KR100881466B1 - 취성재료 기판의 절단방법 및 기판절단 시스템 - Google Patents

취성재료 기판의 절단방법 및 기판절단 시스템 Download PDF

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Publication number
KR100881466B1
KR100881466B1 KR1020077015225A KR20077015225A KR100881466B1 KR 100881466 B1 KR100881466 B1 KR 100881466B1 KR 1020077015225 A KR1020077015225 A KR 1020077015225A KR 20077015225 A KR20077015225 A KR 20077015225A KR 100881466 B1 KR100881466 B1 KR 100881466B1
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South Korea
Prior art keywords
scribe line
substrate
laser beam
scribe
brake
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Expired - Fee Related
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KR1020077015225A
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English (en)
Korean (ko)
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KR20070094756A (ko
Inventor
쓰토무 우에노
겐지 오토다
고지 야마모토
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미쓰보시 다이야몬도 고교 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0614—Marking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
KR1020077015225A 2004-12-28 2005-12-27 취성재료 기판의 절단방법 및 기판절단 시스템 Expired - Fee Related KR100881466B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00381259 2004-12-28
JP2004381259 2004-12-28

Publications (2)

Publication Number Publication Date
KR20070094756A KR20070094756A (ko) 2007-09-21
KR100881466B1 true KR100881466B1 (ko) 2009-02-06

Family

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Family Applications (1)

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KR1020077015225A Expired - Fee Related KR100881466B1 (ko) 2004-12-28 2005-12-27 취성재료 기판의 절단방법 및 기판절단 시스템

Country Status (7)

Country Link
US (1) US20080305615A1 (https=)
EP (1) EP1862280A1 (https=)
JP (1) JP4666391B2 (https=)
KR (1) KR100881466B1 (https=)
CN (1) CN101087678A (https=)
TW (1) TW200633808A (https=)
WO (1) WO2006070825A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102216298B1 (ko) * 2020-04-28 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비
KR102216294B1 (ko) * 2020-07-22 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비
WO2021221378A1 (ko) * 2020-04-28 2021-11-04 주식회사 아이티아이 세라믹 절단법 및 장비

