KR100344373B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR100344373B1
KR100344373B1 KR1020000054154A KR20000054154A KR100344373B1 KR 100344373 B1 KR100344373 B1 KR 100344373B1 KR 1020000054154 A KR1020000054154 A KR 1020000054154A KR 20000054154 A KR20000054154 A KR 20000054154A KR 100344373 B1 KR100344373 B1 KR 100344373B1
Authority
KR
South Korea
Prior art keywords
capacitor
wiring
line
present
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020000054154A
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English (en)
Korean (ko)
Other versions
KR20010039886A (ko
Inventor
마에다시게노부
야마모또가즈야
Original Assignee
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시덴키 가부시키가이샤 filed Critical 미쓰비시덴키 가부시키가이샤
Publication of KR20010039886A publication Critical patent/KR20010039886A/ko
Application granted granted Critical
Publication of KR100344373B1 publication Critical patent/KR100344373B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020000054154A 1999-10-27 2000-09-15 반도체 장치 Expired - Fee Related KR100344373B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1999-305262 1999-10-27
JP30526299A JP4446525B2 (ja) 1999-10-27 1999-10-27 半導体装置

Publications (2)

Publication Number Publication Date
KR20010039886A KR20010039886A (ko) 2001-05-15
KR100344373B1 true KR100344373B1 (ko) 2002-07-24

Family

ID=17942993

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000054154A Expired - Fee Related KR100344373B1 (ko) 1999-10-27 2000-09-15 반도체 장치

Country Status (5)

Country Link
US (1) US6465832B1 (enExample)
JP (1) JP4446525B2 (enExample)
KR (1) KR100344373B1 (enExample)
DE (1) DE10046910A1 (enExample)
TW (1) TW461075B (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10206918A1 (de) * 2002-02-19 2003-08-28 Infineon Technologies Ag Kondensatorelement und Verfahren zum Erzeugen eines Kondensatorelements
DE10217565A1 (de) * 2002-04-19 2003-11-13 Infineon Technologies Ag Halbleiterbauelement mit integrierter gitterförmiger Kapazitätsstruktur
DE10217567A1 (de) * 2002-04-19 2003-11-13 Infineon Technologies Ag Halbleiterbauelement mit integrierter Kapazitätsstruktur und Verfahren zu dessen Herstellung
US6999298B2 (en) * 2003-09-18 2006-02-14 American Semiconductor, Inc. MIM multilayer capacitor
WO2005062355A1 (en) * 2003-12-23 2005-07-07 Telefonaktiebolaget Lm Ericsson (Publ) Capacitor
JP2006261455A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 半導体装置およびｍｉｍキャパシタ
US7645675B2 (en) * 2006-01-13 2010-01-12 International Business Machines Corporation Integrated parallel plate capacitors
JP5101079B2 (ja) * 2006-10-19 2012-12-19 ルネサスエレクトロニクス株式会社 半導体装置
US9177908B2 (en) * 2007-04-30 2015-11-03 Taiwan Semiconductor Manufacturing Company, Limited Stacked semiconductor capacitor structure
US8716778B2 (en) 2008-11-17 2014-05-06 Altera Corporation Metal-insulator-metal capacitors
KR101337075B1 (ko) * 2008-11-21 2013-12-05 자일링크스 인코포레이티드 집적 커패시터의 차폐
US7956438B2 (en) 2008-11-21 2011-06-07 Xilinx, Inc. Integrated capacitor with interlinked lateral fins
US8207592B2 (en) 2008-11-21 2012-06-26 Xilinx, Inc. Integrated capacitor with array of crosses
US7944732B2 (en) 2008-11-21 2011-05-17 Xilinx, Inc. Integrated capacitor with alternating layered segments
US8362589B2 (en) 2008-11-21 2013-01-29 Xilinx, Inc. Integrated capacitor with cabled plates
US7994610B1 (en) 2008-11-21 2011-08-09 Xilinx, Inc. Integrated capacitor with tartan cross section
US7994609B2 (en) 2008-11-21 2011-08-09 Xilinx, Inc. Shielding for integrated capacitors
JP2010093288A (ja) * 2009-12-18 2010-04-22 Renesas Technology Corp 半導体装置
IT1403475B1 (it) * 2010-12-20 2013-10-17 St Microelectronics Srl Struttura di connessione per un circuito integrato con funzione capacitiva
US8653844B2 (en) 2011-03-07 2014-02-18 Xilinx, Inc. Calibrating device performance within an integrated circuit
US8941974B2 (en) 2011-09-09 2015-01-27 Xilinx, Inc. Interdigitated capacitor having digits of varying width
US9153642B2 (en) * 2013-03-05 2015-10-06 Qualcomm Incorporated Metal-oxide-metal (MOM) capacitor with enhanced capacitance
US9093378B2 (en) 2013-03-15 2015-07-28 Samsung Electronics Co., Ltd. Method for forming patterns of semiconductor device using SADP process
US9270247B2 (en) 2013-11-27 2016-02-23 Xilinx, Inc. High quality factor inductive and capacitive circuit structure
US9524964B2 (en) 2014-08-14 2016-12-20 Xilinx, Inc. Capacitor structure in an integrated circuit
US10014692B2 (en) * 2014-12-18 2018-07-03 Intel Corporation Apparatuses, methods, and systems with cross-coupling noise reduction
CN113711322B (zh) * 2019-04-15 2023-06-16 华为技术有限公司 电容器和半导体芯片
EP3991218A1 (en) * 2019-06-28 2022-05-04 CoreHW Semiconductor Oy A capacitor structure and a chip antenna
US20240130046A1 (en) * 2021-02-22 2024-04-18 Nippon Telegraph And Telephone Corporation Capacitor
JP7724746B2 (ja) * 2022-05-19 2025-08-18 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
US20240429269A1 (en) * 2023-06-26 2024-12-26 Intel Corporation Integrated capacitor
CN119364777B (zh) * 2024-12-23 2025-04-11 南京云程半导体有限公司 电容结构和半导体结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419310A (en) * 1981-05-06 1983-12-06 Sprague Electric Company SrTiO3 barrier layer capacitor
JP3322936B2 (ja) * 1992-03-19 2002-09-09 株式会社東芝 半導体記憶装置
JPH07130876A (ja) 1993-11-05 1995-05-19 Sony Corp スタティック記憶セル
US5583359A (en) * 1995-03-03 1996-12-10 Northern Telecom Limited Capacitor structure for an integrated circuit
JPH08298320A (ja) * 1995-04-26 1996-11-12 Nippondenso Co Ltd 半導体装置
US6028324A (en) * 1997-03-07 2000-02-22 Taiwan Semiconductor Manufacturing Company Test structures for monitoring gate oxide defect densities and the plasma antenna effect
KR100245562B1 (ko) * 1997-10-14 2000-03-02 윤종용 고속으로 동작하는 반도체 장치에서 신호 간섭을방지하기 위한배선 구조
US6088258A (en) * 1998-05-28 2000-07-11 International Business Machines Corporation Structures for reduced topography capacitors
US6144053A (en) * 1999-01-20 2000-11-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a capacitor with a high dielectric constant film
US6297524B1 (en) * 2000-04-04 2001-10-02 Philips Electronics North America Corporation Multilayer capacitor structure having an array of concentric ring-shaped plates for deep sub-micron CMOS

Also Published As

Publication number Publication date
KR20010039886A (ko) 2001-05-15
JP2001127247A (ja) 2001-05-11
TW461075B (en) 2001-10-21
DE10046910A1 (de) 2001-05-10
JP4446525B2 (ja) 2010-04-07
US6465832B1 (en) 2002-10-15

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