JPS55145336A - High frequency ion-plating device - Google Patents

High frequency ion-plating device

Info

Publication number
JPS55145336A
JPS55145336A JP5371579A JP5371579A JPS55145336A JP S55145336 A JPS55145336 A JP S55145336A JP 5371579 A JP5371579 A JP 5371579A JP 5371579 A JP5371579 A JP 5371579A JP S55145336 A JPS55145336 A JP S55145336A
Authority
JP
Japan
Prior art keywords
evaporation
source
substrate
high frequency
rotary rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5371579A
Other languages
Japanese (ja)
Other versions
JPS5741807B2 (en
Inventor
Yoichi Murayama
Tetsuya Nomachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEW PLATING KK
NEW PUREITEINGU KK
Original Assignee
NEW PLATING KK
NEW PUREITEINGU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEW PLATING KK, NEW PUREITEINGU KK filed Critical NEW PLATING KK
Priority to JP5371579A priority Critical patent/JPS55145336A/en
Publication of JPS55145336A publication Critical patent/JPS55145336A/en
Publication of JPS5741807B2 publication Critical patent/JPS5741807B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE:To increase a substrate attachment effective area by forming a source of evaporation into an oblong shape and by rotating a substrate around or above the source of evaporation. CONSTITUTION:An oblong-shaped source of evaporation, consisted of electrodes 4 and 4' to be used for heating and a heating material 5, is formed in an evaporation chamber 3. Also a high frequency discharging electrode 6 is arranged in an oblong shape, and a high frequency discharge is performed between the electrode 6 and the electrodes 4 and 4'. On the other hand, a rotary rod 9 with a universal hook 8 supporting a substrate is provided in an upright position on a ring-formed base disk 7. A rotary basket 12 is rotated around the source of evaporation by a gear 7a when a shaft 14 is turned round. At the same time, the rotary rod 9 also rotates on its own axis by a gear 1a and 16. Therefore, while the substrate supported by hook 8 rotates around the source of evaporation, it is rotated by the rotary rod, thereby enabling to give a uniform treatment to a number of substrates at a time.
JP5371579A 1979-05-01 1979-05-01 High frequency ion-plating device Granted JPS55145336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5371579A JPS55145336A (en) 1979-05-01 1979-05-01 High frequency ion-plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5371579A JPS55145336A (en) 1979-05-01 1979-05-01 High frequency ion-plating device

Publications (2)

Publication Number Publication Date
JPS55145336A true JPS55145336A (en) 1980-11-12
JPS5741807B2 JPS5741807B2 (en) 1982-09-04

Family

ID=12950521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5371579A Granted JPS55145336A (en) 1979-05-01 1979-05-01 High frequency ion-plating device

Country Status (1)

Country Link
JP (1) JPS55145336A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131363A (en) * 1981-02-03 1982-08-14 Citizen Watch Co Ltd Ion plating device
JPS5892214A (en) * 1981-11-28 1983-06-01 Yoichi Murayama High-frequency ion plating device
JPH01263266A (en) * 1988-04-13 1989-10-19 Tokuda Seisakusho Ltd Vacuum deposition device
US6280792B1 (en) 1998-10-02 2001-08-28 Sumitomo Special Metals Co., Ltd. Surface-treating process using support member having plate-like elements
JP2010275616A (en) * 2009-06-01 2010-12-09 Goto Seiko:Kk Ion plating apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131363A (en) * 1981-02-03 1982-08-14 Citizen Watch Co Ltd Ion plating device
JPH021228B2 (en) * 1981-02-03 1990-01-10 Citizen Watch Co Ltd
JPS5892214A (en) * 1981-11-28 1983-06-01 Yoichi Murayama High-frequency ion plating device
JPS6231813B2 (en) * 1981-11-28 1987-07-10 Yoichi Murayama
JPH01263266A (en) * 1988-04-13 1989-10-19 Tokuda Seisakusho Ltd Vacuum deposition device
US6280792B1 (en) 1998-10-02 2001-08-28 Sumitomo Special Metals Co., Ltd. Surface-treating process using support member having plate-like elements
US6821560B2 (en) 1998-10-02 2004-11-23 Neomax Co. Ltd. Surface-treating support member and method using the same
US6878210B2 (en) 1998-10-02 2005-04-12 Sumitomo Special Metals Co., Ltd. Surface-treating holder having tubular structure and method using the same
JP2010275616A (en) * 2009-06-01 2010-12-09 Goto Seiko:Kk Ion plating apparatus

Also Published As

Publication number Publication date
JPS5741807B2 (en) 1982-09-04

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