JPS63157919U - - Google Patents
Info
- Publication number
- JPS63157919U JPS63157919U JP4904787U JP4904787U JPS63157919U JP S63157919 U JPS63157919 U JP S63157919U JP 4904787 U JP4904787 U JP 4904787U JP 4904787 U JP4904787 U JP 4904787U JP S63157919 U JPS63157919 U JP S63157919U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- capacitor
- conductive plate
- capacitors
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4904787U JPS63157919U (enExample) | 1987-04-01 | 1987-04-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4904787U JPS63157919U (enExample) | 1987-04-01 | 1987-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157919U true JPS63157919U (enExample) | 1988-10-17 |
Family
ID=30871141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4904787U Pending JPS63157919U (enExample) | 1987-04-01 | 1987-04-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157919U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003526221A (ja) * | 2000-03-03 | 2003-09-02 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | Ｂｇａパッケージのためのバイパス減結合が改良されたプリント回路基板アセンブリ |
-
1987
- 1987-04-01 JP JP4904787U patent/JPS63157919U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003526221A (ja) * | 2000-03-03 | 2003-09-02 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | Ｂｇａパッケージのためのバイパス減結合が改良されたプリント回路基板アセンブリ |