KR100562538B1 - 선택적으로 연결된 본체를 구비한 실리콘 산화물 절연체 반도체 - Google Patents
선택적으로 연결된 본체를 구비한 실리콘 산화물 절연체 반도체 Download PDFInfo
- Publication number
- KR100562538B1 KR100562538B1 KR1020007006666A KR20007006666A KR100562538B1 KR 100562538 B1 KR100562538 B1 KR 100562538B1 KR 1020007006666 A KR1020007006666 A KR 1020007006666A KR 20007006666 A KR20007006666 A KR 20007006666A KR 100562538 B1 KR100562538 B1 KR 100562538B1
- Authority
- KR
- South Korea
- Prior art keywords
- region
- soi
- body region
- conductivity type
- transition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/311—Thin-film BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6708—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
- H10D30/6711—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect by using electrodes contacting the supplementary regions or layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
Landscapes
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/991,808 | 1997-12-16 | ||
| US08/991,808 US6020222A (en) | 1997-12-16 | 1997-12-16 | Silicon oxide insulator (SOI) semiconductor having selectively linked body |
| PCT/US1998/027030 WO1999031731A2 (en) | 1997-12-16 | 1998-12-16 | Silicon oxide insulator (soi) semiconductor having selectively linked body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010024753A KR20010024753A (ko) | 2001-03-26 |
| KR100562538B1 true KR100562538B1 (ko) | 2006-03-22 |
Family
ID=25537598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020007006666A Expired - Fee Related KR100562538B1 (ko) | 1997-12-16 | 1998-12-16 | 선택적으로 연결된 본체를 구비한 실리콘 산화물 절연체 반도체 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US6020222A (https=) |
| EP (1) | EP1040521B1 (https=) |
| JP (2) | JP2002509360A (https=) |
| KR (1) | KR100562538B1 (https=) |
| DE (1) | DE69836981T2 (https=) |
| WO (1) | WO1999031731A2 (https=) |
Families Citing this family (85)
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| US6154091A (en) * | 1999-06-02 | 2000-11-28 | International Business Machines Corporation | SOI sense amplifier with body contact structure |
| TW476993B (en) * | 2000-01-19 | 2002-02-21 | Advanced Micro Devices Inc | Silicon on insulator circuit structure with buried semiconductor interconnect structure and method for forming same |
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| KR20030011083A (ko) * | 2000-05-31 | 2003-02-06 | 모토로라 인코포레이티드 | 반도체 디바이스 및 이를 제조하기 위한 방법 |
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| US6441435B1 (en) | 2001-01-31 | 2002-08-27 | Advanced Micro Devices, Inc. | SOI device with wrap-around contact to underside of body, and method of making |
| US6589823B1 (en) | 2001-02-22 | 2003-07-08 | Advanced Micro Devices, Inc. | Silicon-on-insulator (SOI)electrostatic discharge (ESD) protection device with backside contact plug |
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| US20030036217A1 (en) * | 2001-08-16 | 2003-02-20 | Motorola, Inc. | Microcavity semiconductor laser coupled to a waveguide |
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| US7045873B2 (en) * | 2003-12-08 | 2006-05-16 | International Business Machines Corporation | Dynamic threshold voltage MOSFET on SOI |
| US8398670B2 (en) | 2004-03-19 | 2013-03-19 | Aga Medical Corporation | Multi-layer braided structures for occluding vascular defects and for occluding fluid flow through portions of the vasculature of the body |
| US8747453B2 (en) | 2008-02-18 | 2014-06-10 | Aga Medical Corporation | Stent/stent graft for reinforcement of vascular abnormalities and associated method |
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| JP5100034B2 (ja) * | 2005-05-26 | 2012-12-19 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
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| JP5042518B2 (ja) * | 2006-04-12 | 2012-10-03 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US8034061B2 (en) | 2007-07-12 | 2011-10-11 | Aga Medical Corporation | Percutaneous catheter directed intravascular occlusion devices |
| WO2010032386A1 (ja) * | 2008-09-17 | 2010-03-25 | シャープ株式会社 | 半導体装置 |
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| CN102214679B (zh) * | 2011-05-26 | 2012-12-05 | 上海先进半导体制造股份有限公司 | 形成于绝缘体上硅中的自隔离式高压半桥结构 |
| JP6122275B2 (ja) * | 2011-11-11 | 2017-04-26 | 株式会社半導体エネルギー研究所 | 表示装置 |
| CN107256890A (zh) * | 2017-06-19 | 2017-10-17 | 西安理工大学 | 一种逆导型绝缘栅双极型晶体管及其制备方法 |
| US20250113606A1 (en) * | 2023-09-28 | 2025-04-03 | Qualcomm Incorporated | Body tied to source standard cell implementations in semiconductor-on-insulator (soi) technology |
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| US4587545A (en) * | 1978-12-20 | 1986-05-06 | At&T Bell Laboratories | High voltage dielectrically isolated remote gate solid-state switch |
| US4250409A (en) * | 1979-12-28 | 1981-02-10 | Bell Telephone Laboratories, Incorporated | Control circuitry using a pull-down transistor for high voltage field terminated diode solid-state switches |
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-
1997
- 1997-12-16 US US08/991,808 patent/US6020222A/en not_active Expired - Lifetime
-
1998
- 1998-12-16 KR KR1020007006666A patent/KR100562538B1/ko not_active Expired - Fee Related
- 1998-12-16 WO PCT/US1998/027030 patent/WO1999031731A2/en not_active Ceased
- 1998-12-16 EP EP98964114A patent/EP1040521B1/en not_active Expired - Lifetime
- 1998-12-16 DE DE69836981T patent/DE69836981T2/de not_active Expired - Lifetime
- 1998-12-16 JP JP2000539529A patent/JP2002509360A/ja active Pending
-
1999
- 1999-01-05 US US09/225,658 patent/US5994738A/en not_active Expired - Lifetime
- 1999-12-31 US US09/476,041 patent/US6627952B1/en not_active Expired - Lifetime
-
2008
- 2008-02-12 JP JP2008030550A patent/JP2008193101A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010024753A (ko) | 2001-03-26 |
| DE69836981D1 (de) | 2007-03-15 |
| EP1040521B1 (en) | 2007-01-24 |
| JP2002509360A (ja) | 2002-03-26 |
| US6627952B1 (en) | 2003-09-30 |
| EP1040521A2 (en) | 2000-10-04 |
| WO1999031731A2 (en) | 1999-06-24 |
| DE69836981T2 (de) | 2007-11-22 |
| JP2008193101A (ja) | 2008-08-21 |
| WO1999031731A3 (en) | 1999-09-16 |
| US6020222A (en) | 2000-02-01 |
| US5994738A (en) | 1999-11-30 |
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