KR100502557B1 - 게이트 절연체의 성막 방법, 게이트 절연체의 성막 장치및 클러스터 툴 - Google Patents
게이트 절연체의 성막 방법, 게이트 절연체의 성막 장치및 클러스터 툴 Download PDFInfo
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- KR100502557B1 KR100502557B1 KR10-2003-7003856A KR20037003856A KR100502557B1 KR 100502557 B1 KR100502557 B1 KR 100502557B1 KR 20037003856 A KR20037003856 A KR 20037003856A KR 100502557 B1 KR100502557 B1 KR 100502557B1
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/681—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
- H10D64/685—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered being perpendicular to the channel plane
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/45531—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making ternary or higher compositions
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02194—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing more than one metal element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/693—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2000-00282409 | 2000-09-18 | ||
| JP2000282409 | 2000-09-18 | ||
| PCT/JP2001/008000 WO2002023614A1 (fr) | 2000-09-18 | 2001-09-14 | Procede de formation d'un film d'isolant de grille, appareil pour la formation d'un film d'isolant de grille et outil combine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20030051654A KR20030051654A (ko) | 2003-06-25 |
| KR100502557B1 true KR100502557B1 (ko) | 2005-07-21 |
Family
ID=18766936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-7003856A Expired - Fee Related KR100502557B1 (ko) | 2000-09-18 | 2001-09-14 | 게이트 절연체의 성막 방법, 게이트 절연체의 성막 장치및 클러스터 툴 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20040053472A1 (enExample) |
| EP (1) | EP1326271A4 (enExample) |
| JP (2) | JPWO2002023614A1 (enExample) |
| KR (1) | KR100502557B1 (enExample) |
| TW (1) | TWI293781B (enExample) |
| WO (1) | WO2002023614A1 (enExample) |
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| KR100502557B1 (ko) * | 2000-09-18 | 2005-07-21 | 동경 엘렉트론 주식회사 | 게이트 절연체의 성막 방법, 게이트 절연체의 성막 장치및 클러스터 툴 |
| CN100342500C (zh) * | 2000-09-19 | 2007-10-10 | 马特森技术公司 | 形成介电薄膜的方法 |
| JP3773448B2 (ja) * | 2001-06-21 | 2006-05-10 | 松下電器産業株式会社 | 半導体装置 |
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| JP3941099B2 (ja) * | 2001-12-19 | 2007-07-04 | ソニー株式会社 | 薄膜形成方法 |
| JP4361921B2 (ja) * | 2002-03-26 | 2009-11-11 | 東京エレクトロン株式会社 | 基板処理装置 |
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| JP5052071B2 (ja) * | 2006-08-25 | 2012-10-17 | 株式会社明電舎 | 酸化膜形成方法とその装置 |
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| JP5575582B2 (ja) * | 2007-12-26 | 2014-08-20 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
| JP2010027702A (ja) * | 2008-07-16 | 2010-02-04 | Hitachi Kokusai Electric Inc | 基板処理装置及び薄膜生成方法 |
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| JP5329265B2 (ja) * | 2009-03-09 | 2013-10-30 | 株式会社日立国際電気 | 半導体装置の製造方法および基板処理装置 |
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| JP5457287B2 (ja) * | 2010-06-24 | 2014-04-02 | 株式会社日立国際電気 | 基板処理装置、基板処理方法及び半導体デバイスの製造方法 |
| JP5204809B2 (ja) * | 2010-07-02 | 2013-06-05 | 株式会社日立国際電気 | 基板処理装置、基板処理方法及び半導体デバイスの製造方法 |
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| JP6199570B2 (ja) * | 2013-02-07 | 2017-09-20 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム |
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| CN105513960B (zh) * | 2016-01-27 | 2019-01-11 | 武汉华星光电技术有限公司 | 氧化硅薄膜的沉积方法及低温多晶硅tft基板的制备方法 |
