KR100537972B1 - 집적 회로 패키지용 칩 스케일 볼 그리드 어레이 - Google Patents

집적 회로 패키지용 칩 스케일 볼 그리드 어레이 Download PDF

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Publication number
KR100537972B1
KR100537972B1 KR10-2000-7003827A KR20007003827A KR100537972B1 KR 100537972 B1 KR100537972 B1 KR 100537972B1 KR 20007003827 A KR20007003827 A KR 20007003827A KR 100537972 B1 KR100537972 B1 KR 100537972B1
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KR
South Korea
Prior art keywords
layer
circuit
chip scale
integrated circuit
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR10-2000-7003827A
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English (en)
Korean (ko)
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KR20010031020A (ko
Inventor
란돌프 디. 슈엘러
Original Assignee
미네소타 마이닝 앤드 매뉴팩춰링 캄파니
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Publication of KR20010031020A publication Critical patent/KR20010031020A/ko
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Publication of KR100537972B1 publication Critical patent/KR100537972B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/656—Fan-in layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR10-2000-7003827A 1997-10-08 1998-02-04 집적 회로 패키지용 칩 스케일 볼 그리드 어레이 Expired - Fee Related KR100537972B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/947,042 US5866949A (en) 1996-12-02 1997-10-08 Chip scale ball grid array for integrated circuit packaging
US08/947,042 1997-10-08
US8/947,042 1997-10-08
PCT/US1998/002177 WO1999018609A1 (en) 1997-10-08 1998-02-04 Chip scale ball grid array for integrated circuit package

Publications (2)

Publication Number Publication Date
KR20010031020A KR20010031020A (ko) 2001-04-16
KR100537972B1 true KR100537972B1 (ko) 2005-12-21

Family

ID=25485422

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7003827A Expired - Fee Related KR100537972B1 (ko) 1997-10-08 1998-02-04 집적 회로 패키지용 칩 스케일 볼 그리드 어레이

Country Status (10)

Country Link
US (1) US5866949A (https=)
EP (1) EP1021830A1 (https=)
JP (1) JP2001519600A (https=)
KR (1) KR100537972B1 (https=)
CN (1) CN1274474A (https=)
AU (1) AU6056398A (https=)
MY (1) MY116426A (https=)
NO (1) NO20001741L (https=)
TW (1) TW395000B (https=)
WO (1) WO1999018609A1 (https=)

