KR100680339B1 - 표면처리 지지부재, 표면처리 호울더, 표면처리 방법 및표면처리 장치 - Google Patents
표면처리 지지부재, 표면처리 호울더, 표면처리 방법 및표면처리 장치 Download PDFInfo
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- KR100680339B1 KR100680339B1 KR1020060027620A KR20060027620A KR100680339B1 KR 100680339 B1 KR100680339 B1 KR 100680339B1 KR 1020060027620 A KR1020060027620 A KR 1020060027620A KR 20060027620 A KR20060027620 A KR 20060027620A KR 100680339 B1 KR100680339 B1 KR 100680339B1
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- surface treatment
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004381 surface treatment Methods 0.000 claims abstract description 131
- 239000000463 material Substances 0.000 abstract description 17
- 238000004804 winding Methods 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 34
- 238000000151 deposition Methods 0.000 description 32
- 230000008021 deposition Effects 0.000 description 30
- 238000007740 vapor deposition Methods 0.000 description 20
- 229910052761 rare earth metal Inorganic materials 0.000 description 12
- 150000002910 rare earth metals Chemical class 0.000 description 12
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910001172 neodymium magnet Inorganic materials 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- -1 for example Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
- F04D17/168—Pumps specially adapted to produce a vacuum
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Physical Vapour Deposition (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- ing And Chemical Polishing (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (5)
- 길이방향으로 개폐가능하게 접을 수 있는 판형상 요소를 포함하여 구성되고, 상기 판형상 요소는 개방된 상태에서 작업물의 내경에 대응하는 길이를 각각 가지는 다수개의 폭이 좁은 부분을 형성할 수 있도록 되어 있는 것을 특징으로 하는, 각각 내경부를 가지는 다수개의 작업물을 지지하기 위한 표면처리 지지부재.
- 제 1 항에 있어서, 상기 판형상 요소들은 힌지에 의하여 개폐가능하게 접혀지는 표면처리 지지부재.
- 다수개의 작업물의 표면처리방법으로서, 처리실 내에서, 자전구동되는 청구항 1에 기재된 표면처리 지지부재를 이용하여, 상기 작업물을 서로 간격을 둔 상태로 자전운동시키면서 표면처리하는 것을 특징으로 하는 표면처리방법.
- 다수개의 작업물의 표면처리방법으로서, 처리실 내에서, 공전구동되는 청구항 1에 기재된 표면처리 지지부재를 이용하여, 상기 작업물을 서로 간격을 둔 상태로 공전운동시키면서 표면처리하는 것을 특징으로 하는 표면처리방법.
- 다수개의 작업물의 표면처리방법으로서, 처리실 내에서, 자전구동됨과 동시에 공전구동되는 청구항 1에 기재된 표면처리 지지부재를 이용하여, 상기 작업물을 서로 간격을 둔 상태로 자전운동과 동시에 공전운동시키면서 표면처리하는 것을 특징으로 하는 표면처리방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-1998-00294685 | 1998-10-02 | ||
JP29468598 | 1998-10-02 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990042464A Division KR100649837B1 (ko) | 1998-10-02 | 1999-10-02 | 표면처리 지지부재, 표면처리 호울더, 표면처리 방법 및 표면처리 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060030098A KR20060030098A (ko) | 2006-04-07 |
KR100680339B1 true KR100680339B1 (ko) | 2007-02-08 |
Family
ID=17810992
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990042464A KR100649837B1 (ko) | 1998-10-02 | 1999-10-02 | 표면처리 지지부재, 표면처리 호울더, 표면처리 방법 및 표면처리 장치 |
KR1020060027620A KR100680339B1 (ko) | 1998-10-02 | 2006-03-27 | 표면처리 지지부재, 표면처리 호울더, 표면처리 방법 및표면처리 장치 |
KR1020060027623A KR100649853B1 (ko) | 1998-10-02 | 2006-03-27 | 표면처리 지지부재, 표면처리 호울더, 표면처리 방법 및표면처리 장치 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990042464A KR100649837B1 (ko) | 1998-10-02 | 1999-10-02 | 표면처리 지지부재, 표면처리 호울더, 표면처리 방법 및 표면처리 장치 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060027623A KR100649853B1 (ko) | 1998-10-02 | 2006-03-27 | 표면처리 지지부재, 표면처리 호울더, 표면처리 방법 및표면처리 장치 |
Country Status (6)
Country | Link |
---|---|
US (3) | US6280792B1 (ko) |
EP (1) | EP0992605A3 (ko) |
JP (1) | JP3192642B2 (ko) |
KR (3) | KR100649837B1 (ko) |
CN (3) | CN100359042C (ko) |
MY (3) | MY139698A (ko) |
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JP3801418B2 (ja) * | 1999-05-14 | 2006-07-26 | 株式会社Neomax | 表面処理方法 |
