KR100747130B1 - Ｂｇａ 패키지들에 대해 향상된 바이패스 디커플링을 갖는인쇄 회로 기판 조립체 - Google Patents

Ｂｇａ 패키지들에 대해 향상된 바이패스 디커플링을 갖는인쇄 회로 기판 조립체 Download PDF

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Publication number
KR100747130B1
KR100747130B1 KR1020027011585A KR20027011585A KR100747130B1 KR 100747130 B1 KR100747130 B1 KR 100747130B1 KR 1020027011585 A KR1020027011585 A KR 1020027011585A KR 20027011585 A KR20027011585 A KR 20027011585A KR 100747130 B1 KR100747130 B1 KR 100747130B1
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KR
South Korea
Prior art keywords
capacitor
bga
pcb
circuit board
printed circuit
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Expired - Lifetime
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KR1020027011585A
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English (en)
Korean (ko)
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KR20020082865A (ko
Inventor
드레이크마이클
트레슬러크리스
구에레로에드워드
스켈링그레그
베네트존
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020027011585A 2000-03-03 2000-11-21 Ｂｇａ 패키지들에 대해 향상된 바이패스 디커플링을 갖는인쇄 회로 기판 조립체 Expired - Lifetime KR100747130B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/518,491 2000-03-03
US09/518,491 US6404649B1 (en) 2000-03-03 2000-03-03 Printed circuit board assembly with improved bypass decoupling for BGA packages

Publications (2)

Publication Number Publication Date
KR20020082865A KR20020082865A (ko) 2002-10-31
KR100747130B1 true KR100747130B1 (ko) 2007-08-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027011585A Expired - Lifetime KR100747130B1 (ko) 2000-03-03 2000-11-21 Ｂｇａ 패키지들에 대해 향상된 바이패스 디커플링을 갖는인쇄 회로 기판 조립체

Country Status (7)

Country Link
US (1) US6404649B1 (enExample)
EP (1) EP1260121B1 (enExample)
JP (1) JP2003526221A (enExample)
KR (1) KR100747130B1 (enExample)
CN (1) CN1204793C (enExample)
DE (1) DE60029011T2 (enExample)
WO (1) WO2001067833A1 (enExample)

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US7247932B1 (en) * 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
TW502492B (en) * 2000-05-30 2002-09-11 Alps Electric Co Ltd Electronic circuit unit
US6900991B2 (en) * 2001-12-03 2005-05-31 Intel Corporation Electronic assembly with sandwiched capacitors and methods of manufacture
US20040000704A1 (en) * 2002-07-01 2004-01-01 George Tsao Process for grid array assembly and electronic device made thereby
US7005736B2 (en) * 2002-09-30 2006-02-28 Intel Corporation Semiconductor device power interconnect striping
US20040125580A1 (en) * 2002-12-31 2004-07-01 Intel Corporation Mounting capacitors under ball grid array
US7153723B1 (en) 2003-12-04 2006-12-26 Emc Corporation Method of forming a ball grid array device
US7235875B2 (en) * 2004-12-09 2007-06-26 International Business Machines Corporation Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module
KR100714625B1 (ko) * 2005-10-18 2007-05-07 삼성전기주식회사 박막 캐패시터 내장형 인쇄회로기판의 제조방법
US7622325B2 (en) * 2005-10-29 2009-11-24 Stats Chippac Ltd. Integrated circuit package system including high-density small footprint system-in-package
US8222079B2 (en) * 2007-09-28 2012-07-17 International Business Machines Corporation Semiconductor device and method of making semiconductor device
US7872483B2 (en) 2007-12-12 2011-01-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
US9607935B2 (en) 2009-04-21 2017-03-28 Ati Technologies Ulc Semiconductor chip package with undermount passive devices
US8289727B2 (en) * 2010-06-11 2012-10-16 Taiwan Semiconductor Manufacturing Company, Ltd. Package substrate
US8631706B2 (en) 2010-07-21 2014-01-21 International Business Machines Corporation Noise suppressor for semiconductor packages
US9510448B2 (en) 2014-08-29 2016-11-29 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Maximizing surface area of surface mount contact pads of circuit board also having via contact pads
US9769926B2 (en) * 2015-04-23 2017-09-19 Dell Products L.P. Breakout via system
US11495588B2 (en) 2018-12-07 2022-11-08 Advanced Micro Devices, Inc. Circuit board with compact passive component arrangement

Citations (1)

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GB2176654B (en) 1985-06-11 1988-08-10 Avx Corp Method for optimising the decoupling of integrated circuit devices
US4779164A (en) * 1986-12-12 1988-10-18 Menzies Jr L William Surface mounted decoupling capacitor
JPS63157919U (enExample) * 1987-04-01 1988-10-17
US4853826A (en) * 1988-08-01 1989-08-01 Rogers Corporation Low inductance decoupling capacitor
US5010447A (en) * 1988-12-28 1991-04-23 Texas Instruments Incorporated Divided capacitor mounting pads
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Also Published As

Publication number Publication date
EP1260121B1 (en) 2006-06-21
KR20020082865A (ko) 2002-10-31
DE60029011D1 (de) 2006-08-03
CN1204793C (zh) 2005-06-01
US6404649B1 (en) 2002-06-11
WO2001067833A1 (en) 2001-09-13
DE60029011T2 (de) 2007-01-11
JP2003526221A (ja) 2003-09-02
EP1260121A1 (en) 2002-11-27
CN1437839A (zh) 2003-08-20

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