JPS6324068A - Continuous vacuum deposition plating device - Google Patents

Abstract

PURPOSE:To form a metal plated film having excellent adhesive strength and quality by ionizing the metal vaporized particles by high-frequency glow discharge, and providing an auxiliary cathode in the vicinity of a steel sheet to accelerate the ionized metal particles when the metal vaporized particles are vapor-deposited and plated on the surface of the steel sheet traveling in a vacuum deposition vessel. CONSTITUTION:A long-sized steel sheet 7 is wound on a roll and continuously traveled in the vacuum deposition vessel 1, a plating metal such as Zn melted in a melting furnace 6 on the outside of the vacuum deposition vessel is introduced into a duct 2 in the vacuum deposition vessel 1 and vapor-deposited on the surface of the steel sheet 7 as vaporized particles 3. In this case, a high-frequency electrode 9 is arranged above the An vaporization source 5 in the duct 2, a high-frequency voltage is impressed from an electric power source 15 to generate high-frequency glow discharge between the electrode and the duct 2, and the Zn vaporized particles are positively ionized to obtain the particles 8. Besides, the frame-like auxiliary cathode 10 is arranged in front of the steel sheet 7, and hence the positively ionized Zn particles 8 are highly accelerated, collided with the steel sheet 7 at a high speed, and deposited on the surface to form a Zn plated film having excellent adhesive strength and high quality.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a plating apparatus that performs plating by continuous vacuum deposition.

[Prior art]

As an example of a conventional vacuum evaporation apparatus, Fig. 6 shows a continuous vacuum evaporation galvanizing apparatus for performing zinc plating. Here, 5
The evaporated zinc particles 3 emitted from the zinc bath evaporation source 5 at about 00° C. move in a vacuum of about 10 to 2 Torr only by the ejection energy, and are deposited on the surface of the steel plate 7 to form a film.

[Problems to be solved by this invention]

In such conventional continuous vacuum evaporation plating, the evaporated metal particles collide with the steel plate only with the kinetic energy given in the form of thermal energy during evaporation, so that satisfactory quality in terms of adhesion and film quality cannot be obtained.

The use of high-frequency glow discharge cannot be considered as a solution to these problems, but it is necessary to apply a negative bias voltage to the steel plate so that positive metal ion particles are attracted to the steel plate surface. Therefore, insulation is difficult.

It is also possible to accelerate the ions by raising the potential on the evaporation source side, but the operability will be very poor.In addition, since vacuum sealing is difficult in continuous vacuum evaporation plating, it is possible to accelerate the ions in the low vacuum region (10"-2 Torr). There was a problem with maintaining a stable discharge because the evaporation was carried out using

SUMMARY OF THE INVENTION Therefore, the present invention provides a plating apparatus that can solve the problems of the conventional continuous vacuum evaporation method as described above, increase the adhesion between the evaporated metal particles and the steel plate, and improve the film quality of the evaporated metal. The purpose is to

[Structure of the invention]

The continuous vacuum evaporation plating apparatus according to the present invention is characterized in that a high frequency electrode is provided near the metal bath evaporation source to ionize the evaporated metal particles, and an auxiliary cathode is provided near the steel plate to accelerate the ionized metal particles. be.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained below with reference to illustrated embodiments.

Figure 1 shows the continuous vacuum evaporation galvanizing apparatus of this embodiment. Here, a high frequency electrode 9 is placed above the evaporation source 5 in the duct 2.
A high-frequency current is supplied to the high-frequency electrode 9 from a high-frequency power supply 15 provided outside the vacuum evaporation apparatus 1 via a matching box 14 . By applying a high frequency current to the high frequency electrode 9, a plasma region 12 is generated between the high frequency electrode 9 and the grounded duct 2 due to high frequency glow discharge. Therefore, the evaporated zinc particles 3 emitted from the evaporation source 5 are ionized by passing through the plasma region 12.

On the other hand, a frame-shaped auxiliary cathode 10 having a width approximately equal to that of the steel plate 7 is provided on the front surface of the steel plate 7 in the duct 2, as shown in a partially enlarged view in FIG. A negative charge is applied from the DC power supply 11.

The current supply lines from the high frequency power source 15 and the DC power source 1 to the high frequency electrode 9 and the auxiliary cathode 10 arranged in this way are insulated at the part where they are inserted into the outer wall and duct 2 of the vacuum evaporation device 1, and the surrounding material 13 protects the device. It is insulated while maintaining its properties.

Here, when a high frequency electric field of about 13.56 MHz is applied to the high frequency electrode 9, a stable high frequency glow discharge occurs even in a low vacuum of around 10 -2 Torr due to kneading, and a plasma region 12 is generated.

When the evaporated zinc particles 3 enter here, they are ionized by collision with electrons. Further, since a negative charge is applied to the auxiliary cathode 10 provided between the evaporation source 5 and the steel plate 7,
The positive ion zinc particles 8 are accelerated by this potential difference and collide with the surface of the steel plate 7 with a kinetic energy several hundred times more than that of conventional vacuum evaporation. In this way, moderate ion bombardment creates a strong adhesion (a dense film with few pinholes).Also, since high-frequency glow discharge has a wide discharge area, it is possible to form a film of uniform quality even on a wide steel plate.

Although this embodiment describes the case of zinc plating, it can also be applied to continuous vacuum deposition of metals such as At and Ri, and inorganic and organic materials such as Al2O3.

〔Effect of the invention〕

The embodiments of the continuous vacuum evaporation plating apparatus according to the present invention are as described above, and the following effects can be achieved.

By ionizing the evaporated metal particles by high-frequency glow discharge, electrical energy can be applied to improve the adhesion to the steel plate and the film quality of the evaporated metal.

[Brief explanation of drawings]

Figure 1 of the blade is a configuration diagram of the device of the embodiment, Figure 2 of the blade is a partially enlarged view of the auxiliary cathode, and Figure 3 of the blade is a configuration diagram of the device of a conventional example. 1... Vacuum deposition tank, 2... Duct, 3
... Evaporated zinc particles, 4 ... Shutter, 5 ... Evaporation source, 6 ... External melting furnace,
7... Steel plate, 8... Positively ionized evaporated zinc particles, 9... High frequency electrode, 10...
...Auxiliary cathode, 11...DC power supply, 12...
...Plasma region, 13...Insulating material, 14...
...Matching box, 15...High frequency power supply.

Claims (1)

[Claims] In a plating device that performs vacuum evaporation on a steel plate with metal particles emitted from a metal bath evaporation source, a high frequency electrode is provided near the evaporation source to ionize the evaporated metal particles, and an auxiliary electrode is provided near the steel plate. A continuous vacuum evaporation plating apparatus characterized in that a cathode is provided to accelerate the ionized metal particles.