JPS5514813A - Forming method for thin film on substrate - Google Patents

Forming method for thin film on substrate

Info

Publication number
JPS5514813A
JPS5514813A JP8518278A JP8518278A JPS5514813A JP S5514813 A JPS5514813 A JP S5514813A JP 8518278 A JP8518278 A JP 8518278A JP 8518278 A JP8518278 A JP 8518278A JP S5514813 A JPS5514813 A JP S5514813A
Authority
JP
Japan
Prior art keywords
substrate
coating film
under
power source
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8518278A
Other languages
Japanese (ja)
Inventor
Takaaki Miyashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP8518278A priority Critical patent/JPS5514813A/en
Publication of JPS5514813A publication Critical patent/JPS5514813A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To improve the operation efficiency remarkably, by enabling to carry out the under coating and main coating in vacuous belljar continuously. CONSTITUTION:The belljar 1 is made vacuous by exhausting from the exhausting nozzle 13 and inactive gas is introduced from the valve 4 and then, the gas is ionized supplying high frequency voltage to the coil 5. On this occasion, the metal plate 7, 7' for under coating, is placed at the position as shown in the figure. Then, the under coating film is formed on the substrate 9 by applying th direct current power source for acceleration 11 on the substrate 9. When the under coat film is reached a fix thickness, the plate 7, 7' are put in the covering frame 8, 8' and the main coating process is carried out. The main coating film is formed on the under coating film of the substrate, for example, on occasion of carying out vacuum evaporation, the high frequency power source 6 and the power source 11, are made OFF and current is turned on the evaporation source 13 from the power source for evaporation 15. Then, the evaporation material 14 is fused and vaporized and the main coating film is formed on the under coating film of the substrate 9. Also, the main coating is able to carry out by ion plating method.
JP8518278A 1978-07-14 1978-07-14 Forming method for thin film on substrate Pending JPS5514813A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8518278A JPS5514813A (en) 1978-07-14 1978-07-14 Forming method for thin film on substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8518278A JPS5514813A (en) 1978-07-14 1978-07-14 Forming method for thin film on substrate

Publications (1)

Publication Number Publication Date
JPS5514813A true JPS5514813A (en) 1980-02-01

Family

ID=13851507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8518278A Pending JPS5514813A (en) 1978-07-14 1978-07-14 Forming method for thin film on substrate

Country Status (1)

Country Link
JP (1) JPS5514813A (en)

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