KR100628699B1 - 반송장치, 도포시스템, 및 검사시스템 - Google Patents

반송장치, 도포시스템, 및 검사시스템 Download PDF

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Publication number
KR100628699B1
KR100628699B1 KR1020040074123A KR20040074123A KR100628699B1 KR 100628699 B1 KR100628699 B1 KR 100628699B1 KR 1020040074123 A KR1020040074123 A KR 1020040074123A KR 20040074123 A KR20040074123 A KR 20040074123A KR 100628699 B1 KR100628699 B1 KR 100628699B1
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KR
South Korea
Prior art keywords
base
glass substrate
main surface
conveyed
coating
Prior art date
Application number
KR1020040074123A
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English (en)
Korean (ko)
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KR20050033426A (ko
Inventor
도미타요시유키
고바야시유지
고야나가와야스시
미츠나가요스케
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20050033426A publication Critical patent/KR20050033426A/ko
Application granted granted Critical
Publication of KR100628699B1 publication Critical patent/KR100628699B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0245—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to a moving work of indefinite length, e.g. to a moving web
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020040074123A 2003-10-06 2004-09-16 반송장치, 도포시스템, 및 검사시스템 KR100628699B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00347433 2003-10-06
JP2003347433 2003-10-06
JP2003421506A JP4426276B2 (ja) 2003-10-06 2003-12-18 搬送装置、塗布システム、及び検査システム
JPJP-P-2003-00421506 2003-12-18

Publications (2)

Publication Number Publication Date
KR20050033426A KR20050033426A (ko) 2005-04-12
KR100628699B1 true KR100628699B1 (ko) 2006-09-28

Family

ID=34655936

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040074123A KR100628699B1 (ko) 2003-10-06 2004-09-16 반송장치, 도포시스템, 및 검사시스템

Country Status (4)

Country Link
JP (1) JP4426276B2 (zh)
KR (1) KR100628699B1 (zh)
CN (1) CN1611430A (zh)
TW (1) TWI261041B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI603419B (zh) * 2012-06-28 2017-10-21 Seiko Epson Corp processor

Families Citing this family (38)