Families Citing this family (152)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100386061B1 (ko) * 1995-10-24 2003-08-21 오끼 덴끼 고오교 가부시끼가이샤 크랙을방지하기위한개량된구조를가지는반도체장치및리이드프레임
US6667560B2 (en) 1996-05-29 2003-12-23 Texas Instruments Incorporated Board on chip ball grid array
US6791194B1 (en) 1996-05-30 2004-09-14 Hitachi, Ltd. Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
JP3195236B2 (ja) 1996-05-30 2001-08-06 株式会社日立製作所 接着フィルムを有する配線テープ，半導体装置及び製造方法
DE19638175C2 (de) * 1996-09-18 2000-05-25 Siemens Ag Integrierte Schaltung (Chip) mit einem diese in sich aufnehmenden Gehäuse und externer Konfigurationsmöglichkeit
US6127724A (en) * 1996-10-31 2000-10-03 Tessera, Inc. Packaged microelectronic elements with enhanced thermal conduction
US6150194A (en) * 1996-12-04 2000-11-21 Shinko Electric Industries Co., Ltd. Semiconductor device sealed with resin, and its manufacture
JP3639088B2 (ja) * 1997-06-06 2005-04-13 株式会社ルネサステクノロジ 半導体装置及び配線テープ
KR100211421B1 (ko) * 1997-06-18 1999-08-02 윤종용 중앙부가 관통된 플렉서블 회로기판을 사용한 반도체 칩 패키지
US6683384B1 (en) * 1997-10-08 2004-01-27 Agere Systems Inc Air isolated crossovers
US6028354A (en) 1997-10-14 2000-02-22 Amkor Technology, Inc. Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package
KR100282003B1 (ko) * 1997-10-15 2001-02-15 윤종용 칩 스케일 패키지
US6059173A (en) * 1998-03-05 2000-05-09 International Business Machines Corporation Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board
US6642136B1 (en) * 2001-09-17 2003-11-04 Megic Corporation Method of making a low fabrication cost, high performance, high reliability chip scale package
US6089920A (en) * 1998-05-04 2000-07-18 Micron Technology, Inc. Modular die sockets with flexible interconnects for packaging bare semiconductor die
KR100266698B1 (ko) 1998-06-12 2000-09-15 김영환 반도체 칩 패키지 및 그 제조방법
US6903451B1 (en) * 1998-08-28 2005-06-07 Samsung Electronics Co., Ltd. Chip scale packages manufactured at wafer level
US6428641B1 (en) 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
US6479887B1 (en) 1998-08-31 2002-11-12 Amkor Technology, Inc. Circuit pattern tape for wafer-scale production of chip size semiconductor packages
US6091140A (en) * 1998-10-23 2000-07-18 Texas Instruments Incorporated Thin chip-size integrated circuit package
JP2000138317A (ja) 1998-10-31 2000-05-16 Anam Semiconductor Inc 半導体装置及びその製造方法
JP2000138262A (ja) 1998-10-31 2000-05-16 Anam Semiconductor Inc チップスケ―ル半導体パッケ―ジ及びその製造方法
US6429530B1 (en) * 1998-11-02 2002-08-06 International Business Machines Corporation Miniaturized chip scale ball grid array semiconductor package
US5969783A (en) * 1998-12-11 1999-10-19 National Semiconductor Corporation Reflective liquid crystal display and connection assembly and method
US6630735B1 (en) * 1999-04-09 2003-10-07 Digirad Corporation Insulator/metal bonding island for active-area silver epoxy bonding
WO2000065647A1 (en) 1999-04-22 2000-11-02 International Rectifier Corporation Chip scale package
JP3575001B2 (ja) 1999-05-07 2004-10-06 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
US6373268B1 (en) 1999-05-10 2002-04-16 Intel Corporation Test handling method and equipment for conjoined integrated circuit dice
JP3416737B2 (ja) * 1999-05-20 2003-06-16 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージの製造方法
USRE40112E1 (en) 1999-05-20 2008-02-26 Amkor Technology, Inc. Semiconductor package and method for fabricating the same
JP3398721B2 (ja) * 1999-05-20 2003-04-21 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
JP3314304B2 (ja) * 1999-06-07 2002-08-12 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ用の回路基板
US6359334B1 (en) 1999-06-08 2002-03-19 Micron Technology, Inc. Thermally conductive adhesive tape for semiconductor devices and method using the same
US6559388B1 (en) * 1999-06-08 2003-05-06 International Business Machines Corporation Strain relief for substrates having a low coefficient of thermal expansion
JP3526788B2 (ja) 1999-07-01 2004-05-17 沖電気工業株式会社 半導体装置の製造方法
JP2001044358A (ja) * 1999-07-28 2001-02-16 Mitsubishi Electric Corp 半導体装置およびその製造方法
US6774480B1 (en) 1999-07-30 2004-08-10 Micron Technology, Inc. Method and structure for manufacturing improved yield semiconductor packaged devices
US6255143B1 (en) 1999-08-04 2001-07-03 St. Assembly Test Services Pte Ltd. Flip chip thermally enhanced ball grid array
KR20010017187A (ko) 1999-08-09 2001-03-05 윤종용 인쇄 회로 기판 및 이 인쇄 회로 기판의 스크린 프린팅을 위한마스크
US6285077B1 (en) * 1999-08-19 2001-09-04 Lsi Logic Corporation Multiple layer tape ball grid array package
JP2001077301A (ja) * 1999-08-24 2001-03-23 Amkor Technology Korea Inc 半導体パッケージ及びその製造方法
JP3427352B2 (ja) 1999-08-24 2003-07-14 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ用回路基板
US6472295B1 (en) 1999-08-27 2002-10-29 Jmar Research, Inc. Method and apparatus for laser ablation of a target material
US6455923B1 (en) * 1999-08-30 2002-09-24 Micron Technology, Inc. Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices
US6262490B1 (en) 1999-11-05 2001-07-17 Advanced Semiconductor Engineering, Inc. Substrate strip for use in packaging semiconductor chips
US6306751B1 (en) 1999-09-27 2001-10-23 Lsi Logic Corporation Apparatus and method for improving ball joints in semiconductor packages
KR20010045373A (ko) * 1999-11-04 2001-06-05 마이클 디. 오브라이언 반도체 패키지
JP3450238B2 (ja) 1999-11-04 2003-09-22 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
US6384890B1 (en) 1999-11-15 2002-05-07 National Semiconductor Corporation Connection assembly for reflective liquid crystal projection with branched PCB display
US6309908B1 (en) 1999-12-21 2001-10-30 Motorola, Inc. Package for an electronic component and a method of making it
KR100324332B1 (ko) 2000-01-04 2002-02-16 박종섭 솔더 조인트 신뢰성을 향상시킨 비지에이 반도체 패키지및 그 제조 방법
US6414396B1 (en) 2000-01-24 2002-07-02 Amkor Technology, Inc. Package for stacked integrated circuits
US6265768B1 (en) 2000-01-31 2001-07-24 Advanced Semiconductor Engineering, Inc. Chip scale package
US6257857B1 (en) 2000-01-31 2001-07-10 Advanced Semiconductor Engineering, Inc. Molding apparatus for flexible substrate based package
WO2001059842A1 (en) 2000-02-10 2001-08-16 International Rectifier Corporation Vertical conduction flip-chip device with bump contacts on single surface
JP3568869B2 (ja) * 2000-02-28 2004-09-22 シャープ株式会社 半導体集積回路装置及びその製造方法
SG106050A1 (en) * 2000-03-13 2004-09-30 Megic Corp Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby
US6534852B1 (en) * 2000-04-11 2003-03-18 Advanced Semiconductor Engineering, Inc. Ball grid array semiconductor package with improved strength and electric performance and method for making the same
US6531335B1 (en) * 2000-04-28 2003-03-11 Micron Technology, Inc. Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
US7247932B1 (en) * 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
US6903617B2 (en) 2000-05-25 2005-06-07 Silicon Laboratories Inc. Method and apparatus for synthesizing high-frequency signals for wireless communications
US6323735B1 (en) 2000-05-25 2001-11-27 Silicon Laboratories, Inc. Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors
US6501170B1 (en) 2000-06-09 2002-12-31 Micron Technology, Inc. Substrates and assemblies including pre-applied adhesion promoter
US6452278B1 (en) 2000-06-30 2002-09-17 Amkor Technology, Inc. Low profile package for plural semiconductor dies
DE10034018A1 (de) 2000-07-07 2002-01-24 Infineon Technologies Ag Trägermatrix für integrierte Halbleiter und Verfahren zu ihrer Herstellung
DE10034006A1 (de) * 2000-07-07 2002-01-24 Infineon Technologies Ag Trägermatrix mit Bondkanal für integrierte Halbleiter und Verfahren zu ihrer Herstellung
US6812125B1 (en) 2000-07-07 2004-11-02 National Semiconductor Corporation Substrate for semiconductor packaging
US6507118B1 (en) 2000-07-14 2003-01-14 3M Innovative Properties Company Multi-metal layer circuit
US6627998B1 (en) 2000-07-27 2003-09-30 International Business Machines Corporation Wafer scale thin film package
US6882042B2 (en) * 2000-12-01 2005-04-19 Broadcom Corporation Thermally and electrically enhanced ball grid array packaging
US6566164B1 (en) * 2000-12-07 2003-05-20 Amkor Technology, Inc. Exposed copper strap in a semiconductor package
US7132744B2 (en) 2000-12-22 2006-11-07 Broadcom Corporation Enhanced die-up ball grid array packages and method for making the same
US7161239B2 (en) 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US20020079572A1 (en) * 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
US6906414B2 (en) * 2000-12-22 2005-06-14 Broadcom Corporation Ball grid array package with patterned stiffener layer
US6507114B2 (en) * 2001-01-30 2003-01-14 Micron Technology, Inc. BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die
US6853070B2 (en) * 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
US6815324B2 (en) * 2001-02-15 2004-11-09 Megic Corporation Reliable metal bumps on top of I/O pads after removal of test probe marks
