JP2003526901A - 集積回路の相互接続システム - Google Patents

集積回路の相互接続システム

Info

Publication number
JP2003526901A
JP2003526901A JP2000601543A JP2000601543A JP2003526901A JP 2003526901 A JP2003526901 A JP 2003526901A JP 2000601543 A JP2000601543 A JP 2000601543A JP 2000601543 A JP2000601543 A JP 2000601543A JP 2003526901 A JP2003526901 A JP 2003526901A
Authority
JP
Japan
Prior art keywords
node
interconnection system
frequency response
inductor
capacitive element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000601543A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003526901A5 (enExample
Inventor
ミラー，チャールズ，エイ
Original Assignee
フォームファクター，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/258,185 external-priority patent/US6448865B1/en
Application filed by フォームファクター，インコーポレイテッド filed Critical フォームファクター，インコーポレイテッド
Publication of JP2003526901A publication Critical patent/JP2003526901A/ja
Publication of JP2003526901A5 publication Critical patent/JP2003526901A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
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    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6611—Wire connections
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Filters And Equalizers (AREA)
  • Wire Bonding (AREA)
  • Waveguide Connection Structure (AREA)
JP2000601543A 1999-02-25 2000-02-23 集積回路の相互接続システム Pending JP2003526901A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/258,185 1999-02-25
US09/258,185 US6448865B1 (en) 1999-02-25 1999-02-25 Integrated circuit interconnect system
US09/510,657 US6459343B1 (en) 1999-02-25 2000-02-22 Integrated circuit interconnect system forming a multi-pole filter
US09/510,657 2000-02-22
PCT/US2000/004715 WO2000051012A2 (en) 1999-02-25 2000-02-23 Integrated circuit interconnect system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007043028A Division JP2007189241A (ja) 1999-02-25 2007-02-22 集積回路の相互接続システム

Publications (2)

Publication Number Publication Date
JP2003526901A true JP2003526901A (ja) 2003-09-09
JP2003526901A5 JP2003526901A5 (enExample) 2007-04-12

Family

ID=26946481

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000601543A Pending JP2003526901A (ja) 1999-02-25 2000-02-23 集積回路の相互接続システム
JP2007043028A Ceased JP2007189241A (ja) 1999-02-25 2007-02-22 集積回路の相互接続システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2007043028A Ceased JP2007189241A (ja) 1999-02-25 2007-02-22 集積回路の相互接続システム

Country Status (5)

Country Link
US (2) US6459343B1 (enExample)
EP (1) EP1200990A2 (enExample)
JP (2) JP2003526901A (enExample)
KR (1) KR100640130B1 (enExample)
WO (1) WO2000051012A2 (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004328190A (ja) * 2003-04-23 2004-11-18 Renesas Technology Corp 高周波電力増幅モジュール
US7737553B2 (en) 2004-10-06 2010-06-15 Panasonic Corporation Semiconductor device
JP2013183072A (ja) * 2012-03-02 2013-09-12 Toshiba Corp 半導体装置
JP2014053566A (ja) * 2012-09-10 2014-03-20 Toshiba Corp 半導体装置
JP2014154870A (ja) * 2013-02-14 2014-08-25 Rohm Co Ltd Ｌｓｉのｅｓｄ保護回路および半導体装置
WO2015076008A1 (ja) * 2013-11-20 2015-05-28 株式会社村田製作所 インピーダンス変換回路および通信端末装置
WO2016063459A1 (ja) * 2014-10-24 2016-04-28 株式会社ソシオネクスト 半導体集積回路装置
WO2016063458A1 (ja) * 2014-10-24 2016-04-28 株式会社ソシオネクスト 半導体集積回路装置
KR20210103416A (ko) * 2020-02-13 2021-08-23 쟈인 에레쿠토로닉스 가부시키가이샤 반도체 장치, 수신 장치, 및, 송신 장치

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US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5729150A (en) 1995-12-01 1998-03-17 Cascade Microtech, Inc. Low-current probe card with reduced triboelectric current generating cables
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6034533A (en) 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6538538B2 (en) 1999-02-25 2003-03-25 Formfactor, Inc. High frequency printed circuit board via
US6459343B1 (en) * 1999-02-25 2002-10-01 Formfactor, Inc. Integrated circuit interconnect system forming a multi-pole filter
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6597227B1 (en) * 2000-01-21 2003-07-22 Atheros Communications, Inc. System for providing electrostatic discharge protection for high-speed integrated circuits
US6801869B2 (en) * 2000-02-22 2004-10-05 Mccord Don Method and system for wafer and device-level testing of an integrated circuit
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
WO2002025296A2 (en) * 2000-09-22 2002-03-28 Don Mccord Method and system for wafer and device-level testing of an integrated circuit
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
WO2002058155A1 (en) * 2001-01-19 2002-07-25 Koninklijke Philips Electronics N.V. Semiconductor chip with internal esd matching
EP1418680A4 (en) * 2001-08-10 2005-04-06 Hitachi Metals Ltd DERIVATION FILTER, MUTIBAND ANTENNA SWITCHING CIRCUIT, LAMINATED MODULE COMPOSITE ELEMENT, AND COMMUNICATION DEVICE USING SAME
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US7289302B1 (en) * 2001-10-04 2007-10-30 Maxtor Corporation On slider inductors and capacitors to reduce electrostatic discharge damage
US6624999B1 (en) * 2001-11-20 2003-09-23 Intel Corporation Electrostatic discharge protection using inductors
US6816031B1 (en) 2001-12-04 2004-11-09 Formfactor, Inc. Adjustable delay transmission line
US20030120777A1 (en) * 2001-12-26 2003-06-26 First Data Corporation Forms auditing systems and methods
DE10214068B4 (de) * 2002-03-28 2009-02-19 Advanced Micro Devices, Inc., Sunnyvale ESD-Schutzschaltung für Radiofrequenz-Ausgangsanschlüsse in einer integrierten Schaltung
EP1509776A4 (en) 2002-05-23 2010-08-18 Cascade Microtech Inc PROBE TO TEST ANY TESTING EQUIPMENT
KR100894803B1 (ko) 2002-06-11 2009-04-30 세미컨덕터 콤포넨츠 인더스트리즈 엘엘씨 반도체 필터 회로 및 방법
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