KR100652983B1 - 플라즈마 처리 장치 및 방법 - Google Patents

플라즈마 처리 장치 및 방법 Download PDF

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Publication number
KR100652983B1
KR100652983B1 KR1020057009448A KR20057009448A KR100652983B1 KR 100652983 B1 KR100652983 B1 KR 100652983B1 KR 1020057009448 A KR1020057009448 A KR 1020057009448A KR 20057009448 A KR20057009448 A KR 20057009448A KR 100652983 B1 KR100652983 B1 KR 100652983B1
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KR
South Korea
Prior art keywords
upper electrode
plasma
electrode
high frequency
processing apparatus
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Expired - Fee Related
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KR1020057009448A
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English (en)
Korean (ko)
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KR20050086834A (ko
Inventor
아키라 고시이시
준 히로세
마사히로 오가사와라
다이치 히라노
히로미츠 사사키
데츠오 요시다
미치시게 사이토
히로유키 이시하라
준 오오야부
고지 누마타
Original Assignee
동경 엘렉트론 주식회사
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Publication of KR20050086834A publication Critical patent/KR20050086834A/ko
Application granted granted Critical
Publication of KR100652983B1 publication Critical patent/KR100652983B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020057009448A 2002-11-26 2003-11-25 플라즈마 처리 장치 및 방법 Expired - Fee Related KR100652983B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00341949 2002-11-26
JP2002341949 2002-11-26
JP2003358425A JP4584565B2 (ja) 2002-11-26 2003-10-17 プラズマ処理装置及びプラズマ処理方法
JPJP-P-2003-00358425 2003-10-17
PCT/JP2003/015030 WO2004049420A1 (ja) 2002-11-26 2003-11-25 プラズマ処理装置及び方法

Publications (2)

Publication Number Publication Date
KR20050086834A KR20050086834A (ko) 2005-08-30
KR100652983B1 true KR100652983B1 (ko) 2006-12-01

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KR1020057009448A Expired - Fee Related KR100652983B1 (ko) 2002-11-26 2003-11-25 플라즈마 처리 장치 및 방법

Country Status (7)