TWI313507B (en) * 2002-10-25 2009-08-11 Megica Corporatio Method for assembling chips
KR100401020B1 (ko) * 2001-03-09 2003-10-08 앰코 테크놀로지 코리아 주식회사 반도체칩의 스택킹 구조 및 이를 이용한 반도체패키지
US6486537B1 (en) * 2001-03-19 2002-11-26 Amkor Technology, Inc. Semiconductor package with warpage resistant substrate
US7498196B2 (en) * 2001-03-30 2009-03-03 Megica Corporation Structure and manufacturing method of chip scale package
US7259448B2 (en) * 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package with a heat spreader and method for making the same
US20030006494A1 (en) * 2001-07-03 2003-01-09 Lee Sang Ho Thin profile stackable semiconductor package and method for manufacturing
DE10133571B4 (de) * 2001-07-13 2005-12-22 Infineon Technologies Ag Elektronisches Bauteil und Verfahren zu seiner Herstellung
US7099293B2 (en) 2002-05-01 2006-08-29 Stmicroelectronics, Inc. Buffer-less de-skewing for symbol combination in a CDMA demodulator
US6613606B1 (en) 2001-09-17 2003-09-02 Magic Corporation Structure of high performance combo chip and processing method
US6555917B1 (en) 2001-10-09 2003-04-29 Amkor Technology, Inc. Semiconductor package having stacked semiconductor chips and method of making the same
US6946323B1 (en) 2001-11-02 2005-09-20 Amkor Technology, Inc. Semiconductor package having one or more die stacked on a prepackaged device and method therefor
US6873059B2 (en) * 2001-11-13 2005-03-29 Texas Instruments Incorporated Semiconductor package with metal foil attachment film
TW498472B (en) * 2001-11-27 2002-08-11 Via Tech Inc Tape-BGA package and its manufacturing process
US6737750B1 (en) 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US6879039B2 (en) 2001-12-18 2005-04-12 Broadcom Corporation Ball grid array package substrates and method of making the same
US7550845B2 (en) * 2002-02-01 2009-06-23 Broadcom Corporation Ball grid array package with separated stiffener layer
US7245500B2 (en) * 2002-02-01 2007-07-17 Broadcom Corporation Ball grid array package with stepped stiffener layer
US6825108B2 (en) * 2002-02-01 2004-11-30 Broadcom Corporation Ball grid array package fabrication with IC die support structures
US6861750B2 (en) 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US6982485B1 (en) 2002-02-13 2006-01-03 Amkor Technology, Inc. Stacking structure for semiconductor chips and a semiconductor package using it
US7154171B1 (en) 2002-02-22 2006-12-26 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
US6576998B1 (en) 2002-02-28 2003-06-10 Amkor Technology, Inc. Thin semiconductor package with semiconductor chip and electronic discrete device
US6876553B2 (en) * 2002-03-21 2005-04-05 Broadcom Corporation Enhanced die-up ball grid array package with two substrates
US7196415B2 (en) 2002-03-22 2007-03-27 Broadcom Corporation Low voltage drop and high thermal performance ball grid array package
DE10213296B9 (de) 2002-03-25 2007-04-19 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Nutzens
JP3539952B2 (ja) * 2002-06-13 2004-07-07 沖電気工業株式会社 レベル識別回路
US6700190B2 (en) * 2002-07-26 2004-03-02 Stmicroelectronics, Inc. Integrated circuit device with exposed upper and lower die surfaces
WO2004017407A1 (de) * 2002-07-31 2004-02-26 Osram Opto Semiconductors Gmbh Oberflächenmontierbares halbleiterbauelement und verfahren zu dessen herstellung
JP3625815B2 (ja) * 2002-11-12 2005-03-02 沖電気工業株式会社 半導体装置とその製造方法
US6879047B1 (en) 2003-02-19 2005-04-12 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
JP2004335710A (ja) * 2003-05-07 2004-11-25 Sanyo Electric Co Ltd 半導体装置およびその製造方法
TWI234252B (en) * 2003-05-13 2005-06-11 Siliconware Precision Industries Co Ltd Flash-preventing window ball grid array semiconductor package and chip carrier and method for fabricating the same
US8853001B2 (en) * 2003-11-08 2014-10-07 Stats Chippac, Ltd. Semiconductor device and method of forming pad layout for flipchip semiconductor die
US7394161B2 (en) * 2003-12-08 2008-07-01 Megica Corporation Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto
US20070145548A1 (en) * 2003-12-22 2007-06-28 Amkor Technology, Inc. Stack-type semiconductor package and manufacturing method thereof
DE102004015597B4 (de) * 2004-03-30 2007-12-06 Qimonda Ag Halbleitervorrichtung mit schützender Gehäusestruktur
US7411281B2 (en) * 2004-06-21 2008-08-12 Broadcom Corporation Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
US7432586B2 (en) 2004-06-21 2008-10-07 Broadcom Corporation Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
