DE602007003031D1 - Mikrowellenmodul - Google Patents

Mikrowellenmodul

Info

Publication number
DE602007003031D1
DE602007003031D1 DE602007003031T DE602007003031T DE602007003031D1 DE 602007003031 D1 DE602007003031 D1 DE 602007003031D1 DE 602007003031 T DE602007003031 T DE 602007003031T DE 602007003031 T DE602007003031 T DE 602007003031T DE 602007003031 D1 DE602007003031 D1 DE 602007003031D1
Authority
DE
Germany
Prior art keywords
microwave module
enclosure
cover
microwave
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007003031T
Other languages
English (en)
Inventor
Leopoldo Manfredi
Giulio Favre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siae Microelettronica SpA
Original Assignee
Siae Microelettronica SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siae Microelettronica SpA filed Critical Siae Microelettronica SpA
Publication of DE602007003031D1 publication Critical patent/DE602007003031D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
DE602007003031T 2007-11-26 2007-11-26 Mikrowellenmodul Active DE602007003031D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07425745A EP2063484B1 (de) 2007-11-26 2007-11-26 Mikrowellenmodul

Publications (1)

Publication Number Publication Date
DE602007003031D1 true DE602007003031D1 (de) 2009-12-10

Family

ID=39301242

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007003031T Active DE602007003031D1 (de) 2007-11-26 2007-11-26 Mikrowellenmodul

Country Status (4)

Country Link
EP (1) EP2063484B1 (de)
AT (1) ATE447243T1 (de)
DE (1) DE602007003031D1 (de)
ES (1) ES2334399T3 (de)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4166256A (en) * 1977-01-05 1979-08-28 Hughes Aircraft Company Anti multipacting resonant cavity
US6459343B1 (en) 1999-02-25 2002-10-01 Formfactor, Inc. Integrated circuit interconnect system forming a multi-pole filter
JP3986741B2 (ja) 2000-09-18 2007-10-03 三菱電機株式会社 マイクロ波モジュール格納シャーシ
US6573803B1 (en) 2000-10-12 2003-06-03 Tyco Electronics Corp. Surface-mounted millimeter wave signal source with ridged microstrip to waveguide transition
US7411279B2 (en) * 2004-06-30 2008-08-12 Endwave Corporation Component interconnect with substrate shielding

Also Published As

Publication number Publication date
EP2063484A1 (de) 2009-05-27
ATE447243T1 (de) 2009-11-15
EP2063484B1 (de) 2009-10-28
ES2334399T3 (es) 2010-03-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition