KR100731851B1 - 구리를 기본으로 한 본드패드에 종래의 와이어를 결합시킬 수 있는 방법 - Google Patents

구리를 기본으로 한 본드패드에 종래의 와이어를 결합시킬 수 있는 방법 Download PDF

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KR100731851B1
KR100731851B1 KR1020017012365A KR20017012365A KR100731851B1 KR 100731851 B1 KR100731851 B1 KR 100731851B1 KR 1020017012365 A KR1020017012365 A KR 1020017012365A KR 20017012365 A KR20017012365 A KR 20017012365A KR 100731851 B1 KR100731851 B1 KR 100731851B1
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brush
wafer
oxide
layer
passivation layer
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Korean (ko)
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KR20010108419A (ko
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휴 리
다이안 제이. 히메스
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램 리서치 코포레이션
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020017012365A 1999-03-31 2000-03-06 구리를 기본으로 한 본드패드에 종래의 와이어를 결합시킬 수 있는 방법 Expired - Fee Related KR100731851B1 (ko)

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US09/282,596 US6358847B1 (en) 1999-03-31 1999-03-31 Method for enabling conventional wire bonding to copper-based bond pad features
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