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JP2005321505A (ja) * 2004-05-07 2005-11-17 Kokusai Gijutsu Kaihatsu Co Ltd 露光装置
JP2006186251A (ja) * 2004-12-28 2006-07-13 Kumamoto Technology & Industry Foundation 塗布装置
TWI307929B (en) * 2005-05-12 2009-03-21 Olympus Corp Substrate inspection apparatus
JP4553376B2 (ja) * 2005-07-19 2010-09-29 東京エレクトロン株式会社 浮上式基板搬送処理装置及び浮上式基板搬送処理方法
JP2007051001A (ja) * 2005-08-19 2007-03-01 Nippon Sekkei Kogyo:Kk 薄板状材料の搬送方法及び装置
JP4634265B2 (ja) * 2005-09-27 2011-02-16 東京エレクトロン株式会社 塗布方法及び塗布装置
JP4615415B2 (ja) * 2005-09-30 2011-01-19 シャープ株式会社 表示素子部品修正装置および表示素子部品修正方法
JP2007283428A (ja) * 2006-04-14 2007-11-01 Yokogawa Electric Corp ワーク加工装置およびワーク移送システム
JP2007316162A (ja) * 2006-05-23 2007-12-06 Sharp Corp 表示素子部品修正装置および表示素子部品修正方法
JP2008016543A (ja) * 2006-07-04 2008-01-24 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4962760B2 (ja) * 2006-07-19 2012-06-27 横河電機株式会社 移送システム
JP5265099B2 (ja) * 2006-09-11 2013-08-14 オリンパス株式会社 基板検査装置
JP4272230B2 (ja) * 2006-12-22 2009-06-03 東京エレクトロン株式会社 減圧乾燥装置
JP2008212804A (ja) * 2007-03-02 2008-09-18 Tokyo Ohka Kogyo Co Ltd 基板の搬送塗布装置
JP4495752B2 (ja) * 2007-11-06 2010-07-07 東京エレクトロン株式会社 基板処理装置及び塗布装置
JP5403389B2 (ja) * 2008-03-27 2014-01-29 日本電気硝子株式会社 ガラス基板検査装置およびガラス基板検査方法
KR101431146B1 (ko) 2008-05-09 2014-08-18 주식회사 디엠에스 약액도포장치
WO2009151984A2 (en) * 2008-06-09 2009-12-17 Kla-Tencor Corporation Referenced inspection device
JP5056611B2 (ja) * 2008-06-20 2012-10-24 凸版印刷株式会社 基板処理装置
TWI544294B (zh) * 2008-08-18 2016-08-01 瑪波微影Ｉｐ公司 帶電粒子射束微影系統以及目標物定位裝置
JP4787872B2 (ja) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 基板搬送処理装置
DE102010008233A1 (de) * 2010-02-11 2011-08-11 Schmid Technology GmbH, 68723 Vorrichtung und Verfahren zum Transport von Substraten
KR101146609B1 (ko) * 2010-04-08 2012-05-16 주식회사 태성기연 판유리 이송장치
JP2012096920A (ja) * 2010-11-05 2012-05-24 Hitachi High-Technologies Corp ガラス基板欠陥検査装置及びガラス基板欠陥検査方法並びにガラス基板欠陥検査システム
TW201314372A (zh) * 2011-09-26 2013-04-01 Dainippon Screen Mfg 塗佈裝置
JP5918518B2 (ja) * 2011-11-30 2016-05-18 川崎重工業株式会社 搬送ワークのヨーイング補正機構とその補正方法
JP2015034071A (ja) * 2013-08-08 2015-02-19 日本電気硝子株式会社 シート部材搬送装置、シート部材支持装置、シート部材検査装置、およびシート部材搬送方法
JP2015218055A (ja) * 2014-05-20 2015-12-07 オイレス工業株式会社 搬送用レールおよび浮上搬送装置
WO2015178301A1 (ja) * 2014-05-21 2015-11-26 シャープ株式会社 搬送装置及びウェットプロセス装置
CN106457304B (zh) * 2014-06-17 2021-03-02 科迪华公司 打印系统组件和方法
KR102022471B1 (ko) * 2014-09-19 2019-09-18 한화정밀기계 주식회사 기판 검사장치
JP2018120358A (ja) * 2017-01-24 2018-08-02 Thk株式会社 ワーク搬送制御システム、及び運動案内装置
JP2019010691A (ja) * 2017-06-29 2019-01-24 日本電産サンキョー株式会社 産業用ロボットのハンドおよび産業用ロボット
CN108333191B (zh) * 2018-05-14 2024-02-06 杭州智谷精工有限公司 基于暗场扫描和机器视觉的光学双场平面体快速检测设备
JP2021150351A (ja) * 2020-03-17 2021-09-27 東レエンジニアリング株式会社 基板浮上搬送装置
TW202301531A (zh) * 2021-03-25 2023-01-01 日商東京威力科創股份有限公司 基板搬送裝置、塗佈處理裝置、基板搬送方法及基板搬送程式
CN114602741B (zh) * 2022-03-30 2023-08-29 深圳市鑫龙邦科技有限公司 一种卷对卷cob灯带点胶机及方法
WO2024009470A1 (ja) * 2022-07-07 2024-01-11 Ｊｓｗアクティナシステム株式会社 搬送装置、搬送方法、及び半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI603419B (zh) * 2012-06-28 2017-10-21 Seiko Epson Corp processor

Also Published As

Publication number Publication date
TW200517322A (en) 2005-06-01
TWI261041B (en) 2006-09-01
JP4426276B2 (ja) 2010-03-03
KR20050033426A (ko) 2005-04-12
JP2005132626A (ja) 2005-05-26
CN1611430A (zh) 2005-05-04

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