KR100530449B1 - Ｅｓｄ 보호 소자를 포함하는 반도체 소자 - Google Patents

Ｅｓｄ 보호 소자를 포함하는 반도체 소자 Download PDF

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Publication number
KR100530449B1
KR100530449B1 KR10-2003-7009295A KR20037009295A KR100530449B1 KR 100530449 B1 KR100530449 B1 KR 100530449B1 KR 20037009295 A KR20037009295 A KR 20037009295A KR 100530449 B1 KR100530449 B1 KR 100530449B1
Authority
KR
South Korea
Prior art keywords
conductor track
terminal
semiconductor chip
additional
electrostatic discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2003-7009295A
Other languages
English (en)
Korean (ko)
Other versions
KR20030072594A (ko
Inventor
트로스트마르코
Original Assignee
인피니언 테크놀로지스 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인피니언 테크놀로지스 아게 filed Critical 인피니언 테크놀로지스 아게
Publication of KR20030072594A publication Critical patent/KR20030072594A/ko
Application granted granted Critical
Publication of KR100530449B1 publication Critical patent/KR100530449B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
KR10-2003-7009295A 2001-01-19 2002-01-21 Ｅｓｄ 보호 소자를 포함하는 반도체 소자 Expired - Fee Related KR100530449B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10102354A DE10102354C1 (de) 2001-01-19 2001-01-19 Halbleiter-Bauelement mit ESD-Schutz
DE10102354.5 2001-01-19
PCT/DE2002/000175 WO2002058154A2 (de) 2001-01-19 2002-01-21 Halbleiter-bauelement mit esd-schutz

Publications (2)

Publication Number Publication Date
KR20030072594A KR20030072594A (ko) 2003-09-15
KR100530449B1 true KR100530449B1 (ko) 2005-11-22

Family

ID=7671118

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7009295A Expired - Fee Related KR100530449B1 (ko) 2001-01-19 2002-01-21 Ｅｓｄ 보호 소자를 포함하는 반도체 소자

Country Status (7)

Country Link
US (1) US7250659B2 (https=)
EP (1) EP1360726B1 (https=)
JP (1) JP3886905B2 (https=)
KR (1) KR100530449B1 (https=)
CN (1) CN1244151C (https=)
DE (2) DE10102354C1 (https=)
WO (1) WO2002058154A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004031455B4 (de) * 2004-06-29 2014-10-30 Infineon Technologies Ag Verfahren zur Erstellung eines ESD-Schutzes bei einem mikroelektronischen Baustein und entsprechend ausgebildeter mikroelektronischer Baustein
US9387313B2 (en) 2004-08-03 2016-07-12 Interventional Spine, Inc. Telescopic percutaneous tissue dilation systems and related methods
JP4993092B2 (ja) * 2007-05-31 2012-08-08 富士電機株式会社 レベルシフト回路および半導体装置
US7586179B2 (en) * 2007-10-09 2009-09-08 Fairchild Semiconductor Corporation Wireless semiconductor package for efficient heat dissipation
US10015916B1 (en) * 2013-05-21 2018-07-03 Xilinx, Inc. Removal of electrostatic charges from an interposer via a ground pad thereof for die attach for formation of a stacked die
US9960227B2 (en) 2013-09-11 2018-05-01 Xilinx, Inc. Removal of electrostatic charges from interposer for die attachment
US11088134B2 (en) 2016-11-07 2021-08-10 Dialog Semiconductor (Uk) Limited Electrostatic discharge device and split multi rail network with symmetrical layout design technique

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065705B2 (ja) * 1989-08-11 1994-01-19 株式会社東芝 半導体集積回路装置
JPH03156965A (ja) * 1989-11-15 1991-07-04 Fujitsu Ltd 半導体集積回路装置
JPH05308107A (ja) * 1991-07-01 1993-11-19 Sumitomo Electric Ind Ltd 半導体装置及びその製作方法
JP2888005B2 (ja) * 1992-01-24 1999-05-10 住友電気工業株式会社 マイクロ波デバイス用パッケージ
EP0623958B1 (de) * 1993-05-04 1998-04-01 Siemens Aktiengesellschaft Integrierte Halbleiterschaltung mit einem Schutzmittel
DE19507313C2 (de) * 1995-03-02 1996-12-19 Siemens Ag Halbleiterbauelement mit Schutzstruktur zum Schutz vor elektrostatischer Entladung
DE59510495D1 (de) * 1995-04-06 2003-01-16 Infineon Technologies Ag Integrierte Halbleiterschaltung mit einem Schutzmittel
US5917362A (en) * 1996-01-29 1999-06-29 Sony Corporation Switching circuit
JPH1022448A (ja) 1996-07-03 1998-01-23 Oki Micro Design Miyazaki:Kk 静電破壊／ラッチアップ対策半導体装置
US6476486B1 (en) * 1997-10-30 2002-11-05 Agilent Technologies, Inc. Ball grid array package with supplemental electronic component
US5886862A (en) * 1997-11-26 1999-03-23 Digital Equipment Corporation Cross-referenced electrostatic discharge protection systems and methods for power supplies

Also Published As

Publication number Publication date
EP1360726B1 (de) 2008-03-19
CN1244151C (zh) 2006-03-01
CN1488171A (zh) 2004-04-07
DE10102354C1 (de) 2002-08-08
US20040056339A1 (en) 2004-03-25
EP1360726A2 (de) 2003-11-12
KR20030072594A (ko) 2003-09-15
JP3886905B2 (ja) 2007-02-28
DE50211919D1 (de) 2008-04-30
WO2002058154A2 (de) 2002-07-25
JP2004531051A (ja) 2004-10-07
WO2002058154A3 (de) 2003-08-21
US7250659B2 (en) 2007-07-31

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