US7482686B2 (en) * 2004-06-21 2009-01-27 Braodcom Corporation Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
US7071559B2 (en) * 2004-07-16 2006-07-04 International Business Machines Corporation Design of beol patterns to reduce the stresses on structures below chip bondpads
US7786591B2 (en) * 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
KR100676493B1 (ko) * 2004-10-08 2007-02-01 디엔제이 클럽 인코 재배선 기판을 이용한 웨이퍼 레벨 칩 스케일 패키지의제조 방법
US8294279B2 (en) * 2005-01-25 2012-10-23 Megica Corporation Chip package with dam bar restricting flow of underfill
US7371676B2 (en) * 2005-04-08 2008-05-13 Micron Technology, Inc. Method for fabricating semiconductor components with through wire interconnects
US7393770B2 (en) 2005-05-19 2008-07-01 Micron Technology, Inc. Backside method for fabricating semiconductor components with conductive interconnects
JP4638768B2 (ja) * 2005-05-20 2011-02-23 三井金属鉱業株式会社 キャパシタ回路付フィルムキャリアテープ及びその製造方法、キャパシタ回路付表面実装フィルムキャリアテープ及びその製造方法
US7307348B2 (en) * 2005-12-07 2007-12-11 Micron Technology, Inc. Semiconductor components having through wire interconnects (TWI)
US7675180B1 (en) 2006-02-17 2010-03-09 Amkor Technology, Inc. Stacked electronic component package having film-on-wire spacer
US7768075B2 (en) * 2006-04-06 2010-08-03 Fairchild Semiconductor Corporation Semiconductor die packages using thin dies and metal substrates
US7659612B2 (en) 2006-04-24 2010-02-09 Micron Technology, Inc. Semiconductor components having encapsulated through wire interconnects (TWI)
US8183680B2 (en) * 2006-05-16 2012-05-22 Broadcom Corporation No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
US7633144B1 (en) 2006-05-24 2009-12-15 Amkor Technology, Inc. Semiconductor package
US7788960B2 (en) * 2006-10-27 2010-09-07 Cummins Filtration Ip, Inc. Multi-walled tube and method of manufacture
US7573131B2 (en) * 2006-10-27 2009-08-11 Compass Technology Co., Ltd. Die-up integrated circuit package with grounded stiffener
US9466545B1 (en) 2007-02-21 2016-10-11 Amkor Technology, Inc. Semiconductor package in package
US20090057866A1 (en) * 2007-08-27 2009-03-05 Chow Linda L W Microelectronic Package Having Second Level Interconnects Including Stud Bumps and Method of Forming Same
KR100969326B1 (ko) * 2007-09-18 2010-07-09 삼성전기주식회사 다층 인쇄회로기판 및 그 제조방법
US20090159709A1 (en) 2007-12-24 2009-06-25 Dynamics Inc. Advanced dynamic credit cards
KR20090070406A (ko) * 2007-12-27 2009-07-01 삼성전자주식회사 피씨비 스트립과 그의 어셈블리 장치와 방법
DE102008028299B3 (de) 2008-06-13 2009-07-30 Epcos Ag Systemträger für elektronische Komponente und Verfahren für dessen Herstellung
TWI394245B (zh) * 2009-02-05 2013-04-21 Unimicron Technology Corp 封裝基板及其製法
US8569877B2 (en) 2009-03-12 2013-10-29 Utac Thai Limited Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
EP2524264A4 (en) * 2010-01-11 2014-02-19 Flextronics Ap Llc CAMERA MODULE WITH A HOLDER FOR A MOLDED BAND FLIP CHIP IMAGER AND METHOD OF MANUFACTURING THEREOF
US8525318B1 (en) * 2010-11-10 2013-09-03 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8546925B2 (en) * 2011-09-28 2013-10-01 Texas Instruments Incorporated Synchronous buck converter having coplanar array of contact bumps of equal volume
US9916992B2 (en) 2012-02-20 2018-03-13 Dynamics Inc. Systems and methods for flexible components for powered cards and devices
CA2864986C (en) * 2012-02-20 2020-05-12 Dynamics Inc. Systems and methods for flexible components, flexible cards, multi-layer boards, multiple sensor detectors, non-time smearing detection mechanisms and electromagnetic field generators for powered cards and devices
US9064195B2 (en) 2012-06-29 2015-06-23 Dynamics Inc. Multiple layer card circuit boards
US9010647B2 (en) 2012-10-29 2015-04-21 Dynamics Inc. Multiple sensor detector systems and detection methods of magnetic cards and devices
US10949627B2 (en) 2012-12-20 2021-03-16 Dynamics Inc. Systems and methods for non-time smearing detection mechanisms for magnetic cards and devices
DE102013210668A1 (de) * 2013-06-07 2014-12-11 Würth Elektronik GmbH & Co. KG Verfahren zur Herstellung eines optischen Moduls
US10242953B1 (en) 2015-05-27 2019-03-26 Utac Headquarters PTE. Ltd Semiconductor package with plated metal shielding and a method thereof
US10242934B1 (en) 2014-05-07 2019-03-26 Utac Headquarters Pte Ltd. Semiconductor package with full plating on contact side surfaces and methods thereof
US11837518B2 (en) * 2020-08-26 2023-12-05 Texas Instruments Incorporated Coated semiconductor dies

