KR100853573B1 - 기판 처리 장치 및 기판 처리 시스템 - Google Patents

기판 처리 장치 및 기판 처리 시스템 Download PDF

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Publication number
KR100853573B1
KR100853573B1 KR1020060083863A KR20060083863A KR100853573B1 KR 100853573 B1 KR100853573 B1 KR 100853573B1 KR 1020060083863 A KR1020060083863 A KR 1020060083863A KR 20060083863 A KR20060083863 A KR 20060083863A KR 100853573 B1 KR100853573 B1 KR 100853573B1
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KR
South Korea
Prior art keywords
lid
substrate
chamber
processing apparatus
substrate processing
Prior art date
Application number
KR1020060083863A
Other languages
English (en)
Korean (ko)
Other versions
KR20070026222A (ko
Inventor
가츠미 시오노
신고 데구치
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20070026222A publication Critical patent/KR20070026222A/ko
Application granted granted Critical
Publication of KR100853573B1 publication Critical patent/KR100853573B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020060083863A 2005-08-31 2006-08-31 기판 처리 장치 및 기판 처리 시스템 KR100853573B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005252220A JP4642608B2 (ja) 2005-08-31 2005-08-31 基板処理装置および基板処理システム
JPJP-P-2005-00252220 2005-08-31

Publications (2)

Publication Number Publication Date
KR20070026222A KR20070026222A (ko) 2007-03-08
KR100853573B1 true KR100853573B1 (ko) 2008-08-21

Family

ID=37817364

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060083863A KR100853573B1 (ko) 2005-08-31 2006-08-31 기판 처리 장치 및 기판 처리 시스템

Country Status (4)

Country Link
JP (1) JP4642608B2 (zh)
KR (1) KR100853573B1 (zh)
CN (1) CN100500941C (zh)
TW (1) TWI400753B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101171758B1 (ko) 2010-09-29 2012-08-07 스미도모쥬기가이고교 가부시키가이샤 챔버라인
KR20120106684A (ko) * 2010-05-31 2012-09-26 도쿄엘렉트론가부시키가이샤 덮개 유지 지그
KR101299843B1 (ko) * 2010-09-28 2013-08-23 도쿄엘렉트론가부시키가이샤 처리 장치 및 그 메인테넌스 방법
KR101910367B1 (ko) * 2018-04-27 2018-10-23 김중민 커버의 수평조절이 가능한 오토리드 및 이를 이용한 커버의 개폐방법

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101165869B (zh) * 2007-08-29 2010-11-03 常州亿晶光电科技有限公司 硅片装卸装置
KR100925172B1 (ko) * 2007-12-24 2009-11-05 주식회사 에이디피엔지니어링 리드 개폐장치 및 방법
KR101007711B1 (ko) * 2008-05-19 2011-01-13 주식회사 에스에프에이 플라즈마 처리장치
KR101338629B1 (ko) * 2009-01-14 2013-12-06 가부시키가이샤 아루박 플라스마 ｃｖｄ 장치
CN101673810B (zh) * 2009-09-03 2011-06-22 东莞宏威数码机械有限公司 腔盖启闭机构
JP4917660B2 (ja) * 2009-10-05 2012-04-18 株式会社日立国際電気 基板処理装置、基板処理装置の制御方法、半導体デバイスの製造方法、装置状態遷移方法、基板処理装置の保守方法及び状態遷移プログラム
JP5585238B2 (ja) * 2010-06-24 2014-09-10 東京エレクトロン株式会社 基板処理装置
JP5575558B2 (ja) * 2010-06-30 2014-08-20 東京エレクトロン株式会社 処理装置
CN102590924B (zh) * 2011-01-07 2014-08-20 志圣工业股份有限公司 导光板制造方法、导光板及罩板
CN103911598A (zh) * 2012-12-31 2014-07-09 光达光电设备科技（嘉兴）有限公司 一种金属有机化学气相沉积设备
DE102014104011A1 (de) 2014-03-24 2015-09-24 Aixtron Se Vorrichtung zum Abscheiden von Nanotubes
JP5941943B2 (ja) * 2014-05-08 2016-06-29 ワイエイシイ株式会社 蓋体開閉装置およびマルチチャンバー処理システム
CN105441876B (zh) * 2014-09-02 2019-04-23 北京北方华创微电子装备有限公司 一种薄膜沉积设备
KR101685406B1 (ko) * 2015-10-19 2016-12-13 주식회사 티이에스 리드 개폐 모듈을 포함하는 장치
CN108914090B (zh) * 2018-09-14 2024-01-02 江苏润阳悦达光伏科技有限公司 半自动化石墨舟卡点更换机
CN110289235B (zh) * 2019-07-09 2021-07-09 北京北方华创微电子装备有限公司 开盖装置和半导体加工设备
CN112086390A (zh) * 2020-09-30 2020-12-15 上海广川科技有限公司 腔室开盖机构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335406A (ja) * 1992-06-03 1993-12-17 Fujitsu Ltd 基板格納装置
JPH10303277A (ja) 1997-04-28 1998-11-13 Toshiba Corp 扉開閉装置
JP2001298016A (ja) 2001-02-20 2001-10-26 Matsushita Electric Ind Co Ltd プラズマクリーニング装置
KR20050022734A (ko) * 2003-08-29 2005-03-08 동부아남반도체 주식회사 반도체 웨이퍼의 이탈 방지장치 및 이탈 방지방법
KR20050045360A (ko) * 2003-11-11 2005-05-17 주식회사 디엠에스 기판의 진공처리장치
KR20050047677A (ko) * 2003-11-18 2005-05-23 주식회사 에이디피엔지니어링 상부 커버를 개폐할 수 있는 개폐장치가 구비된평판표시소자 제조장치의 공정챔버

