JPS57131363A - Ion plating device - Google Patents

Ion plating device

Info

Publication number
JPS57131363A
JPS57131363A JP1383681A JP1383681A JPS57131363A JP S57131363 A JPS57131363 A JP S57131363A JP 1383681 A JP1383681 A JP 1383681A JP 1383681 A JP1383681 A JP 1383681A JP S57131363 A JPS57131363 A JP S57131363A
Authority
JP
Japan
Prior art keywords
members
contact
worked
lead
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1383681A
Other languages
Japanese (ja)
Other versions
JPH021228B2 (en
Inventor
Mitsugi Enomoto
Masao Koshi
Shotaro Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP1383681A priority Critical patent/JPS57131363A/en
Publication of JPS57131363A publication Critical patent/JPS57131363A/en
Publication of JPH021228B2 publication Critical patent/JPH021228B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To make the position setting of electrodes optimum and to expand the free treating space for the purpose of uniform vapor deposition treatment by bringing the lead-in contacts of the anode and cathode provided on the outside freely slidingly with the sliding contacts provided in a working chamber. CONSTITUTION:Members 5 to be worked are mounted to the revolving shafts 18 for the members to be worked inside of a frame body 2 of a mounting base for the members to be worked, and said body 2 is mounted in a working chamber 1. The cathode lead-in contact 12a, main anode lead-in contact 16a, and auxiliary anode lead-in contact 15a provided on the outside of the body 2 are brought into sliding contact with the sliding contacts 12, 16, 15 provided in the chamber 1. The material evaporated from an evaporating material support body 8 is ionized by a main electrode 10 and is deposited on the members 5. At this time, sufficient ionization is caused in places remote from the evaporating source as well by an auxiliary electrode 14. The materials 5 rotate while revolving around the shafts 18, whereby the uniform vapor deposition films are applied thereon. The ion atmosphere in the treating space is controlled by regulating the power sources 19, 20, 21 of the electrodes 4, 10, 14.
JP1383681A 1981-02-03 1981-02-03 Ion plating device Granted JPS57131363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1383681A JPS57131363A (en) 1981-02-03 1981-02-03 Ion plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1383681A JPS57131363A (en) 1981-02-03 1981-02-03 Ion plating device

Publications (2)

Publication Number Publication Date
JPS57131363A true JPS57131363A (en) 1982-08-14
JPH021228B2 JPH021228B2 (en) 1990-01-10

Family

ID=11844355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1383681A Granted JPS57131363A (en) 1981-02-03 1981-02-03 Ion plating device

Country Status (1)

Country Link
JP (1) JPS57131363A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310964A (en) * 1987-05-29 1988-12-19 インコ、リミテッド Plazma coating process and equipment for carrying out it
US6280792B1 (en) 1998-10-02 2001-08-28 Sumitomo Special Metals Co., Ltd. Surface-treating process using support member having plate-like elements
CN105986229A (en) * 2016-06-27 2016-10-05 广东腾胜真空技术工程有限公司 Uniformity multi-arc ion coating device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145336A (en) * 1979-05-01 1980-11-12 Yoichi Murayama High frequency ion-plating device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145336A (en) * 1979-05-01 1980-11-12 Yoichi Murayama High frequency ion-plating device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310964A (en) * 1987-05-29 1988-12-19 インコ、リミテッド Plazma coating process and equipment for carrying out it
US6280792B1 (en) 1998-10-02 2001-08-28 Sumitomo Special Metals Co., Ltd. Surface-treating process using support member having plate-like elements
US6821560B2 (en) 1998-10-02 2004-11-23 Neomax Co. Ltd. Surface-treating support member and method using the same
US6878210B2 (en) 1998-10-02 2005-04-12 Sumitomo Special Metals Co., Ltd. Surface-treating holder having tubular structure and method using the same
KR100649837B1 (en) * 1998-10-02 2006-11-24 가부시키가이샤 네오맥스 Surface-treating support member, surface-treating holder, surface-treating process, and surface-treating apparatus
CN105986229A (en) * 2016-06-27 2016-10-05 广东腾胜真空技术工程有限公司 Uniformity multi-arc ion coating device

Also Published As

Publication number Publication date
JPH021228B2 (en) 1990-01-10

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