KR100640130B1 - 집적 회로 상호 접속 시스템 - Google Patents
집적 회로 상호 접속 시스템 Download PDFInfo
- Publication number
- KR100640130B1 KR100640130B1 KR1020017010806A KR20017010806A KR100640130B1 KR 100640130 B1 KR100640130 B1 KR 100640130B1 KR 1020017010806 A KR1020017010806 A KR 1020017010806A KR 20017010806 A KR20017010806 A KR 20017010806A KR 100640130 B1 KR100640130 B1 KR 100640130B1
- Authority
- KR
- South Korea
- Prior art keywords
- node
- integrated circuit
- interconnect system
- capacitive element
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
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- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H01L2924/30111—Impedance matching
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Filters And Equalizers (AREA)
- Wire Bonding (AREA)
- Waveguide Connection Structure (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/258,185 | 1999-02-25 | ||
| US09/258,185 US6448865B1 (en) | 1999-02-25 | 1999-02-25 | Integrated circuit interconnect system |
| US09/510,657 US6459343B1 (en) | 1999-02-25 | 2000-02-22 | Integrated circuit interconnect system forming a multi-pole filter |
| US09/510,657 | 2000-02-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020013504A KR20020013504A (ko) | 2002-02-20 |
| KR100640130B1 true KR100640130B1 (ko) | 2006-10-31 |
Family
ID=26946481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020017010806A Expired - Fee Related KR100640130B1 (ko) | 1999-02-25 | 2000-02-23 | 집적 회로 상호 접속 시스템 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6459343B1 (enExample) |
| EP (1) | EP1200990A2 (enExample) |
| JP (2) | JP2003526901A (enExample) |
| KR (1) | KR100640130B1 (enExample) |
| WO (1) | WO2000051012A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200129663A (ko) * | 2019-05-09 | 2020-11-18 | 베렉스주식회사 | 반도체 장치 |
Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
| US5729150A (en) | 1995-12-01 | 1998-03-17 | Cascade Microtech, Inc. | Low-current probe card with reduced triboelectric current generating cables |
| US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US6034533A (en) | 1997-06-10 | 2000-03-07 | Tervo; Paul A. | Low-current pogo probe card |
| US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
| US6538538B2 (en) | 1999-02-25 | 2003-03-25 | Formfactor, Inc. | High frequency printed circuit board via |
| US6459343B1 (en) * | 1999-02-25 | 2002-10-01 | Formfactor, Inc. | Integrated circuit interconnect system forming a multi-pole filter |
| US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
| US6597227B1 (en) * | 2000-01-21 | 2003-07-22 | Atheros Communications, Inc. | System for providing electrostatic discharge protection for high-speed integrated circuits |
| US6801869B2 (en) * | 2000-02-22 | 2004-10-05 | Mccord Don | Method and system for wafer and device-level testing of an integrated circuit |
| US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
| WO2002025296A2 (en) * | 2000-09-22 | 2002-03-28 | Don Mccord | Method and system for wafer and device-level testing of an integrated circuit |
| DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | Wafersonde |
| WO2002058155A1 (en) * | 2001-01-19 | 2002-07-25 | Koninklijke Philips Electronics N.V. | Semiconductor chip with internal esd matching |
| EP1418680A4 (en) * | 2001-08-10 | 2005-04-06 | Hitachi Metals Ltd | DERIVATION FILTER, MUTIBAND ANTENNA SWITCHING CIRCUIT, LAMINATED MODULE COMPOSITE ELEMENT, AND COMMUNICATION DEVICE USING SAME |
| AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
| US7289302B1 (en) * | 2001-10-04 | 2007-10-30 | Maxtor Corporation | On slider inductors and capacitors to reduce electrostatic discharge damage |
| US6624999B1 (en) * | 2001-11-20 | 2003-09-23 | Intel Corporation | Electrostatic discharge protection using inductors |
| US6816031B1 (en) | 2001-12-04 | 2004-11-09 | Formfactor, Inc. | Adjustable delay transmission line |
| US20030120777A1 (en) * | 2001-12-26 | 2003-06-26 | First Data Corporation | Forms auditing systems and methods |
| DE10214068B4 (de) * | 2002-03-28 | 2009-02-19 | Advanced Micro Devices, Inc., Sunnyvale | ESD-Schutzschaltung für Radiofrequenz-Ausgangsanschlüsse in einer integrierten Schaltung |
| EP1509776A4 (en) | 2002-05-23 | 2010-08-18 | Cascade Microtech Inc | PROBE TO TEST ANY TESTING EQUIPMENT |
| KR100894803B1 (ko) | 2002-06-11 | 2009-04-30 | 세미컨덕터 콤포넨츠 인더스트리즈 엘엘씨 | 반도체 필터 회로 및 방법 |
| US20030235019A1 (en) * | 2002-06-19 | 2003-12-25 | Ming-Dou Ker | Electrostatic discharge protection scheme for flip-chip packaged integrated circuits |
| DE10231638B4 (de) * | 2002-07-12 | 2011-07-28 | Infineon Technologies AG, 81669 | Integrierte Schaltungsanordnung |
| TW573350B (en) * | 2002-10-25 | 2004-01-21 | Via Tech Inc | Integrated circuit with electrostatic discharge protection |
| US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
| JP4744786B2 (ja) * | 2003-04-23 | 2011-08-10 | ルネサスエレクトロニクス株式会社 | 高周波電力増幅モジュール |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| WO2006017078A2 (en) | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| DE112004002554T5 (de) | 2003-12-24 | 2006-11-23 | Cascade Microtech, Inc., Beaverton | Active wafer probe |
| US7388424B2 (en) | 2004-04-07 | 2008-06-17 | Formfactor, Inc. | Apparatus for providing a high frequency loop back with a DC path for a parametric test |
| US7466113B2 (en) * | 2004-07-07 | 2008-12-16 | 02Micro International Limited | Break-before-make sensing for drivers |
| US7327035B2 (en) * | 2004-09-08 | 2008-02-05 | Texas Instruments Incorporated | System and method for providing a low frequency filter pole |
| DE202005021435U1 (de) | 2004-09-13 | 2008-02-28 | Cascade Microtech, Inc., Beaverton | Doppelseitige Prüfaufbauten |
| US7737553B2 (en) | 2004-10-06 | 2010-06-15 | Panasonic Corporation | Semiconductor device |
| US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
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- 2000-02-23 WO PCT/US2000/004715 patent/WO2000051012A2/en not_active Ceased
- 2000-02-23 KR KR1020017010806A patent/KR100640130B1/ko not_active Expired - Fee Related
- 2000-02-23 EP EP00911945A patent/EP1200990A2/en not_active Withdrawn
-
2002
- 2002-08-02 US US10/211,003 patent/US6646520B2/en not_active Expired - Fee Related
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2007
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200129663A (ko) * | 2019-05-09 | 2020-11-18 | 베렉스주식회사 | 반도체 장치 |
| KR102213561B1 (ko) | 2019-05-09 | 2021-02-08 | 베렉스주식회사 | 반도체 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1200990A2 (en) | 2002-05-02 |
| US6646520B2 (en) | 2003-11-11 |
| US20030006856A1 (en) | 2003-01-09 |
| WO2000051012A2 (en) | 2000-08-31 |
| WO2000051012A3 (en) | 2001-02-01 |
| JP2007189241A (ja) | 2007-07-26 |
| JP2003526901A (ja) | 2003-09-09 |
| WO2000051012A8 (en) | 2001-12-06 |
| KR20020013504A (ko) | 2002-02-20 |
| US6459343B1 (en) | 2002-10-01 |
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