TW503421B - Protective element - Google Patents

Protective element Download PDF

Info

Publication number
TW503421B
TW503421B TW090110387A TW90110387A TW503421B TW 503421 B TW503421 B TW 503421B TW 090110387 A TW090110387 A TW 090110387A TW 90110387 A TW90110387 A TW 90110387A TW 503421 B TW503421 B TW 503421B
Authority
TW
Taiwan
Prior art keywords
low melting
metal member
melting point
point metal
heat
Prior art date
Application number
TW090110387A
Other languages
English (en)
Inventor
Yuji Furuuchi
Masami Kawazu
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Application granted granted Critical
Publication of TW503421B publication Critical patent/TW503421B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fuses (AREA)
  • Protection Of Static Devices (AREA)
TW090110387A 2000-05-17 2001-05-01 Protective element TW503421B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000145692A JP2001325869A (ja) 2000-05-17 2000-05-17 保護素子

Publications (1)

Publication Number Publication Date
TW503421B true TW503421B (en) 2002-09-21

Family

ID=18652160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090110387A TW503421B (en) 2000-05-17 2001-05-01 Protective element

Country Status (6)

Country Link
US (1) US6566995B2 (zh)
EP (1) EP1156527A3 (zh)
JP (1) JP2001325869A (zh)
KR (1) KR100478316B1 (zh)
CN (1) CN1242442C (zh)
TW (1) TW503421B (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8675333B2 (en) 2009-09-04 2014-03-18 Cyntec Co., Ltd. Protective device
TWI452592B (zh) * 2010-04-16 2014-09-11 Cyntec Co Ltd 保護元件及電子裝置
TWI456617B (zh) * 2010-05-14 2014-10-11 Cyntec Co Ltd 保護元件及電子裝置
US9025295B2 (en) 2009-09-04 2015-05-05 Cyntec Co., Ltd. Protective device and protective module
US9129769B2 (en) 2009-09-04 2015-09-08 Cyntec Co., Ltd. Protective device
TWI575832B (zh) * 2011-12-19 2017-03-21 Dexerials Corp A protective element, a manufacturing method of a protective element, and a battery module in which a protective element is incorporated