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8780343B2 (en) 2006-07-28 2014-07-15 Alliance For Sustainable Energy, Llc Wafer screening device and methods for wafer screening
US8006566B2 (en) * 2006-07-28 2011-08-30 Alliance For Sustainable Energy, Llc Screening of silicon wafers used in photovoltaics
JP5102557B2 (ja) * 2007-08-09 2012-12-19 三星ダイヤモンド工業株式会社 サファイア基板の分断方法
KR100949152B1 (ko) 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
JP5090897B2 (ja) * 2007-12-28 2012-12-05 株式会社ディスコ ウェーハの分割方法
KR100890764B1 (ko) 2008-01-25 2009-03-26 삼성코닝정밀유리 주식회사 가공 테이블 일체형 유리 기판 브레이킹 장치
CN101530951B (zh) * 2008-03-13 2012-03-14 富士迈半导体精密工业（上海）有限公司 激光切割脆性基板的方法及脆性基板
JP5170668B2 (ja) * 2008-06-04 2013-03-27 株式会社ジャパンディスプレイセントラル 基板装置およびその製造方法
JP2009294461A (ja) * 2008-06-05 2009-12-17 Toshiba Mobile Display Co Ltd 液晶表示装置及びその製造方法
JP5127669B2 (ja) * 2008-10-31 2013-01-23 パナソニック株式会社 半導体ウェハ
KR101041137B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR20100107253A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
CN102741179B (zh) * 2009-11-30 2015-11-25 康宁股份有限公司 用于激光刻划和分割玻璃基板的方法
US20110127242A1 (en) * 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates
JP5129826B2 (ja) * 2010-02-05 2013-01-30 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP5210356B2 (ja) * 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
DE102010032029B4 (de) * 2010-07-21 2012-09-13 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen einer runden Planplatte aus sprödbrüchigem Material in mehrere rechteckige Einzelplatten mittels Laser
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
JP5202595B2 (ja) * 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
US9527158B2 (en) * 2011-07-29 2016-12-27 Ats Automation Tooling Systems Inc. Systems and methods for producing silicon slim rods
JP5353978B2 (ja) * 2011-09-05 2013-11-27 三星ダイヤモンド工業株式会社 分断装置
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法
US8677783B2 (en) * 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
JP6047874B2 (ja) * 2011-12-06 2016-12-21 三菱電機株式会社 半導体装置の製造方法
JP2013136074A (ja) * 2011-12-28 2013-07-11 Mitsuboshi Diamond Industrial Co Ltd 分断装置、被加工物の分断方法、および光学素子パターン付き基板の分断方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
JP6206406B2 (ja) * 2012-06-28 2017-10-04 旭硝子株式会社 ガラス基板の切断方法及びガラス基板の製造方法
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US20140084039A1 (en) * 2012-09-24 2014-03-27 Electro Scientific Industries, Inc. Method and apparatus for separating workpieces
JP6035127B2 (ja) * 2012-11-29 2016-11-30 三星ダイヤモンド工業株式会社 レーザ加工方法及びレーザ加工装置
WO2015018425A1 (de) 2013-08-07 2015-02-12 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum bearbeiten eines plattenartigen werkstückes mit einer transparenten, gläsernen, glasartigen, keramischen und/oder kristallinen lage, trennvorrichtung für ein derartiges werkstück sowie produkt aus einem derartigen werkstück
JP2015050953A (ja) * 2013-09-06 2015-03-19 ブロードビュー株式会社 海苔レーザー加工装置及び海苔レーザー加工方法
US9154138B2 (en) * 2013-10-11 2015-10-06 Palo Alto Research Center Incorporated Stressed substrates for transient electronic systems
KR101484091B1 (ko) * 2013-11-04 2015-01-19 코닝정밀소재 주식회사 강화유리 절단방법 및 강화유리 절단장치
KR101536983B1 (ko) * 2014-02-25 2015-07-15 삼목강업주식회사 스프링용 레이저 마킹 시스템
EP3183222B1 (en) * 2014-08-20 2019-12-25 Corning Incorporated Method for yielding high edge strength in cutting of flexible thin glass
US20160172243A1 (en) * 2014-12-11 2016-06-16 Nxp B.V. Wafer material removal
TWI627010B (zh) * 2015-04-24 2018-06-21 納諾股份有限公司 脆性物件切斷裝置
TWI543834B (zh) * 2015-04-24 2016-08-01 納諾股份有限公司 脆性物件切斷裝置及其切斷方法
RU2671239C1 (ru) * 2015-06-10 2018-10-30 Бандо Кико Ко., Лтд. Способ вырезания листового стекла и позиционирования вырезанного листового стекла и устройство для его осуществления
DE102015120950B4 (de) 2015-12-02 2022-03-03 Schott Ag Verfahren zum lasergestützten Ablösen eines Teilstücks von einem flächigen Glas- oder Glaskeramikelement, flächiges zumindest teilweise keramisiertes Glaselement oder Glaskeramikelement und Kochfläche umfassend ein flächiges Glas- oder Glaskeramikelement
JP6638400B2 (ja) * 2016-01-05 2020-01-29 三星ダイヤモンド工業株式会社 基板分断方法
US10903173B2 (en) 2016-10-20 2021-01-26 Palo Alto Research Center Incorporated Pre-conditioned substrate
CN106526941A (zh) * 2016-12-30 2017-03-22 惠科股份有限公司 显示面板加工工艺的改善方法、显示面板加工设备
CN107379292B (zh) * 2017-09-15 2019-07-02 京东方科技集团股份有限公司 显示面板的切割方法、系统和存储介质
US10717669B2 (en) 2018-05-16 2020-07-21 Palo Alto Research Center Incorporated Apparatus and method for creating crack initiation sites in a self-fracturing frangible member
CN111112808A (zh) * 2018-10-30 2020-05-08 三星钻石工业股份有限公司 基板分断装置及基板分断方法
CN111390399B (zh) * 2020-03-12 2022-02-15 上海柏楚电子科技股份有限公司 基于冷却点的切割控制方法、系统、电子设备与介质
JP7552230B2 (ja) * 2020-10-12 2024-09-18 Ａｇｃ株式会社 ガラス製造装置、及びガラス製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0437492A (ja) * 1990-05-31 1992-02-07 Shunichi Maekawa 脆性材料の切断法
JP2002153984A (ja) 2000-11-22 2002-05-28 Seiko Epson Corp 基板分割方法及びこれを用いた液晶装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5325997A (en) * 1977-07-06 1978-03-10 Toshiba Corp Laser scribing method
JPH09150286A (ja) * 1995-06-26 1997-06-10 Corning Inc 脆弱性材料切断方法および装置
EP0847317B1 (en) * 1995-08-31 2003-08-27 Corning Incorporated Method and apparatus for breaking brittle materials
KR100626983B1 (ko) * 1999-06-18 2006-09-22 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저를 이용한 스크라이브 방법
US6812430B2 (en) * 2000-12-01 2004-11-02 Lg Electronics Inc. Glass cutting method and apparatus with controlled laser beam energy
TW592868B (en) * 2001-07-18 2004-06-21 Mitsuboshi Diamond Ind Co Ltd Device and method for scribing fragile material substrate
TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
JP2004223796A (ja) * 2003-01-21 2004-08-12 Kyoto Seisakusho Co Ltd 脆性材料の割断加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0437492A (ja) * 1990-05-31 1992-02-07 Shunichi Maekawa 脆性材料の切断法
JP2002153984A (ja) 2000-11-22 2002-05-28 Seiko Epson Corp 基板分割方法及びこれを用いた液晶装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102216298B1 (ko) * 2020-04-28 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비
WO2021221378A1 (ko) * 2020-04-28 2021-11-04 주식회사 아이티아이 세라믹 절단법 및 장비
KR102216294B1 (ko) * 2020-07-22 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비

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