EP1136587B1 (en) | 2000-03-23 | 2013-05-15 | Hitachi Metals, Ltd. | Deposited-film forming apparatus |
JP4715047B2 (ja) * | 2000-07-10 | 2011-07-06 | 日立金属株式会社 | 金属蒸着被膜における突起物生成の抑制方法 |
EP1299570B1 (en) * | 2000-07-10 | 2013-02-27 | Hitachi Metals, Ltd. | Method of inhibiting production of projections in metal deposited film |
TW574398B (en) * | 2002-10-25 | 2004-02-01 | Ritek Display Technology Corp | Evaporation method and equipment for evaporation |
TWI280986B (en) * | 2004-04-30 | 2007-05-11 | Hon Hai Prec Ind Co Ltd | Vacuum vapor deposition apparatus |
US7727565B2 (en) * | 2004-08-25 | 2010-06-01 | Cadbury Adams Usa Llc | Liquid-filled chewing gum composition |
JP4483574B2 (ja) * | 2004-12-27 | 2010-06-16 | 日立金属株式会社 | 蒸着被膜形成方法 |
CN101643892B (zh) * | 2008-08-04 | 2012-03-28 | 鸿富锦精密工业(深圳)有限公司 | 溅镀治具 |
GB0900106D0 (en) | 2009-01-05 | 2009-02-11 | Seating Design & Dev Ltd | A locking device for locking an object on a support structure |
US9182000B2 (en) * | 2009-03-31 | 2015-11-10 | Sanofi-Aventis Deutschland Gmbh | Spring element for a drug delivery device, use thereof and drug delivery device |
JP5088596B2 (ja) * | 2010-09-30 | 2012-12-05 | 日立金属株式会社 | R−t−b系焼結磁石の製造方法 |
CN102424957B (zh) * | 2011-12-07 | 2013-06-19 | 山东国晶新材料有限公司 | 一种气相沉积用多层制品支架及化学气相沉积反应室 |
JP5799837B2 (ja) * | 2012-01-31 | 2015-10-28 | 日立金属株式会社 | 表面処理用治具 |
CN104480440A (zh) | 2014-11-05 | 2015-04-01 | 烟台首钢磁性材料股份有限公司 | 小尺寸钕铁硼磁体表面真空镀膜方法及专用镀膜设备 |
CN104651779A (zh) | 2015-02-11 | 2015-05-27 | 烟台首钢磁性材料股份有限公司 | 一种用于钕铁硼磁体的镀膜设备及镀膜工艺 |
CN109423629B (zh) * | 2017-08-31 | 2021-05-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | 圆盘类零件一次性全表面沉积用工件驱动装置及气相沉积炉 |
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1999
- 1999-09-20 JP JP26540099A patent/JP3192642B2/ja not_active Expired - Lifetime
- 1999-09-20 EP EP99118543A patent/EP0992605A3/en not_active Withdrawn
- 1999-09-29 CN CNB2005100047776A patent/CN100359042C/zh not_active Expired - Lifetime
- 1999-09-29 CN CNB2005100047780A patent/CN100355936C/zh not_active Expired - Lifetime
- 1999-09-29 CN CNB991205308A patent/CN1207435C/zh not_active Expired - Lifetime
- 1999-09-29 US US09/407,304 patent/US6280792B1/en not_active Expired - Lifetime
- 1999-10-01 MY MYPI20052784A patent/MY139698A/en unknown
- 1999-10-01 MY MYPI99004247A patent/MY117198A/en unknown
- 1999-10-01 MY MYPI20034447A patent/MY127770A/en unknown
- 1999-10-02 KR KR1019990042464A patent/KR100649837B1/ko active IP Right Grant
-
2001
- 2001-06-19 US US09/883,232 patent/US6878210B2/en not_active Expired - Lifetime
- 2001-06-19 US US09/883,334 patent/US6821560B2/en not_active Expired - Lifetime
-
2006
- 2006-03-27 KR KR1020060027620A patent/KR100680339B1/ko active IP Right Grant
- 2006-03-27 KR KR1020060027623A patent/KR100649853B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN1654705A (zh) | 2005-08-17 |
KR100649837B1 (ko) | 2006-11-24 |
CN100355936C (zh) | 2007-12-19 |
MY117198A (en) | 2004-05-31 |
CN1207435C (zh) | 2005-06-22 |
US6821560B2 (en) | 2004-11-23 |
KR100649853B1 (ko) | 2006-11-28 |
US20010036507A1 (en) | 2001-11-01 |
MY127770A (en) | 2006-12-29 |
MY139698A (en) | 2009-10-30 |
CN1654706A (zh) | 2005-08-17 |
US6878210B2 (en) | 2005-04-12 |
CN1250822A (zh) | 2000-04-19 |
KR20060030098A (ko) | 2006-04-07 |
KR20000028790A (ko) | 2000-05-25 |
CN100359042C (zh) | 2008-01-02 |
US6280792B1 (en) | 2001-08-28 |
EP0992605A3 (en) | 2002-11-13 |
JP2000169964A (ja) | 2000-06-20 |
EP0992605A2 (en) | 2000-04-12 |
US20010033896A1 (en) | 2001-10-25 |
KR20060030099A (ko) | 2006-04-07 |
JP3192642B2 (ja) | 2001-07-30 |
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