Country Link
US (1) US7506610B2 (https=)
JP (1) JP4584565B2 (https=)
KR (1) KR100652983B1 (https=)
CN (1) CN100459059C (https=)
AU (1) AU2003284684A1 (https=)
TW (1) TW200416874A (https=)
WO (1) WO2004049420A1 (https=)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7988816B2 (en) 2004-06-21 2011-08-02 Tokyo Electron Limited Plasma processing apparatus and method
KR101247857B1 (ko) * 2004-06-21 2013-03-26 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
US7951262B2 (en) 2004-06-21 2011-05-31 Tokyo Electron Limited Plasma processing apparatus and method
JP4550507B2 (ja) * 2004-07-26 2010-09-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
US7507670B2 (en) * 2004-12-23 2009-03-24 Lam Research Corporation Silicon electrode assembly surface decontamination by acidic solution
US7674393B2 (en) * 2005-03-25 2010-03-09 Tokyo Electron Limited Etching method and apparatus
US7993489B2 (en) 2005-03-31 2011-08-09 Tokyo Electron Limited Capacitive coupling plasma processing apparatus and method for using the same
JP4642528B2 (ja) * 2005-03-31 2011-03-02 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
JP2007234770A (ja) * 2006-02-28 2007-09-13 Tokyo Electron Ltd プラズマエッチング方法およびコンピュータ読み取り可能な記憶媒体
US8157953B2 (en) 2006-03-29 2012-04-17 Tokyo Electron Limited Plasma processing apparatus
US8034213B2 (en) 2006-03-30 2011-10-11 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US7829463B2 (en) 2006-03-30 2010-11-09 Tokyo Electron Limited Plasma processing method and plasma processing apparatus
JP5116983B2 (ja) * 2006-03-30 2013-01-09 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
JP5057768B2 (ja) * 2006-12-19 2012-10-24 株式会社ライフ技術研究所 直流プラズマ成膜装置
JP5474291B2 (ja) * 2007-11-05 2014-04-16 株式会社アルバック アッシング装置
JP2009239012A (ja) * 2008-03-27 2009-10-15 Tokyo Electron Ltd プラズマ処理装置及びプラズマエッチング方法
US8367965B2 (en) * 2008-08-28 2013-02-05 Hermes-Epitek Corp. Electrode design for plasma processing chamber
CN102365906B (zh) * 2009-02-13 2016-02-03 应用材料公司 用于等离子体腔室电极的rf总线与rf回流总线
JP5566389B2 (ja) * 2009-09-25 2014-08-06 京セラ株式会社 堆積膜形成装置および堆積膜形成方法
JP5312369B2 (ja) * 2010-02-22 2013-10-09 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
TWI474365B (zh) * 2010-08-25 2015-02-21 Canon Anelva Corp And a method of manufacturing the plasma processing apparatus and apparatus
JP5709505B2 (ja) * 2010-12-15 2015-04-30 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理方法、および記憶媒体
KR101171988B1 (ko) 2011-03-30 2012-08-07 엘아이지에이디피 주식회사 플라즈마 처리장치
TWI638587B (zh) 2011-10-05 2018-10-11 美商應用材料股份有限公司 對稱電漿處理腔室
CN103377868A (zh) * 2012-04-14 2013-10-30 靖江先锋半导体科技有限公司 一种刻蚀电极机中的下电极装置
US9745663B2 (en) * 2012-07-20 2017-08-29 Applied Materials, Inc. Symmetrical inductively coupled plasma source with symmetrical flow chamber
US10249470B2 (en) * 2012-07-20 2019-04-02 Applied Materials, Inc. Symmetrical inductively coupled plasma source with coaxial RF feed and coaxial shielding
US9082590B2 (en) 2012-07-20 2015-07-14 Applied Materials, Inc. Symmetrical inductively coupled plasma source with side RF feeds and RF distribution plates
US9928987B2 (en) * 2012-07-20 2018-03-27 Applied Materials, Inc. Inductively coupled plasma source with symmetrical RF feed
US9449794B2 (en) * 2012-07-20 2016-09-20 Applied Materials, Inc. Symmetrical inductively coupled plasma source with side RF feeds and spiral coil antenna
US10170279B2 (en) 2012-07-20 2019-01-01 Applied Materials, Inc. Multiple coil inductively coupled plasma source with offset frequencies and double-walled shielding
JP6120527B2 (ja) * 2012-11-05 2017-04-26 東京エレクトロン株式会社 プラズマ処理方法
CN107221487B (zh) 2013-03-15 2019-06-28 应用材料公司 具有高度对称四重式气体注入的等离子体反应器
JP6249659B2 (ja) 2013-07-25 2017-12-20 東京エレクトロン株式会社 プラズマ処理装置
JP2017157778A (ja) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 基板処理装置
KR101938306B1 (ko) * 2016-04-18 2019-01-14 최상준 건식 에칭장치의 제어방법
KR101909479B1 (ko) 2016-10-06 2018-10-19 세메스 주식회사 기판 지지 유닛, 그를 포함하는 기판 처리 장치, 그리고 그 제어 방법
JP6846776B2 (ja) * 2016-11-30 2021-03-24 東京エレクトロン株式会社 プラズマ処理装置
CN108257840B (zh) * 2016-12-29 2021-03-30 中微半导体设备(上海)股份有限公司 一种等离子处理装置
JP6836976B2 (ja) * 2017-09-26 2021-03-03 東京エレクトロン株式会社 プラズマ処理装置
JP7345382B2 (ja) * 2018-12-28 2023-09-15 東京エレクトロン株式会社 プラズマ処理装置及び制御方法
TWI846953B (zh) * 2019-10-08 2024-07-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基板處理裝置
CN113936985B (zh) * 2020-07-14 2025-03-11 东京毅力科创株式会社 等离子体处理装置和等离子体处理方法
JP7446190B2 (ja) * 2020-09-23 2024-03-08 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ生成方法
KR20230107477A (ko) * 2020-11-18 2023-07-17 램 리써치 코포레이션 임피던스 매칭을 위한 균일도 제어 회로
CN118098916A (zh) * 2022-11-28 2024-05-28 中微半导体设备(上海)股份有限公司 晶圆斜面蚀刻设备和方法
CN118824825B (zh) * 2023-04-17 2026-03-17 中微半导体设备(上海)股份有限公司 一种等离子体处理设备及其安装维护方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637051A (ja) * 1992-07-15 1994-02-10 Tokyo Electron Ltd プラズマ装置
JP3499104B2 (ja) * 1996-03-01 2004-02-23 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
JPH10134995A (ja) * 1996-10-28 1998-05-22 Toshiba Corp プラズマ処理装置及びプラズマ処理方法
JPH10172792A (ja) * 1996-12-05 1998-06-26 Tokyo Electron Ltd プラズマ処理装置
JP3704023B2 (ja) * 1999-04-28 2005-10-05 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
JP4322350B2 (ja) * 1999-05-06 2009-08-26 東京エレクトロン株式会社 プラズマ処理装置
JP4454718B2 (ja) 1999-05-07 2010-04-21 東京エレクトロン株式会社 プラズマ処理装置およびそれに用いられる電極
JP2001313286A (ja) * 2000-02-24 2001-11-09 Tokyo Electron Ltd 平行平板型ドライエッチング装置
US7030335B2 (en) * 2000-03-17 2006-04-18 Applied Materials, Inc. Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
US6528751B1 (en) * 2000-03-17 2003-03-04 Applied Materials, Inc. Plasma reactor with overhead RF electrode tuned to the plasma
US6894245B2 (en) * 2000-03-17 2005-05-17 Applied Materials, Inc. Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
KR100552641B1 (ko) * 2000-04-27 2006-02-20 가부시끼가이샤 히다치 세이사꾸쇼 플라즈마처리장치 및 플라즈마처리방법

Also Published As

Publication number Publication date
CN100459059C (zh) 2009-02-04
US20050257743A1 (en) 2005-11-24
TWI321814B (https=) 2010-03-11
JP4584565B2 (ja) 2010-11-24
CN1717788A (zh) 2006-01-04
AU2003284684A1 (en) 2004-06-18
KR20050086834A (ko) 2005-08-30
WO2004049420A1 (ja) 2004-06-10
US7506610B2 (en) 2009-03-24
TW200416874A (en) 2004-09-01
JP2004193566A (ja) 2004-07-08

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