KR100834176B1 - 제전 장치 및 제전 방법과 프로그램 기록 매체 - Google Patents

제전 장치 및 제전 방법과 프로그램 기록 매체 Download PDF

Info

Publication number
KR100834176B1
KR100834176B1 KR1020070094236A KR20070094236A KR100834176B1 KR 100834176 B1 KR100834176 B1 KR 100834176B1 KR 1020070094236 A KR1020070094236 A KR 1020070094236A KR 20070094236 A KR20070094236 A KR 20070094236A KR 100834176 B1 KR100834176 B1 KR 100834176B1
Authority
KR
South Korea
Prior art keywords
wafer
probe card
relay switch
test
inspected object
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020070094236A
Other languages
English (en)
Korean (ko)
Other versions
KR20080039784A (ko
Inventor
에이이치 시노하라
가즈키 하나와
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Priority to US11/861,905 priority Critical patent/US7859279B2/en
Publication of KR20080039784A publication Critical patent/KR20080039784A/ko
Application granted granted Critical
Publication of KR100834176B1 publication Critical patent/KR100834176B1/ko
Priority to US12/842,756 priority patent/US8085052B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/206—Switches for connection of measuring instruments or electric motors to measuring loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020070094236A 2006-11-01 2007-09-17 제전 장치 및 제전 방법과 프로그램 기록 매체 Active KR100834176B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11/861,905 US7859279B2 (en) 2006-11-01 2007-09-26 Charge eliminating apparatus and method, and program storage medium
US12/842,756 US8085052B2 (en) 2006-11-01 2010-07-23 Charge eliminating apparatus and method, and program storage medium for removing static electricity from a target object such as a wafer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006297979 2006-11-01
JPJP-P-2006-00297979 2006-11-01
JP2007063310A JP4068127B2 (ja) 2006-11-01 2007-03-13 除電装置及び除電方法並びにプログラム記録媒体
JPJP-P-2007-00063310 2007-03-13

Publications (2)

Publication Number Publication Date
KR20080039784A KR20080039784A (ko) 2008-05-07
KR100834176B1 true KR100834176B1 (ko) 2008-05-30

Family

ID=38305365

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070094236A Active KR100834176B1 (ko) 2006-11-01 2007-09-17 제전 장치 및 제전 방법과 프로그램 기록 매체

Country Status (4)

Country Link
JP (1) JP4068127B2 (enExample)
KR (1) KR100834176B1 (enExample)
CN (1) CN101175362B (enExample)
TW (1) TW200826213A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101604075B (zh) * 2008-06-13 2013-04-10 统宝光电股份有限公司 液晶显示面板的点灯测试静电防护装置与方法
JP5377915B2 (ja) * 2008-09-30 2013-12-25 東京エレクトロン株式会社 検査装置及び検査方法
JP5356769B2 (ja) * 2008-10-15 2013-12-04 東京エレクトロン株式会社 載置台
JP2011054762A (ja) * 2009-09-02 2011-03-17 Tokyo Electron Ltd 除電装置の監視装置、除電装置の監視方法及び除電装置の監視用プログラム
KR101999720B1 (ko) * 2012-11-20 2019-07-16 삼성디스플레이 주식회사 기판 정전기 검사 장치 및 기판 제조 방법
JP6227262B2 (ja) 2013-03-06 2017-11-08 株式会社荏原製作所 表面電位測定装置および表面電位測定方法
KR101515719B1 (ko) * 2013-12-23 2015-04-27 세메스 주식회사 프로브 스테이션
CN105530750A (zh) * 2014-09-29 2016-04-27 盛美半导体设备（上海）有限公司 晶圆导静电装置
CN107976576A (zh) * 2016-10-24 2018-05-01 精工爱普生株式会社 电子元器件传送装置以及电子元器件检查装置
JP7153181B2 (ja) * 2018-03-29 2022-10-14 株式会社東京精密 導通検査装置、プローバ
CN111257714B (zh) * 2020-01-17 2022-11-29 上海华力集成电路制造有限公司 静电测量设备及静电测量方法
JP2023148322A (ja) * 2022-03-30 2023-10-13 株式会社東京精密 導通検査装置、ケルビン測定用プローバ、及び除電装置
CN119355311B (zh) * 2024-10-22 2025-04-29 上海矽弼半导体科技有限公司 一种探针台用的具有耐高压低漏电功能的载物台
CN120048713B (zh) * 2025-02-20 2025-10-24 盛吉盛(宁波)半导体科技有限公司 除电装置、电源连接装置以及半导体加工腔室

