DE10046910A1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE10046910A1
DE10046910A1 DE10046910A DE10046910A DE10046910A1 DE 10046910 A1 DE10046910 A1 DE 10046910A1 DE 10046910 A DE10046910 A DE 10046910A DE 10046910 A DE10046910 A DE 10046910A DE 10046910 A1 DE10046910 A1 DE 10046910A1
Authority
DE
Germany
Prior art keywords
line
capacitor
semiconductor device
lines
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10046910A
Other languages
German (de)
English (en)
Inventor
Shigenobu Maeda
Kazuya Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE10046910A1 publication Critical patent/DE10046910A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE10046910A 1999-10-27 2000-09-21 Halbleitervorrichtung Ceased DE10046910A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30526299A JP4446525B2 (ja) 1999-10-27 1999-10-27 半導体装置

Publications (1)

Publication Number Publication Date
DE10046910A1 true DE10046910A1 (de) 2001-05-10

Family

ID=17942993

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10046910A Ceased DE10046910A1 (de) 1999-10-27 2000-09-21 Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US6465832B1 (enExample)
JP (1) JP4446525B2 (enExample)
KR (1) KR100344373B1 (enExample)
DE (1) DE10046910A1 (enExample)
TW (1) TW461075B (enExample)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10206918A1 (de) * 2002-02-19 2003-08-28 Infineon Technologies Ag Kondensatorelement und Verfahren zum Erzeugen eines Kondensatorelements
WO2003090279A1 (de) * 2002-04-19 2003-10-30 Infineon Technologies Ag Halbleiterbauelement mit integrierter gitterförmiger kapazitätsstruktur
WO2003090280A1 (de) * 2002-04-19 2003-10-30 Infineon Technologies Ag Halbleiterbauelement mit integrierter kapazitätsstruktur und verfahren zu dessen herstellung
WO2010059335A1 (en) * 2008-11-21 2010-05-27 Xilinx, Inc. Shielding for integrated capacitors
US7944732B2 (en) 2008-11-21 2011-05-17 Xilinx, Inc. Integrated capacitor with alternating layered segments
US7956438B2 (en) 2008-11-21 2011-06-07 Xilinx, Inc. Integrated capacitor with interlinked lateral fins
US7994610B1 (en) 2008-11-21 2011-08-09 Xilinx, Inc. Integrated capacitor with tartan cross section
US7994609B2 (en) 2008-11-21 2011-08-09 Xilinx, Inc. Shielding for integrated capacitors
ITVI20100339A1 (it) * 2010-12-20 2012-06-21 St Microelectronics Srl Struttura di connessione per un circuito integrato con funzione capacitiva
US8207592B2 (en) 2008-11-21 2012-06-26 Xilinx, Inc. Integrated capacitor with array of crosses
US8362589B2 (en) 2008-11-21 2013-01-29 Xilinx, Inc. Integrated capacitor with cabled plates
EP2351082A4 (en) * 2008-11-17 2013-06-26 Altera Corp METAL-INSULATOR-METAL CAPACITORS
US8653844B2 (en) 2011-03-07 2014-02-18 Xilinx, Inc. Calibrating device performance within an integrated circuit
US8941974B2 (en) 2011-09-09 2015-01-27 Xilinx, Inc. Interdigitated capacitor having digits of varying width
US9270247B2 (en) 2013-11-27 2016-02-23 Xilinx, Inc. High quality factor inductive and capacitive circuit structure
US9524964B2 (en) 2014-08-14 2016-12-20 Xilinx, Inc. Capacitor structure in an integrated circuit

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6999298B2 (en) * 2003-09-18 2006-02-14 American Semiconductor, Inc. MIM multilayer capacitor
US20070217122A1 (en) * 2003-12-23 2007-09-20 Telefonaktiebolaget Lm Ericsson (Publ) Capacitor
JP2006261455A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 半導体装置およびｍｉｍキャパシタ
US7645675B2 (en) * 2006-01-13 2010-01-12 International Business Machines Corporation Integrated parallel plate capacitors
JP5101079B2 (ja) * 2006-10-19 2012-12-19 ルネサスエレクトロニクス株式会社 半導体装置
US9177908B2 (en) * 2007-04-30 2015-11-03 Taiwan Semiconductor Manufacturing Company, Limited Stacked semiconductor capacitor structure
JP2010093288A (ja) * 2009-12-18 2010-04-22 Renesas Technology Corp 半導体装置
US9153642B2 (en) * 2013-03-05 2015-10-06 Qualcomm Incorporated Metal-oxide-metal (MOM) capacitor with enhanced capacitance
US9093378B2 (en) 2013-03-15 2015-07-28 Samsung Electronics Co., Ltd. Method for forming patterns of semiconductor device using SADP process
US10014692B2 (en) * 2014-12-18 2018-07-03 Intel Corporation Apparatuses, methods, and systems with cross-coupling noise reduction
WO2020210932A1 (zh) * 2019-04-15 2020-10-22 华为技术有限公司 电容器和半导体芯片
WO2020260747A1 (en) * 2019-06-28 2020-12-30 Corehw Semiconductor Oy A capacitor structure and a chip antenna
WO2022176188A1 (ja) * 2021-02-22 2022-08-25 日本電信電話株式会社 キャパシタ
JP7724746B2 (ja) * 2022-05-19 2025-08-18 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
CN119364777B (zh) * 2024-12-23 2025-04-11 南京云程半导体有限公司 电容结构和半导体结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419310A (en) * 1981-05-06 1983-12-06 Sprague Electric Company SrTiO3 barrier layer capacitor
JP3322936B2 (ja) * 1992-03-19 2002-09-09 株式会社東芝 半導体記憶装置
JPH07130876A (ja) 1993-11-05 1995-05-19 Sony Corp スタティック記憶セル
US5583359A (en) * 1995-03-03 1996-12-10 Northern Telecom Limited Capacitor structure for an integrated circuit
JPH08298320A (ja) * 1995-04-26 1996-11-12 Nippondenso Co Ltd 半導体装置
US6028324A (en) * 1997-03-07 2000-02-22 Taiwan Semiconductor Manufacturing Company Test structures for monitoring gate oxide defect densities and the plasma antenna effect
KR100245562B1 (ko) * 1997-10-14 2000-03-02 윤종용 고속으로 동작하는 반도체 장치에서 신호 간섭을방지하기 위한배선 구조
US6088258A (en) * 1998-05-28 2000-07-11 International Business Machines Corporation Structures for reduced topography capacitors
US6144053A (en) * 1999-01-20 2000-11-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a capacitor with a high dielectric constant film
US6297524B1 (en) * 2000-04-04 2001-10-02 Philips Electronics North America Corporation Multilayer capacitor structure having an array of concentric ring-shaped plates for deep sub-micron CMOS

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10206918A1 (de) * 2002-02-19 2003-08-28 Infineon Technologies Ag Kondensatorelement und Verfahren zum Erzeugen eines Kondensatorelements
WO2003090279A1 (de) * 2002-04-19 2003-10-30 Infineon Technologies Ag Halbleiterbauelement mit integrierter gitterförmiger kapazitätsstruktur
WO2003090280A1 (de) * 2002-04-19 2003-10-30 Infineon Technologies Ag Halbleiterbauelement mit integrierter kapazitätsstruktur und verfahren zu dessen herstellung
DE10217567A1 (de) * 2002-04-19 2003-11-13 Infineon Technologies Ag Halbleiterbauelement mit integrierter Kapazitätsstruktur und Verfahren zu dessen Herstellung
US7768054B2 (en) 2002-04-19 2010-08-03 Infineon Technologies, Ag Semiconductor component with integrated capacitance structure and method for fabrication thereof
US8716778B2 (en) 2008-11-17 2014-05-06 Altera Corporation Metal-insulator-metal capacitors
EP2351082A4 (en) * 2008-11-17 2013-06-26 Altera Corp METAL-INSULATOR-METAL CAPACITORS
US7944732B2 (en) 2008-11-21 2011-05-17 Xilinx, Inc. Integrated capacitor with alternating layered segments
US7994610B1 (en) 2008-11-21 2011-08-09 Xilinx, Inc. Integrated capacitor with tartan cross section
US7994609B2 (en) 2008-11-21 2011-08-09 Xilinx, Inc. Shielding for integrated capacitors
US7956438B2 (en) 2008-11-21 2011-06-07 Xilinx, Inc. Integrated capacitor with interlinked lateral fins
US8207592B2 (en) 2008-11-21 2012-06-26 Xilinx, Inc. Integrated capacitor with array of crosses
WO2010059335A1 (en) * 2008-11-21 2010-05-27 Xilinx, Inc. Shielding for integrated capacitors
US8362589B2 (en) 2008-11-21 2013-01-29 Xilinx, Inc. Integrated capacitor with cabled plates
ITVI20100339A1 (it) * 2010-12-20 2012-06-21 St Microelectronics Srl Struttura di connessione per un circuito integrato con funzione capacitiva
WO2012084207A1 (en) * 2010-12-20 2012-06-28 Stmicroelectronics S.R.L. Connection structure for an integrated circuit with capacitive function
US9257499B2 (en) 2010-12-20 2016-02-09 Stmicroelectronics S.R.L. Connection structure for an integrated circuit with capacitive function
US8653844B2 (en) 2011-03-07 2014-02-18 Xilinx, Inc. Calibrating device performance within an integrated circuit
US8941974B2 (en) 2011-09-09 2015-01-27 Xilinx, Inc. Interdigitated capacitor having digits of varying width
US9270247B2 (en) 2013-11-27 2016-02-23 Xilinx, Inc. High quality factor inductive and capacitive circuit structure
US9524964B2 (en) 2014-08-14 2016-12-20 Xilinx, Inc. Capacitor structure in an integrated circuit

Also Published As

Publication number Publication date
JP4446525B2 (ja) 2010-04-07
US6465832B1 (en) 2002-10-15
JP2001127247A (ja) 2001-05-11
TW461075B (en) 2001-10-21
KR100344373B1 (ko) 2002-07-24
KR20010039886A (ko) 2001-05-15

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection