KR100312058B1 - 집적회로(ic)패키지테스트용소켓장치 - Google Patents

집적회로(ic)패키지테스트용소켓장치 Download PDF

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Publication number
KR100312058B1
KR100312058B1 KR1019940003311A KR19940003311A KR100312058B1 KR 100312058 B1 KR100312058 B1 KR 100312058B1 KR 1019940003311 A KR1019940003311 A KR 1019940003311A KR 19940003311 A KR19940003311 A KR 19940003311A KR 100312058 B1 KR100312058 B1 KR 100312058B1
Authority
KR
South Korea
Prior art keywords
contact
block
lead wire
slip block
slip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940003311A
Other languages
English (en)
Korean (ko)
Other versions
KR940020126A (ko
Inventor
모리이쿠오
이케야기요카주
Original Assignee
윌리엄 비. 켐플러
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=13155880&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100312058(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 윌리엄 비. 켐플러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 비. 켐플러
Publication of KR940020126A publication Critical patent/KR940020126A/ko
Application granted granted Critical
Publication of KR100312058B1 publication Critical patent/KR100312058B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1019940003311A 1993-02-24 1994-02-24 집적회로(ic)패키지테스트용소켓장치 Expired - Fee Related KR100312058B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6090693 1993-02-24
JP93-60906 1993-02-24

Publications (2)

Publication Number Publication Date
KR940020126A KR940020126A (ko) 1994-09-15
KR100312058B1 true KR100312058B1 (ko) 2001-12-28

Family

ID=13155880

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940003311A Expired - Fee Related KR100312058B1 (ko) 1993-02-24 1994-02-24 집적회로(ic)패키지테스트용소켓장치

Country Status (6)

Country Link
US (1) US5482471A (enExample)
EP (1) EP0613335B1 (enExample)
JP (1) JP2973161B2 (enExample)
KR (1) KR100312058B1 (enExample)
DE (1) DE69400884T2 (enExample)
TW (1) TW280018B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100478269B1 (ko) * 2002-05-29 2005-03-23 주식회사 유니테스트 반도체 디바이스 방향전환시스템

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GB2290176B (en) * 1994-06-10 1997-07-02 Wayne Kay Pfaff Mounting apparatus for ball grid array device
JP3256796B2 (ja) * 1994-08-23 2002-02-12 日本テキサス・インスツルメンツ株式会社 ソケット及びソケットを用いた電気部品の試験方法
WO1997003467A1 (en) * 1995-07-10 1997-01-30 Pcd Inc. Top loading socket for ball grid arrays
US5647756A (en) * 1995-12-19 1997-07-15 Minnesota Mining And Manufacturing Integrated circuit test socket having toggle clamp lid
US5688140A (en) * 1995-12-28 1997-11-18 Hon Hai Precision Ind. Co., Ltd. Chip carrier socket
JP3745060B2 (ja) * 1996-12-09 2006-02-15 日本テキサス・インスツルメンツ株式会社 ソケット
JP3270716B2 (ja) * 1997-07-04 2002-04-02 日本テキサス・インスツルメンツ株式会社 ソケット及び半導体装置の取付方法
US6267603B1 (en) * 1998-04-01 2001-07-31 Molex Incorporated Burn-in test socket
TW437037B (en) * 1998-09-23 2001-05-28 Wells Cti Inc Vertically actuated bag socket
US6045381A (en) * 1998-12-18 2000-04-04 Hon Hai Precision Ind. Co., Ltd. Two-layer ZIF PGA socket
US6071138A (en) * 1998-12-21 2000-06-06 Hon Hai Precision Ind. Co., Ltd. Driving mechanism of a ZIF PGA socket and the socket using the same
TW415701U (en) * 1998-12-22 2000-12-11 Hon Hai Prec Ind Co Ltd Electronic connector
JP3257994B2 (ja) 1999-08-30 2002-02-18 日本テキサス・インスツルメンツ株式会社 ソケット
US6280222B1 (en) * 2000-07-25 2001-08-28 Hon Hai Precision Ind. Co., Ltd. LGA socket with reliable securing mechanism
US6439912B1 (en) * 2001-03-14 2002-08-27 Advanced Micro Devices, Inc. Method and apparatus for lifting an integrated circuit from a socket
US6624647B2 (en) 2001-07-05 2003-09-23 Fci Usa, Inc. Test socket for ball grib array electronic module
JP2003059602A (ja) * 2001-08-08 2003-02-28 Yamaichi Electronics Co Ltd 半導体装置用ソケット
US6547580B1 (en) * 2001-09-24 2003-04-15 Texas Instruments Incorporated Socket apparatus particularly adapted for land grid array type semiconductor devices
US6692280B2 (en) * 2001-09-28 2004-02-17 Intel Corporation Socket warpage reduction apparatus and method
US6623290B2 (en) * 2001-12-18 2003-09-23 Intel Corporation Coverless ZIF socket for mounting an integrated circuit package on a circuit board
TW560718U (en) * 2002-11-15 2003-11-01 Hon Hai Prec Ind Co Ltd Electrical connector
TW549644U (en) * 2002-12-13 2003-08-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP3803099B2 (ja) * 2002-12-17 2006-08-02 山一電機株式会社 半導体装置用ソケット
US7244136B2 (en) * 2003-01-30 2007-07-17 Molex Incorporated ZIF electrical connector
US6969267B2 (en) * 2003-03-26 2005-11-29 Intel Corporation Land grid array socket loading device
US6916195B2 (en) * 2003-03-26 2005-07-12 Intel Corporation Land grid array socket loading device
TW568400U (en) * 2003-04-09 2003-12-21 Hon Hai Prec Ind Co Ltd Electrical connector assembly
TWI259622B (en) * 2003-07-11 2006-08-01 Via Tech Inc Lockable retractable locating frame of a BGA on-top test socket
US6881087B2 (en) * 2003-07-22 2005-04-19 Tyco Electronics Corporation Spring assisted lever actuated socket
US7195507B2 (en) * 2003-08-06 2007-03-27 Yamaichi Electronics U.S.A., Inc. Socket apparatus with actuation via pivotal motion
CN2703339Y (zh) * 2004-01-08 2005-06-01 富士康(昆山)电脑接插件有限公司 电连接器组件
US7101209B2 (en) * 2004-01-26 2006-09-05 Gold Technologies, Inc. Test socket
TWI299598B (en) * 2004-03-09 2008-08-01 Hon Hai Prec Ind Co Ltd Electrical connector
JP4073439B2 (ja) * 2004-04-16 2008-04-09 山一電機株式会社 半導体装置用ソケット
JP2005347220A (ja) * 2004-06-07 2005-12-15 Toshiba Corp コネクタ、電子機器、及びコネクタの実装方法
JP4312685B2 (ja) * 2004-08-31 2009-08-12 山一電機株式会社 半導体装置の着脱方法、それが用いられる半導体装置の着脱装置、および半導体装置用ソケット
US7121860B2 (en) * 2004-09-02 2006-10-17 Micron Technology, Inc. Pinch-style support contact, method of enabling electrical communication with and supporting an IC package, and socket including same
JP4471941B2 (ja) * 2005-03-10 2010-06-02 山一電機株式会社 半導体装置用ソケット
US7172450B1 (en) * 2006-01-11 2007-02-06 Qualitau, Inc. High temperature open ended zero insertion force (ZIF) test socket
CN200959466Y (zh) * 2006-08-22 2007-10-10 富士康(昆山)电脑接插件有限公司 电连接器
US20080081489A1 (en) * 2006-09-29 2008-04-03 Macgregor Mike G Reliable land grid array socket loading device
JP4495200B2 (ja) * 2007-09-28 2010-06-30 山一電機株式会社 半導体装置用ソケット
JP2010118275A (ja) * 2008-11-13 2010-05-27 Yamaichi Electronics Co Ltd 半導体装置用ソケット
US7736169B1 (en) * 2009-03-10 2010-06-15 Lotes Co., Ltd. Chip module sliding connector
US8727328B2 (en) * 2010-06-24 2014-05-20 Isc Co., Ltd. Insert for handler
SG11201402256QA (en) 2012-02-10 2014-06-27 Ismeca Semiconductor Holding Nest for testing electrical components
CN103543301A (zh) * 2013-10-31 2014-01-29 苏州艾克威尔科技有限公司 软起动器测试治具
KR102511698B1 (ko) * 2017-11-27 2023-03-20 삼성전자주식회사 반도체 패키지의 신호 속도 테스트 장치
CN110931381B (zh) * 2019-12-11 2021-12-14 深圳市英赛尔电子有限公司 一种连续测试的集成电路封装测试装置

