FR2722511B1 - Procede pour enlever les metaux dans un dispositif de recurage - Google Patents

Procede pour enlever les metaux dans un dispositif de recurage

Info

Publication number
FR2722511B1
FR2722511B1 FR9508510A FR9508510A FR2722511B1 FR 2722511 B1 FR2722511 B1 FR 2722511B1 FR 9508510 A FR9508510 A FR 9508510A FR 9508510 A FR9508510 A FR 9508510A FR 2722511 B1 FR2722511 B1 FR 2722511B1
Authority
FR
France
Prior art keywords
removing metals
scouring device
scouring
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9508510A
Other languages
English (en)
Other versions
FR2722511A1 (fr
Inventor
Wilbur C Krusell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ontrak Systems Inc
Original Assignee
Ontrak Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ontrak Systems Inc filed Critical Ontrak Systems Inc
Publication of FR2722511A1 publication Critical patent/FR2722511A1/fr
Application granted granted Critical
Publication of FR2722511B1 publication Critical patent/FR2722511B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B08B1/32—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
FR9508510A 1994-07-15 1995-07-13 Procede pour enlever les metaux dans un dispositif de recurage Expired - Fee Related FR2722511B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27563294A 1994-07-15 1994-07-15

Publications (2)

Publication Number Publication Date
FR2722511A1 FR2722511A1 (fr) 1996-01-19
FR2722511B1 true FR2722511B1 (fr) 1999-04-02

Family

ID=23053195

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9508510A Expired - Fee Related FR2722511B1 (fr) 1994-07-15 1995-07-13 Procede pour enlever les metaux dans un dispositif de recurage

Country Status (4)

Country Link
US (1) US6274059B1 (fr)
JP (3) JPH08187475A (fr)
DE (1) DE19525521B4 (fr)
FR (1) FR2722511B1 (fr)

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JP2010226089A (ja) * 2009-01-14 2010-10-07 Rohm & Haas Electronic Materials Llc 半導体ウェハをクリーニングする方法
JP5671793B2 (ja) * 2009-10-08 2015-02-18 株式会社Sumco 仕上研磨を施したシリコンウェーハの洗浄方法
JP5819589B2 (ja) * 2010-03-10 2015-11-24 株式会社フジミインコーポレーテッド 研磨用組成物を用いた方法
CN101780459B (zh) * 2010-03-12 2011-10-26 西安热工研究院有限公司 一种滤元离线化学清洗装置
US20130098395A1 (en) * 2011-10-21 2013-04-25 Applied Materials, Inc. Semiconductor substrate cleaning apparatus, systems, and methods
CN102744230A (zh) * 2012-07-26 2012-10-24 浙江矽盛电子有限公司 一种粘污太阳能硅片的清洗方法
US11694889B2 (en) * 2020-03-02 2023-07-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing cleaning system with temperature control for defect reduction
CN111701947B (zh) * 2020-07-23 2021-06-22 安徽富乐德科技发展股份有限公司 一种半导体硅片超声和兆声清洗系统

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Also Published As

Publication number Publication date
DE19525521B4 (de) 2007-04-26
JP2007165935A (ja) 2007-06-28
US6274059B1 (en) 2001-08-14
JP2010109384A (ja) 2010-05-13
FR2722511A1 (fr) 1996-01-19
DE19525521A1 (de) 1996-03-21
JPH08187475A (ja) 1996-07-23

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Effective date: 20110331