KR100733847B1 - 전자선 또는 엑스선용 네거티브 레지스트 조성물 - Google Patents

전자선 또는 엑스선용 네거티브 레지스트 조성물 Download PDF

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Publication number
KR100733847B1
KR100733847B1 KR1020010001762A KR20010001762A KR100733847B1 KR 100733847 B1 KR100733847 B1 KR 100733847B1 KR 1020010001762 A KR1020010001762 A KR 1020010001762A KR 20010001762 A KR20010001762 A KR 20010001762A KR 100733847 B1 KR100733847 B1 KR 100733847B1
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KR
South Korea
Prior art keywords
group
compound
substituent
resin
resist composition
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KR1020010001762A
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English (en)
Korean (ko)
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KR20010088315A (ko
Inventor
아오아이토시아키
아데가와유타카
야기하라모리오
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후지필름 가부시키가이샤
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Publication of KR20010088315A publication Critical patent/KR20010088315A/ko
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Publication of KR100733847B1 publication Critical patent/KR100733847B1/ko

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
KR1020010001762A 2000-01-13 2001-01-12 전자선 또는 엑스선용 네거티브 레지스트 조성물 KR100733847B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000-004766 2000-01-13
JP2000004766 2000-01-13
JP2000084469 2000-03-24
JP2000-084469 2000-03-24

Publications (2)

Publication Number Publication Date
KR20010088315A KR20010088315A (ko) 2001-09-26
KR100733847B1 true KR100733847B1 (ko) 2007-06-29

Family

ID=26583449

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010001762A KR100733847B1 (ko) 2000-01-13 2001-01-12 전자선 또는 엑스선용 네거티브 레지스트 조성물

Country Status (4)

Country Link
US (1) US6824948B1 (US06824948-20041130-C00014.png)
EP (1) EP1117004A3 (US06824948-20041130-C00014.png)
KR (1) KR100733847B1 (US06824948-20041130-C00014.png)
TW (1) TWI289238B (US06824948-20041130-C00014.png)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7022455B2 (en) * 2001-12-28 2006-04-04 Shipley Company, L.L.C. Photoacid-labile polymers and photoresists comprising same
US7083892B2 (en) * 2002-06-28 2006-08-01 Fuji Photo Film Co., Ltd. Resist composition
JP4090307B2 (ja) 2002-08-22 2008-05-28 富士フイルム株式会社 平版印刷版の作製方法
JP4480141B2 (ja) 2004-06-28 2010-06-16 キヤノン株式会社 インクジェット記録ヘッドの製造方法
TWI400568B (zh) * 2004-12-24 2013-07-01 Mitsubishi Gas Chemical Co 感放射線性組成物、非晶質膜及形成光阻圖案的方法
KR100904068B1 (ko) * 2007-09-04 2009-06-23 제일모직주식회사 컬러필터용 감광성 수지 조성물 및 이를 이용한 컬러필터
US9469941B2 (en) 2011-07-01 2016-10-18 Empire Technology Development Llc Paraben derivatives for preserving cellulosic materials
US11635688B2 (en) * 2012-03-08 2023-04-25 Kayaku Advanced Materials, Inc. Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates
JP5850873B2 (ja) * 2012-07-27 2016-02-03 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、それを用いたレジスト膜、パターン形成方法、及び電子デバイスの製造方法
JP6438645B2 (ja) * 2013-09-26 2018-12-19 富士フイルム株式会社 感活性光線性又は感放射線性組成物、並びに、これを用いた、レジスト膜、パターン形成方法、レジスト塗布マスクブランクス、フォトマスクの製造方法、及び電子デバイスの製造方法
US10656521B2 (en) * 2014-11-26 2020-05-19 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate
CN112558409B (zh) * 2019-09-25 2022-05-20 常州强力先端电子材料有限公司 能够在i线高产酸的磺酰亚胺类光产酸剂