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US4406505A (en) * 1981-02-18 1983-09-27 Daniel Woodhead, Inc. Grounding clip for electrical fixtures
JPS59165442A (ja) * 1983-03-10 1984-09-18 Yamaichi Electric Mfg Co Ltd 接触子
US4506941A (en) * 1983-11-23 1985-03-26 Burroughs Corporation Socket incorporating serially coupled springs
JPS61116783A (ja) * 1984-11-10 1986-06-04 山一電機株式会社 格子配列形ｉｃパツケ−ジ用ソケツト
GB8521843D0 (en) * 1985-09-03 1985-10-09 Bicc Plc Circuit board connector
JP2784570B2 (ja) * 1987-06-09 1998-08-06 日本テキサス・インスツルメンツ 株式会社 ソケツト
JPH02174084A (ja) * 1988-12-27 1990-07-05 Yamaichi Electric Mfg Co Ltd 電気部品用ソケットにおける接触及び接触解除用移動板の移動機構
US5213531A (en) * 1990-05-14 1993-05-25 Yamachi Electric Co., Ltd. Connector
US5123855A (en) * 1991-04-26 1992-06-23 Minnesota Mining And Manufacturing Company Zero insertion force connector for printed circuit boards
JP2665419B2 (ja) * 1991-08-13 1997-10-22 山一電機株式会社 電気部品用接続器
US5147213A (en) * 1991-10-24 1992-09-15 Minnesota Mining And Manufacturing Company Zero insertion pressure test socket for pin grid array electronic packages
US5290192A (en) * 1992-09-28 1994-03-01 Wells Electronics, Inc. Chip carrier socket

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100478269B1 (ko) * 2002-05-29 2005-03-23 주식회사 유니테스트 반도체 디바이스 방향전환시스템

Also Published As

Publication number Publication date
KR940020126A (ko) 1994-09-15
EP0613335B1 (en) 1996-11-13
US5482471A (en) 1996-01-09
DE69400884D1 (de) 1996-12-19
DE69400884T2 (de) 1997-04-03
JPH07235358A (ja) 1995-09-05
JP2973161B2 (ja) 1999-11-08
TW280018B (enExample) 1996-07-01
EP0613335A1 (en) 1994-08-31

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