| JP6778553B2 (ja) * | 2016-08-31 | 2020-11-04 | 株式会社日本製鋼所 | 原子層成長装置および原子層成長方法 |
| KR102799270B1 (ko) * | 2017-01-05 | 2025-04-23 | 주성엔지니어링(주) | 투습 방지막과 그 제조 방법 |
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| EP0283311B1 (en) * | 1987-03-18 | 2001-08-01 | Kabushiki Kaisha Toshiba | Thin film forming method |
| JP2789587B2 (ja) * | 1988-01-08 | 1998-08-20 | 日本電気株式会社 | 絶縁薄膜の製造方法 |
| JPH0661448A (ja) * | 1991-01-23 | 1994-03-04 | Matsushita Electric Ind Co Ltd | 半導体記憶装置およびその製造方法 |
| US6110531A (en) * | 1991-02-25 | 2000-08-29 | Symetrix Corporation | Method and apparatus for preparing integrated circuit thin films by chemical vapor deposition |
| JP2764472B2 (ja) * | 1991-03-25 | 1998-06-11 | 東京エレクトロン株式会社 | 半導体の成膜方法 |
| JP2643833B2 (ja) * | 1994-05-30 | 1997-08-20 | 日本電気株式会社 | 半導体記憶装置及びその製造方法 |
| TW295677B (enExample) * | 1994-08-19 | 1997-01-11 | Tokyo Electron Co Ltd | |
| JPH0982696A (ja) * | 1995-09-18 | 1997-03-28 | Toshiba Corp | 半導体装置の製造方法および半導体製造装置 |
| JP3402881B2 (ja) * | 1995-11-24 | 2003-05-06 | 株式会社東芝 | 半導体装置の製造方法 |
| JP3297857B2 (ja) * | 1995-12-27 | 2002-07-02 | 東京エレクトロン株式会社 | クラスタツール装置 |
| JP3110316B2 (ja) * | 1996-07-25 | 2000-11-20 | 日本電気株式会社 | 外部燃焼酸化装置 |
| TW466615B (en) * | 1996-12-23 | 2001-12-01 | Lucent Technologies Inc | A gate structure for integrated circuit fabrication |
| US6013553A (en) * | 1997-07-24 | 2000-01-11 | Texas Instruments Incorporated | Zirconium and/or hafnium oxynitride gate dielectric |
| US6020024A (en) * | 1997-08-04 | 2000-02-01 | Motorola, Inc. | Method for forming high dielectric constant metal oxides |
| US6727148B1 (en) * | 1998-06-30 | 2004-04-27 | Lam Research Corporation | ULSI MOS with high dielectric constant gate insulator |
| KR100275738B1 (ko) * | 1998-08-07 | 2000-12-15 | 윤종용 | 원자층 증착법을 이용한 박막 제조방법 |
| KR100297719B1 (ko) * | 1998-10-16 | 2001-08-07 | 윤종용 | 박막제조방법 |
| US6623656B2 (en) * | 1999-10-07 | 2003-09-23 | Advanced Technology Materials, Inc. | Source reagent composition for CVD formation of Zr/Hf doped gate dielectric and high dielectric constant metal oxide thin films and method of using same |
| WO2001094662A1 (fr) * | 2000-06-07 | 2001-12-13 | Commissariat A L'energie Atomique | Procede de preparation d'un revetement sur un substrat par le procede ald utilisant un reactant deutere |
| KR100502557B1 (ko) * | 2000-09-18 | 2005-07-21 | 동경 엘렉트론 주식회사 | 게이트 절연체의 성막 방법, 게이트 절연체의 성막 장치및 클러스터 툴 |
| CN100342500C (zh) * | 2000-09-19 | 2007-10-10 | 马特森技术公司 | 形成介电薄膜的方法 |
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2001
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- 2001-09-14 JP JP2002527562A patent/JPWO2002023614A1/ja active Pending
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- 2001-09-14 WO PCT/JP2001/008000 patent/WO2002023614A1/ja not_active Ceased
- 2001-09-19 TW TW090123023A patent/TWI293781B/zh not_active IP Right Cessation
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2009
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Also Published As
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| JP2009278131A (ja) | 2009-11-26 |
| WO2002023614A1 (fr) | 2002-03-21 |
| JPWO2002023614A1 (ja) | 2004-01-22 |
| US20040053472A1 (en) | 2004-03-18 |
| EP1326271A1 (en) | 2003-07-09 |
| TWI293781B (enExample) | 2008-02-21 |
| KR20030051654A (ko) | 2003-06-25 |
| EP1326271A4 (en) | 2005-08-24 |
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