KR100478316B1 - 보호소자 - Google Patents
보호소자 Download PDFInfo
- Publication number
- KR100478316B1 KR100478316B1 KR10-2001-0026315A KR20010026315A KR100478316B1 KR 100478316 B1 KR100478316 B1 KR 100478316B1 KR 20010026315 A KR20010026315 A KR 20010026315A KR 100478316 B1 KR100478316 B1 KR 100478316B1
- Authority
- KR
- South Korea
- Prior art keywords
- metal body
- low melting
- point metal
- melting point
- electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
- H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
- H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fuses (AREA)
- Protection Of Static Devices (AREA)
Abstract
Description
전극 | 땜납박 | [땜납박 단면적]/[전극면적] | 판정 | |||
L2(㎜) | W2(㎜) | 면적(㎟) | 단면적(㎟) | |||
실시예1 | 0.3 | 1.5 | 0.45 | 0.02 | 0.044 | OK |
실시예2 | 0.4 | 1.5 | 0.60 | 0.06 | 0.100 | OK |
실시예3 | 0.5 | 1.5 | 0.75 | 0.06 | 0.080 | OK |
실시예4 | 0.7 | 1.5 | 1.05 | 0.15 | 0.143 | OK |
실시예5 | 0.9 | 1.8 | 1.62 | 0.20 | 0.123 | OK |
실시예6 | 1.4 | 1.8 | 2.52 | 0.30 | 0.119 | OK |
실시예7 | 1.4 | 2.0 | 2.80 | 0.30 | 0.107 | OK |
실시예8 | 1.6 | 2.0 | 3.20 | 0.40 | 0.125 | OK |
비교예1 | 0.3 | 1.5 | 0.45 | 0.08 | 0.178 | NG |
비교예2 | 0.4 | 1.5 | 0.60 | 0.10 | 0.167 | NG |
비교예3 | 0.5 | 1.5 | 0.75 | 0.15 | 0.200 | NG |
비교예4 | 0.7 | 1.5 | 1.05 | 0.18 | 0.171 | NG |
비교예5 | 0.9 | 1.8 | 1.62 | 0.30 | 0.185 | NG |
비교예6 | 1.4 | 1.8 | 2.52 | 0.40 | 0.159 | NG |
비교예7 | 1.4 | 2.0 | 2.80 | 0.50 | 0.179 | NG |
비교예8 | 1.6 | 2.0 | 3.20 | 0.50 | 0.156 | NG |
땜납박단면적(㎟) | 전극간 거리(㎜) | [전극간 거리]/[땜납박 단면적](㎜-1) | 판정 | |
실시예9 | 0.02 | 0.6 | 30.0 | OK |
실시예10 | 0.04 | 0.6 | 15.0 | OK |
실시예11 | 0.06 | 1.0 | 16.7 | OK |
실시예12 | 0.15 | 0.4 | 2.7 | OK |
실시예13 | 0.20 | 0.6 | 3.0 | OK |
실시예14 | 0.50 | 1.5 | 3.0 | OK |
비교예9 | 0.02 | 1.0 | 50.0 | NG*1 |
비교예10 | 0.04 | 1.5 | 37.5 | NG*2 |
비교예11 | 0.06 | 2.0 | 33.3 | NG*2 |
비교예12 | 0.15 | 0.2 | 1.3 | NG*3 |
비교예13 | 0.20 | 0.4 | 2.0 | NG*3 |
비교예14 | 0.50 | 1.0 | 2.0 | NG*4 |
*1:땜납박압착시에 땜납박이 용단*2:땜납박의 단면적이, 국부적으로 초기단면적의 75% 정도의 가느다란 부분있음*3:4W 동작개시후 60초 경과하여도 용단하지 않음*4:4W 동작개시후 40초에 용단 |
Claims (2)
- (정정) 기판상에 발열체 및 저융점 금속체를 구비하여, 상기 발열체의 발열에 의해 상기 저융점 금속체가 용융되어, 전극상에 흘러들어감으로써 상기 저융점 금속체가 용단되는 보호소자에 있어서,상기 저융점 금속체의 단면적은 상기 저융점 금속체를 통해 흐르는 전류의 방향과 수직인 평면들의 단면적들의 평균값으로 하고, 용단 유효 전극면적은, 용융된 상기 저융점 금속체가 흘러들어가는 각 전극에 대하여 상기 저융점 금속체가 완전히 용융되어 유동이 개시된 후 1분 동안에 용융 상태의 저융점 금속체를 적실 수 있는 전극의 표면적으로 하는 경우에, 용융된 상기 저융점 금속체가 흘러들어가는 적어도 하나의 전극에 대하여, 다음 식 (1)[저융점 금속체의 단면적]/[용단 유효 전극면적]≤0.15 (1)가 만족되는 것을 특징으로 하는 보호소자.
- (정정) 기판상에 발열체 및 저융점 금속체를 구비하여, 발열체의 발열에 의해 상기 저융점 금속체가 용융되어, 전극상에 흘러들어감으로써 상기 저융점 금속체가 용단되는 보호소자에 있어서,상기 저융점 금속체의 단면적은 상기 저융점 금속체를 통해 흐르는 전류의 방향과 수직인 평면들의 단면적들의 평균값으로 하고, 용융된 상기 저융점 금속체가 흘러들어가는 전극 중 상기 저융점 금속체를 통하여 인접하는 전극끼리의 거리를 전극간 거리로 한 경우에, 다음 식 (2)2.5 ≤[전극간 거리]/[저융점 금속체의 단면적]≤30 (2)가 만족되는 것을 특징으로 하는 보호소자.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000145692A JP2001325869A (ja) | 2000-05-17 | 2000-05-17 | 保護素子 |
JP2000-145692 | 2000-05-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010105186A KR20010105186A (ko) | 2001-11-28 |
KR100478316B1 true KR100478316B1 (ko) | 2005-03-23 |
Family
ID=18652160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0026315A KR100478316B1 (ko) | 2000-05-17 | 2001-05-15 | 보호소자 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6566995B2 (ko) |
EP (1) | EP1156527A3 (ko) |
JP (1) | JP2001325869A (ko) |
KR (1) | KR100478316B1 (ko) |
CN (1) | CN1242442C (ko) |
TW (1) | TW503421B (ko) |
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- 2001-05-01 TW TW090110387A patent/TW503421B/zh not_active IP Right Cessation
- 2001-05-15 KR KR10-2001-0026315A patent/KR100478316B1/ko active IP Right Grant
- 2001-05-16 EP EP01111837A patent/EP1156527A3/en not_active Withdrawn
- 2001-05-17 CN CNB011215003A patent/CN1242442C/zh not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
US20020014945A1 (en) | 2002-02-07 |
KR20010105186A (ko) | 2001-11-28 |
EP1156527A2 (en) | 2001-11-21 |
JP2001325869A (ja) | 2001-11-22 |
US6566995B2 (en) | 2003-05-20 |
CN1242442C (zh) | 2006-02-15 |
CN1324086A (zh) | 2001-11-28 |
EP1156527A3 (en) | 2005-11-02 |
TW503421B (en) | 2002-09-21 |
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