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745684A (ja) * 1993-07-27 1995-02-14 Kokusai Electric Co Ltd 半導体製造装置の処理室
JP3122617B2 (ja) * 1996-07-19 2001-01-09 東京エレクトロン株式会社 プラズマ処理装置
JPH11140648A (ja) * 1997-11-07 1999-05-25 Tokyo Electron Ltd プロセスチャンバ装置及び処理装置
JP3205312B2 (ja) * 1999-03-17 2001-09-04 株式会社日立製作所 プラズマ処理装置及びプラズマ処理装置のメンテナンス方法
JP3527450B2 (ja) * 1999-12-22 2004-05-17 東京エレクトロン株式会社 処理装置
KR100638917B1 (ko) * 2000-05-17 2006-10-25 동경 엘렉트론 주식회사 처리 장치 부품의 조립 기구 및 그 조립 방법
JP3397203B2 (ja) * 2001-03-28 2003-04-14 松下電器産業株式会社 プラズマクリーニング装置
JP4199062B2 (ja) * 2003-07-07 2008-12-17 株式会社神戸製鋼所 真空蒸着装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335406A (ja) * 1992-06-03 1993-12-17 Fujitsu Ltd 基板格納装置
JPH10303277A (ja) 1997-04-28 1998-11-13 Toshiba Corp 扉開閉装置
JP2001298016A (ja) 2001-02-20 2001-10-26 Matsushita Electric Ind Co Ltd プラズマクリーニング装置
KR20050022734A (ko) * 2003-08-29 2005-03-08 동부아남반도체 주식회사 반도체 웨이퍼의 이탈 방지장치 및 이탈 방지방법
KR20050045360A (ko) * 2003-11-11 2005-05-17 주식회사 디엠에스 기판의 진공처리장치
KR20050047677A (ko) * 2003-11-18 2005-05-23 주식회사 에이디피엔지니어링 상부 커버를 개폐할 수 있는 개폐장치가 구비된평판표시소자 제조장치의 공정챔버

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120106684A (ko) * 2010-05-31 2012-09-26 도쿄엘렉트론가부시키가이샤 덮개 유지 지그
KR101581993B1 (ko) * 2010-05-31 2015-12-31 도쿄엘렉트론가부시키가이샤 덮개 유지 지그
KR101299843B1 (ko) * 2010-09-28 2013-08-23 도쿄엘렉트론가부시키가이샤 처리 장치 및 그 메인테넌스 방법
KR101171758B1 (ko) 2010-09-29 2012-08-07 스미도모쥬기가이고교 가부시키가이샤 챔버라인
KR101910367B1 (ko) * 2018-04-27 2018-10-23 김중민 커버의 수평조절이 가능한 오토리드 및 이를 이용한 커버의 개폐방법

Also Published As

Publication number Publication date
TW200723397A (en) 2007-06-16
KR20070026222A (ko) 2007-03-08
CN100500941C (zh) 2009-06-17
TWI400753B (zh) 2013-07-01
JP4642608B2 (ja) 2011-03-02
JP2007067218A (ja) 2007-03-15
CN1924659A (zh) 2007-03-07

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