JP3982689B2 - 無線通信機能を含む装置 - Google Patents
無線通信機能を含む装置 Download PDFInfo
- Publication number
- JP3982689B2 JP3982689B2 JP2002566592A JP2002566592A JP3982689B2 JP 3982689 B2 JP3982689 B2 JP 3982689B2 JP 2002566592 A JP2002566592 A JP 2002566592A JP 2002566592 A JP2002566592 A JP 2002566592A JP 3982689 B2 JP3982689 B2 JP 3982689B2
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- matching
- switch
- present
- antenna device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004891 communication Methods 0.000 title claims description 5
- 239000004020 conductor Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 8
- PEZNEXFPRSOYPL-UHFFFAOYSA-N (bis(trifluoroacetoxy)iodo)benzene Chemical compound FC(F)(F)C(=O)OI(OC(=O)C(F)(F)F)C1=CC=CC=C1 PEZNEXFPRSOYPL-UHFFFAOYSA-N 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 18
- 230000008901 benefit Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 241000132007 Bahia Species 0.000 description 2
- 229930194845 Bahia Natural products 0.000 description 2
- 235000017858 Laurus nobilis Nutrition 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- -1 aluminum-germanium Chemical compound 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/06—Details
- H01Q9/14—Length of element or elements adjustable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
- H01Q5/328—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors between a radiating element and ground
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0442—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular tuning means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Support Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
- Transceivers (AREA)
- Telephone Set Structure (AREA)
- Mobile Radio Communication Systems (AREA)
Description
2…アンテナ
3…リアクタンス素子
3a…キャパシタ
3b…キャパシタ
3c…キャパシタ
3d…キャパシタ
4…リアクタンス素子
5…バイア
6…相互接続部
7…モジュールコンタクトパッド
8…第一側部
9…第二側部
10…アンテナデバイス
11…集積回路
12…RXバランフィルタ1
13…TXバランフィルタ
14…TX/RXスイッチ
15…バンドパスフィルタ
16…VCOタンク
17…PLLループフィルタ
18…供給デカップリングユニット
19…入力端子
20…プリント回路ボード
21…アース導体
22…ボードコンタクトパッド
23…バイア
25…スイッチ
25a…スイッチ
25b…スイッチ
25c…スイッチ
25d…スイッチ
26a…スイッチ
26b…スイッチ
27…スイッチ
28…第一側部
29…第二側部
31…入力端子
32…アース端子
33…マッチングブリッジ端子
34…マッチングブリッジ
35…マッチングブリッジ
36…マッチングブリッジ
37…マッチングブリッジ
38…マッチングブリッジ
39…マッチングブリッジ
43…相互接続部
44…バイアパッド
46…ボードコンタクトパッド
47…モジュールコンタクトパッド
50…アンテナデバイス
51…共振回路
52…キャパシタ
53…インダクタ
100…装置
110…装置
Claims (6)
- 第一側部と、これと反対側の第二側部とを有し、かつアース導体が設けられているプリント回路基板を有し、この第一側部に入力インピーダンスを有するアンテナを有するアンテナデバイスが存在する、無線通信機能を有する装置において、
前記アンテナデバイスは、
第一側部と、これと反対側の第二側部とを有する基板と、
前記基板の前記第一側部に存在する PIFA タイプまたはタッチタイプのアンテナと、
を有し、
前記装置は、当該入力インピーダンスを調整するための手段を更に有し、
当該手段は、前記基板の前記第一側部の前記アンテナデバイスに存在するリアクタンス素子をそれぞれ有する第一及び第二のマッチングブリッジと、前記基板の前記第二側部のモジュールコンタクトパッドと、前記プリント回路基板の前記第一側部のボードコンタクトパッドと、前記プリント回路基板に存在するスイッチとを有し、前記ブリッジのそれぞれは、前記アンテナの箇所と前記アース導体の箇所との間に存在し、
集積回路及びフィルタが、前記アンテナデバイスの前記基板の前記第一側部に存在し、
前記マッチングブリッジのうち少なくとも1つが、前記装置の前記プリント回路基板の前記アース導体に接続されていることを特徴とする、装置。 - 前記アンテナデバイスは、前記アンテナと前記アース導体との間に共振回路を更に有する、請求項1に記載の装置。
- 前記リアクタンス素子は、受動素子のアレイに集積化されている、請求項1に記載の装置。
- 前記マッチングブリッジの前記モジュールコンタクトパッドは、ボールグリッドアレイまたはランドグリッドアレイの一部であることを特徴とする、請求項1に記載の装置。
- 前記集積回路は送受信装置であることを特徴とする、請求項1に記載の装置。
- 請求項1に記載の装置のアンテナを調整する方法であって、
前記アンテナの入力インピーダンスを測定するステップと、
当該スイッチの少なくとも1つのスイッチをオンまたはオフにすることによって、前記アンテナの前記入力インピーダンスを適合化するステップと、
を有する、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01200502 | 2001-02-13 | ||
PCT/IB2002/000440 WO2002067375A1 (en) | 2001-02-13 | 2002-02-13 | Patch antenna with switchable reactive components for multiple frequency use in mobile communications |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004520746A JP2004520746A (ja) | 2004-07-08 |
JP3982689B2 true JP3982689B2 (ja) | 2007-09-26 |
Family
ID=8179882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002566592A Expired - Fee Related JP3982689B2 (ja) | 2001-02-13 | 2002-02-13 | 無線通信機能を含む装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6819293B2 (ja) |
EP (1) | EP1362388B1 (ja) |
JP (1) | JP3982689B2 (ja) |
AT (1) | ATE365985T1 (ja) |
DE (1) | DE60220882T2 (ja) |
TW (1) | TW567639B (ja) |
WO (1) | WO2002067375A1 (ja) |
Families Citing this family (56)
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US7167135B2 (en) * | 2003-09-11 | 2007-01-23 | Intel Corporation | MEMS based tunable antenna for wireless reception and transmission |
FI121037B (fi) * | 2003-12-15 | 2010-06-15 | Pulse Finland Oy | Säädettävä monikaista-antenni |
US7928914B2 (en) | 2004-06-21 | 2011-04-19 | Motorola Mobility, Inc. | Multi-frequency conductive-strip antenna system |
US8330259B2 (en) * | 2004-07-23 | 2012-12-11 | Fractus, S.A. | Antenna in package with reduced electromagnetic interaction with on chip elements |
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-
2002
- 2002-02-13 WO PCT/IB2002/000440 patent/WO2002067375A1/en active IP Right Grant
- 2002-02-13 DE DE60220882T patent/DE60220882T2/de not_active Expired - Lifetime
- 2002-02-13 EP EP02710270A patent/EP1362388B1/en not_active Expired - Lifetime
- 2002-02-13 AT AT02710270T patent/ATE365985T1/de not_active IP Right Cessation
- 2002-02-13 JP JP2002566592A patent/JP3982689B2/ja not_active Expired - Fee Related
- 2002-02-13 US US10/467,739 patent/US6819293B2/en not_active Expired - Fee Related
- 2002-03-27 TW TW091105994A patent/TW567639B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE365985T1 (de) | 2007-07-15 |
JP2004520746A (ja) | 2004-07-08 |
TW567639B (en) | 2003-12-21 |
EP1362388B1 (en) | 2007-06-27 |
US6819293B2 (en) | 2004-11-16 |
DE60220882D1 (de) | 2007-08-09 |
EP1362388A1 (en) | 2003-11-19 |
US20040066336A1 (en) | 2004-04-08 |
WO2002067375A1 (en) | 2002-08-29 |
DE60220882T2 (de) | 2008-02-28 |
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