 및 이를 구비한 기판세정시스템
KR100685919B1 (ko) 세정 장치
JP3631180B2 (ja) フォトレジスト塗布方法及びヘッド洗浄機構並びに塗布装置
CN111801170A (zh) 涂布用喷嘴的清扫装置
KR101253499B1 (ko) 약액 도포모듈 및 이를 이용한 약액 도포장치
KR100687505B1 (ko) 슬릿코터의 예비토출장치
CN118629894B (zh) 狭缝喷嘴、基板处理装置及基板处理方法
JP2008227195A (ja) 液処理装置
CN118616274B (zh) 狭缝喷嘴及基板处理装置
JP3447890B2 (ja) 基板処理装置
JP2002273285A (ja) 液滴塗布装置のワイピング装置
JPH058604Y2 (cg-RX-API-DMAC10.html)
JP3666983B2 (ja) 基板処理装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20130227

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20140220

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20150224

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20160218

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20170220

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20180219

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20200218

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000