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US7269249B2 (en) 2001-09-28 2007-09-11 At&T Bls Intellectual Property, Inc. Systems and methods for providing user profile information in conjunction with an enhanced caller information system
US7079837B1 (en) * 2001-11-06 2006-07-18 Bellsouth Intellectual Property Corporation Caller identification queue for wireless telephones
US7315618B1 (en) 2001-12-27 2008-01-01 At&T Bls Intellectual Property, Inc. Voice caller ID
US9886309B2 (en) * 2002-06-28 2018-02-06 Microsoft Technology Licensing, Llc Identity-based distributed computing for device resources
US7139374B1 (en) 2002-07-23 2006-11-21 Bellsouth Intellectual Property Corp. System and method for gathering information related to a geographical location of a callee in a public switched telephone network
US7623645B1 (en) 2002-07-23 2009-11-24 At&T Intellectual Property, I, L.P. System and method for gathering information related to a geographical location of a caller in a public switched telephone network
JP4095426B2 (ja) * 2002-12-12 2008-06-04 ソニーケミカル＆インフォメーションデバイス株式会社 二次電池装置
JP4110967B2 (ja) * 2002-12-27 2008-07-02 ソニーケミカル＆インフォメーションデバイス株式会社 保護素子
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US7978833B2 (en) 2003-04-18 2011-07-12 At&T Intellectual Property I, L.P. Private caller ID messaging
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US8160226B2 (en) 2007-08-22 2012-04-17 At&T Intellectual Property I, L.P. Key word programmable caller ID
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JP5072796B2 (ja) * 2008-05-23 2012-11-14 ソニーケミカル＆インフォメーションデバイス株式会社 保護素子及び二次電池装置
JP5301298B2 (ja) * 2009-01-21 2013-09-25 デクセリアルズ株式会社 保護素子
JP5130232B2 (ja) 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
JP5130233B2 (ja) * 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
KR101060013B1 (ko) * 2009-04-21 2011-08-26 스마트전자 주식회사 퓨즈저항기 및 그 제조방법과 설치방법
CN102034655B (zh) * 2009-09-25 2014-02-12 乾坤科技股份有限公司 保护元件
CN102117720A (zh) * 2009-12-31 2011-07-06 比亚迪股份有限公司 一种温度保护装置
JP5549427B2 (ja) * 2010-06-30 2014-07-16 ミツミ電機株式会社 温度ヒューズ、温度ヒューズ取付方法および保護装置
US8976001B2 (en) * 2010-11-08 2015-03-10 Cyntec Co., Ltd. Protective device
US8461956B2 (en) * 2011-07-20 2013-06-11 Polytronics Technology Corp. Over-current protection device
JP5844669B2 (ja) * 2012-03-26 2016-01-20 デクセリアルズ株式会社 保護素子
JP6249600B2 (ja) 2012-03-29 2017-12-20 デクセリアルズ株式会社 保護素子
JP2014022050A (ja) * 2012-07-12 2014-02-03 Dexerials Corp 保護素子
JP6081096B2 (ja) * 2012-08-01 2017-02-15 デクセリアルズ株式会社 保護素子及びバッテリパック
US9887057B2 (en) 2012-11-20 2018-02-06 Littelfuse, Inc. Remote activated fuse and circuit
KR101401141B1 (ko) * 2012-11-26 2014-05-30 스마트전자 주식회사 비정상상태의 전류 및 전압을 차단하는 복합보호소자
KR101388354B1 (ko) * 2012-11-26 2014-04-24 스마트전자 주식회사 비정상상태의 전류 및 전압을 차단하는 복합보호소자
CN104659013A (zh) * 2013-11-19 2015-05-27 中芯国际集成电路制造(上海)有限公司 电熔丝结构及半导体器件
KR101504133B1 (ko) * 2014-02-28 2015-03-19 스마트전자 주식회사 복합보호소자
KR101434135B1 (ko) * 2014-03-17 2014-08-26 스마트전자 주식회사 퓨즈 저항기
JP6576618B2 (ja) * 2014-05-28 2019-09-18 デクセリアルズ株式会社 保護素子
DE102015108758A1 (de) * 2014-06-13 2015-12-17 Smart Electronics Inc. Komplexe Schutzvorrichtung
JP6294165B2 (ja) * 2014-06-19 2018-03-14 Koa株式会社 チップ型ヒューズ
DE102014215279A1 (de) * 2014-08-04 2016-02-04 Phoenix Contact Gmbh & Co. Kg Schmelzsicherung für eine zu schützende Einrichtung
DE102015225377A1 (de) * 2015-12-16 2017-06-22 Phoenix Contact Gmbh & Co. Kg Laststromtragende Sicherung mit internem Schaltelement
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JP7231527B2 (ja) * 2018-12-28 2023-03-01 ショット日本株式会社 保護素子用ヒューズ素子およびそれを利用した保護素子
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8675333B2 (en) 2009-09-04 2014-03-18 Cyntec Co., Ltd. Protective device
US9025295B2 (en) 2009-09-04 2015-05-05 Cyntec Co., Ltd. Protective device and protective module
US9129769B2 (en) 2009-09-04 2015-09-08 Cyntec Co., Ltd. Protective device
US9336978B2 (en) 2009-09-04 2016-05-10 Cyntec Co., Ltd. Protective device
TWI452592B (zh) * 2010-04-16 2014-09-11 Cyntec Co Ltd 保護元件及電子裝置
TWI456617B (zh) * 2010-05-14 2014-10-11 Cyntec Co Ltd 保護元件及電子裝置
TWI575832B (zh) * 2011-12-19 2017-03-21 Dexerials Corp A protective element, a manufacturing method of a protective element, and a battery module in which a protective element is incorporated

Also Published As

Publication number Publication date
US20020014945A1 (en) 2002-02-07
KR20010105186A (ko) 2001-11-28
EP1156527A2 (en) 2001-11-21
JP2001325869A (ja) 2001-11-22
US6566995B2 (en) 2003-05-20
CN1242442C (zh) 2006-02-15
CN1324086A (zh) 2001-11-28
EP1156527A3 (en) 2005-11-02
KR100478316B1 (ko) 2005-03-23

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