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH02190860A (ja) * 1989-01-20 1990-07-26 Fuji Photo Film Co Ltd 液状感光性樹脂組成物
EP0403170A2 (en) * 1989-06-09 1990-12-19 Morton International, Inc. Photoimageable compositions
EP0509512A1 (en) * 1991-04-17 1992-10-21 Nippon Paint Co., Ltd. Photosensitive composition for volume hologram recording
EP0613050A2 (en) * 1993-02-26 1994-08-31 International Business Machines Corporation Universal negative tone photoresist
EP0756203A1 (en) * 1995-07-26 1997-01-29 Hoechst Industry Limited Radiation-sensitive composition

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US4621043A (en) * 1983-01-31 1986-11-04 E. I. Du Pont De Nemours And Company Storage stable photopolymerizable composition
US4857437A (en) * 1986-12-17 1989-08-15 Ciba-Geigy Corporation Process for the formation of an image
JPH01168723A (ja) * 1987-12-24 1989-07-04 Hitachi Chem Co Ltd 感光性樹脂組成物
US5180653A (en) * 1988-11-28 1993-01-19 Tokyo Ohka Kogyo Co., Ltd. Electron beam-curable resist composition and method for fine patterning using the same
JP2505033B2 (ja) * 1988-11-28 1996-06-05 東京応化工業株式会社 電子線レジスト組成物及びそれを用いた微細パタ―ンの形成方法
US5124234A (en) * 1989-01-20 1992-06-23 Fuji Photo Film Co., Ltd. Liquid light-sensitive resin composition
JP3279059B2 (ja) 1993-06-02 2002-04-30 住友化学工業株式会社 フォトレジスト組成物
JP3424357B2 (ja) 1994-11-29 2003-07-07 住友化学工業株式会社 電子線用化学増幅ネガ型レジスト組成物
EP0732626B1 (en) 1995-03-16 2004-03-03 Shipley Company LLC Radiation sensitive composition comprising polymer having inert blocking groups
JP3520643B2 (ja) 1995-12-14 2004-04-19 Jsr株式会社 ネガ型感放射線性樹脂組成物
JP3780569B2 (ja) 1996-06-20 2006-05-31 Jsr株式会社 KrFエキシマレーザー照射用化学増幅型ネガ型レジスト
US5858618A (en) * 1996-12-02 1999-01-12 Nan Ya Plastics Corporation Photopolymerizable resinous composition
EP0893737A3 (en) * 1997-07-24 1999-11-24 JSR Corporation Radiation sensitive composition
JP4282783B2 (ja) * 1997-12-16 2009-06-24 Jsr株式会社 カラーフィルタ用感放射線性組成物
US6338936B1 (en) * 1998-02-02 2002-01-15 Taiyo Ink Manufacturing Co., Ltd. Photosensitive resin composition and method for formation of resist pattern by use thereof
US6630285B2 (en) * 1998-10-15 2003-10-07 Mitsui Chemicals, Inc. Positive sensitive resin composition and a process for forming a resist pattern therewith

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02190860A (ja) * 1989-01-20 1990-07-26 Fuji Photo Film Co Ltd 液状感光性樹脂組成物
EP0403170A2 (en) * 1989-06-09 1990-12-19 Morton International, Inc. Photoimageable compositions
EP0509512A1 (en) * 1991-04-17 1992-10-21 Nippon Paint Co., Ltd. Photosensitive composition for volume hologram recording
EP0613050A2 (en) * 1993-02-26 1994-08-31 International Business Machines Corporation Universal negative tone photoresist
EP0756203A1 (en) * 1995-07-26 1997-01-29 Hoechst Industry Limited Radiation-sensitive composition

Also Published As

Publication number Publication date
US6824948B1 (en) 2004-11-30
KR20010088315A (ko) 2001-09-26
EP1117004A2 (en) 2001-07-18
EP1117004A3 (en) 2003-08-13
TWI289238B (en) 2007-11-01

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