KR100834702B1 - 반송처리장치 - Google Patents

반송처리장치 Download PDF

Info

Publication number
KR100834702B1
KR100834702B1 KR1020060104941A KR20060104941A KR100834702B1 KR 100834702 B1 KR100834702 B1 KR 100834702B1 KR 1020060104941 A KR1020060104941 A KR 1020060104941A KR 20060104941 A KR20060104941 A KR 20060104941A KR 100834702 B1 KR100834702 B1 KR 100834702B1
Authority
KR
South Korea
Prior art keywords
substrate
chamber
processing apparatus
liquid
decompression chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060104941A
Other languages
English (en)
Korean (ko)
Other versions
KR20070046727A (ko
Inventor
후토시 시마이
시게루 가와타
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20070046727A publication Critical patent/KR20070046727A/ko
Application granted granted Critical
Publication of KR100834702B1 publication Critical patent/KR100834702B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020060104941A 2005-10-31 2006-10-27 반송처리장치 Expired - Fee Related KR100834702B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00316881 2005-10-31
JP2005316881A JP4817802B2 (ja) 2005-10-31 2005-10-31 搬送処理装置

Publications (2)

Publication Number Publication Date
KR20070046727A KR20070046727A (ko) 2007-05-03
KR100834702B1 true KR100834702B1 (ko) 2008-06-02

Family

ID=38071554

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060104941A Expired - Fee Related KR100834702B1 (ko) 2005-10-31 2006-10-27 반송처리장치

Country Status (4)

Country Link
JP (1) JP4817802B2 (enExample)
KR (1) KR100834702B1 (enExample)
CN (1) CN100466216C (enExample)
TW (1) TW200746251A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
CN101718963B (zh) * 2010-01-14 2011-10-05 友达光电股份有限公司 显影设备
JP5641989B2 (ja) * 2011-03-17 2014-12-17 三菱電機ビルテクノサービス株式会社 フィルタ洗浄装置
WO2014069577A1 (ja) * 2012-11-05 2014-05-08 日本電気硝子株式会社 板ガラス洗浄装置および板ガラス洗浄方法
US20150118012A1 (en) * 2013-10-31 2015-04-30 Lam Research Corporation Wafer entry port with gas concentration attenuators
CN104538332B (zh) * 2014-12-12 2017-06-27 深圳市华星光电技术有限公司 一种湿制程机台的腔室结构
CN116198779A (zh) * 2023-03-31 2023-06-02 西安奕斯伟材料科技股份有限公司 一种用于包装硅片盒的设备及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030039318A (ko) * 2001-11-12 2003-05-17 동경 엘렉트론 주식회사 기판처리장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08203858A (ja) * 1995-01-31 1996-08-09 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11334870A (ja) * 1998-05-26 1999-12-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001135702A (ja) * 1999-11-04 2001-05-18 Canon Inc 基板搬送装置および基板処理装置ならびにデバイス製造方法
JP4316767B2 (ja) * 2000-03-22 2009-08-19 株式会社半導体エネルギー研究所 基板処理装置
JP4056858B2 (ja) * 2001-11-12 2008-03-05 東京エレクトロン株式会社 基板処理装置
JP4044047B2 (ja) * 2002-02-04 2008-02-06 住友精密工業株式会社 搬送式基板処理装置
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置
JP4346967B2 (ja) * 2003-06-13 2009-10-21 住友精密工業株式会社 レジスト剥離装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030039318A (ko) * 2001-11-12 2003-05-17 동경 엘렉트론 주식회사 기판처리장치

Also Published As

Publication number Publication date
CN1959951A (zh) 2007-05-09
CN100466216C (zh) 2009-03-04
TWI306272B (enExample) 2009-02-11
KR20070046727A (ko) 2007-05-03
TW200746251A (en) 2007-12-16
JP2007117953A (ja) 2007-05-17
JP4817802B2 (ja) 2011-11-16

Similar Documents

Publication Publication Date Title
CN1299334C (zh) 基板处理方法和基板处理装置
US5762749A (en) Apparatus for removing liquid from substrates
TWI546131B (zh) 基板處理裝置、噴嘴以及基板處理方法
KR100834702B1 (ko) 반송처리장치
JP2015099919A (ja) 基板洗浄装置
JP2006278606A (ja) 基板処理装置および基板処理方法
JP2003083675A (ja) 基板乾燥装置
JP4878900B2 (ja) 基板処理装置
JP2009213958A (ja) 基板処理装置
JP2004095926A (ja) 基板処理装置
JP4138504B2 (ja) 基板処理装置
JP2005064312A (ja) 基板処理方法および基板処理装置
JP6347921B2 (ja) 超音波洗浄装置
KR100764683B1 (ko) 기판처리장치
JP7237670B2 (ja) 基板処理装置および基板処理方法
JP3863086B2 (ja) 基板処理装置
JP2001358114A (ja) 乾燥装置
TWI344665B (en) Equipment for peeling resist
JP2004016997A (ja) 基板の処理装置及び処理方法
JP4365192B2 (ja) 搬送式基板処理装置
TW200843868A (en) Liquid treatment device
KR20210146796A (ko) 현상 처리 장치 및 현상 처리 방법
KR20060027597A (ko) 기판세정장치 및 기판세정방법
JP4417180B2 (ja) 基板処理装置
JP2005268247A (ja) 基板処理装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20130503

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20140502

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20150430

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20160427

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20170504

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20180427

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20190429

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240528

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240528

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000