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406925B1 (en) 1998-08-17 2002-06-18 Tegal Corporation Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing
JP2003100821A (ja) 2001-09-27 2003-04-04 Sony Corp ウェハーの検査システムおよび検査方法
JP2003218175A (ja) * 2002-01-23 2003-07-31 Tokyo Electron Ltd 載置台の除電機構及び検査装置
KR20050018063A (ko) * 2003-08-13 2005-02-23 삼성전자주식회사 반도체 제조장치의 기판 척킹/디척킹 장치 및 그의 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2076241U (zh) * 1990-09-30 1991-05-01 朱少武 防爆接地控制器
CN2303378Y (zh) * 1997-07-29 1999-01-06 马思正 电器自动接地消幅器
CN100381883C (zh) * 2004-05-24 2008-04-16 统宝光电股份有限公司 静电消除装置及其机台

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406925B1 (en) 1998-08-17 2002-06-18 Tegal Corporation Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing
JP2003100821A (ja) 2001-09-27 2003-04-04 Sony Corp ウェハーの検査システムおよび検査方法
JP2003218175A (ja) * 2002-01-23 2003-07-31 Tokyo Electron Ltd 載置台の除電機構及び検査装置
KR20050018063A (ko) * 2003-08-13 2005-02-23 삼성전자주식회사 반도체 제조장치의 기판 척킹/디척킹 장치 및 그의 방법

Also Published As

Publication number Publication date
JP2007180580A (ja) 2007-07-12
CN101175362A (zh) 2008-05-07
KR20080039784A (ko) 2008-05-07
TW200826213A (en) 2008-06-16
TWI362712B (enExample) 2012-04-21
CN101175362B (zh) 2011-12-14
JP4068127B2 (ja) 2008-03-26

Similar Documents

Publication Publication Date Title
KR100834176B1 (ko) 제전 장치 및 제전 방법과 프로그램 기록 매체
US8195324B2 (en) Probe polishing method, program therefor, and probe apparatus
JP2008251678A (ja) 被検査体の搬送装置及び検査装置
CN102326243A (zh) 测试装置及测试方法
CN101271145A (zh) 检查装置和检查方法
CN111742399A (zh) 接触精度保证方法、接触精度保证机构和检查装置
KR101114617B1 (ko) 제전 장치의 감시 장치, 제전 장치의 감시 방법 및 제전 장치의 감시용 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
JP2013191741A (ja) プローブ装置及びプローブ装置のプローブカード装着方法
TWI753123B (zh) 檢查裝置之診斷方法及檢查系統
KR102294790B1 (ko) 검사 장치, 및 검사 방법
US8085052B2 (en) Charge eliminating apparatus and method, and program storage medium for removing static electricity from a target object such as a wafer
US11933839B2 (en) Inspection apparatus and inspection method
US11385283B2 (en) Chuck top, inspection apparatus, and chuck top recovery method
US7265536B2 (en) Procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate in a probe station
JP5137965B2 (ja) 搬送装置および電子部品ハンドリング装置
CN113823577B (zh) 检查装置中的接触解除方法和检查装置
KR100806381B1 (ko) 웨이퍼 공급장치
JP7737852B2 (ja) 検査装置及び検査方法
JP7784890B2 (ja) 検査装置及び検査方法
JP2750448B2 (ja) 半導体検査装置
JP2016157883A (ja) プローバ及びウェーハ剥離方法
JPH0329335A (ja) 半導体チッププローバ
JPS60239036A (ja) 半導体ウエハプロ−バ
JPS61206238A (ja) 自動半導体ウエハプロ−バ
JPH02272374A (ja) 半導体検査装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

A302 Request for accelerated examination
PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20130503

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20140502

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20150430

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20160427

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20170504

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20180518

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20190516

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 17

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 18

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000