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5640047A (en) * 1995-09-25 1997-06-17 Mitsui High-Tec, Inc. Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216278A (en) * 1990-12-04 1993-06-01 Motorola, Inc. Semiconductor device having a pad array carrier package
US5241133A (en) * 1990-12-21 1993-08-31 Motorola, Inc. Leadless pad array chip carrier
JPH05160292A (ja) * 1991-06-06 1993-06-25 Toshiba Corp 多層パッケージ
US5214845A (en) * 1992-05-11 1993-06-01 Micron Technology, Inc. Method for producing high speed integrated circuits
US5592025A (en) * 1992-08-06 1997-01-07 Motorola, Inc. Pad array semiconductor device
US5468994A (en) * 1992-12-10 1995-11-21 Hewlett-Packard Company High pin count package for semiconductor device
US5420460A (en) * 1993-08-05 1995-05-30 Vlsi Technology, Inc. Thin cavity down ball grid array package based on wirebond technology
US5397921A (en) * 1993-09-03 1995-03-14 Advanced Semiconductor Assembly Technology Tab grid array
US5477611A (en) * 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
US5548091A (en) * 1993-10-26 1996-08-20 Tessera, Inc. Semiconductor chip connection components with adhesives and methods for bonding to the chip
TW258829B (https=) * 1994-01-28 1995-10-01 Ibm
EP1213754A3 (en) * 1994-03-18 2005-05-25 Hitachi Chemical Co., Ltd. Fabrication process of semiconductor package and semiconductor package
US5741729A (en) * 1994-07-11 1998-04-21 Sun Microsystems, Inc. Ball grid array package for an integrated circuit
JP2616565B2 (ja) * 1994-09-12 1997-06-04 日本電気株式会社 電子部品組立体
JP2546192B2 (ja) * 1994-09-30 1996-10-23 日本電気株式会社 フィルムキャリア半導体装置
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
US5677566A (en) * 1995-05-08 1997-10-14 Micron Technology, Inc. Semiconductor chip package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5640047A (en) * 1995-09-25 1997-06-17 Mitsui High-Tec, Inc. Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die

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