JP2002540631A - 銅を用いたボンディングパッド構造に対する従来型のワイヤボンディングの適用を可能にする方法および装置 - Google Patents

銅を用いたボンディングパッド構造に対する従来型のワイヤボンディングの適用を可能にする方法および装置

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Publication number
JP2002540631A
JP2002540631A JP2000608434A JP2000608434A JP2002540631A JP 2002540631 A JP2002540631 A JP 2002540631A JP 2000608434 A JP2000608434 A JP 2000608434A JP 2000608434 A JP2000608434 A JP 2000608434A JP 2002540631 A JP2002540631 A JP 2002540631A
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Japan
Prior art keywords
brush
wafer
layer
passivation layer
oxide
Prior art date
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Pending
Application number
JP2000608434A
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English (en)
Japanese (ja)
Other versions
JP2002540631A5 (enExample
Inventor
リー・ヒュウ
ハイムズ・ダイアン・ジェイ．
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Lam Research Corp
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Lam Research Corp
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Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2002540631A publication Critical patent/JP2002540631A/ja
Publication of JP2002540631A5 publication Critical patent/JP2002540631A5/ja
Pending legal-status Critical Current

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • B08—CLEANING
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JP2000608434A 1999-03-31 2000-03-06 銅を用いたボンディングパッド構造に対する従来型のワイヤボンディングの適用を可能にする方法および装置 Pending JP2002540631A (ja)

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US09/282,596 US6358847B1 (en) 1999-03-31 1999-03-31 Method for enabling conventional wire bonding to copper-based bond pad features
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