SG11201402256QA - Nest for testing electrical components - Google Patents

Nest for testing electrical components

Info

Publication number
SG11201402256QA
SG11201402256QA SG11201402256QA SG11201402256QA SG11201402256QA SG 11201402256Q A SG11201402256Q A SG 11201402256QA SG 11201402256Q A SG11201402256Q A SG 11201402256QA SG 11201402256Q A SG11201402256Q A SG 11201402256QA SG 11201402256Q A SG11201402256Q A SG 11201402256QA
Authority
SG
Singapore
Prior art keywords
nest
electrical components
testing electrical
testing
components
Prior art date
Application number
SG11201402256QA
Inventor
Sylvain Vienot
Philippe Viverge
Massimo Scarpella
Philippe Roy
Original Assignee
Ismeca Semiconductor Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding filed Critical Ismeca Semiconductor Holding
Publication of SG11201402256QA publication Critical patent/SG11201402256QA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/2632Circuits therefor for testing diodes
    • G01R31/2635Testing light-emitting diodes, laser diodes or photodiodes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Seats For Vehicles (AREA)
SG11201402256QA 2012-02-10 2012-12-05 Nest for testing electrical components SG11201402256QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1862012 2012-02-10
PCT/EP2012/074397 WO2013117265A1 (en) 2012-02-10 2012-12-05 Nest for testing electrical components

Publications (1)

Publication Number Publication Date
SG11201402256QA true SG11201402256QA (en) 2014-06-27

Family

ID=47294902

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201402256QA SG11201402256QA (en) 2012-02-10 2012-12-05 Nest for testing electrical components

Country Status (9)

Country Link
US (1) US9523710B2 (en)
EP (1) EP2812713B1 (en)
KR (1) KR101885686B1 (en)
CN (1) CN104160288A (en)
MY (1) MY167965A (en)
PH (1) PH12014501249B1 (en)
SG (1) SG11201402256QA (en)
TW (1) TWI589894B (en)
WO (1) WO2013117265A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI589894B (en) 2012-02-10 2017-07-01 伊斯美加半導體控股公司 A nest
SG11201707232TA (en) * 2015-07-31 2017-10-30 Ismeca Semiconductor Holding Sa An assembly and method for handling components
KR102654553B1 (en) * 2023-12-13 2024-04-04 주식회사 프로이천 Nest plate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2976075B2 (en) * 1990-05-14 1999-11-10 日本テキサス・インスツルメンツ株式会社 socket
US5482471A (en) 1993-02-24 1996-01-09 Texas Instruments Incorporated Socket apparatus for IC package testing
US5469074A (en) * 1994-02-08 1995-11-21 The Whitaker Corporation Chip socket testing apparatus with adjustable contact force
US5578870A (en) * 1995-08-03 1996-11-26 Precision Connector Designs, Inc. Top loading test socket for ball grid arrays
JP2001212246A (en) 2000-02-07 2001-08-07 Shimadzu Corp Biodegradable stent
US6797936B1 (en) 2002-01-03 2004-09-28 Opto Electronic Systems, Inc. Automated laser diode testing
US6741089B2 (en) * 2002-01-14 2004-05-25 Micro Control Company Hinged heat sink burn-in socket
CH695871A5 (en) * 2002-11-07 2006-09-29 Ismeca Semiconductor Holding Apparatus and method for testing electronic components.
US6881088B2 (en) * 2003-07-29 2005-04-19 Hon Hai Precision Ind. Co., Ltd. Connector assembly with actuation system
CN201107385Y (en) * 2007-11-07 2008-08-27 深圳市同洲电子股份有限公司 Semiconductor high and low temperature experiment instrument
US8305104B2 (en) 2009-03-26 2012-11-06 Electro Scientific Industries, Inc. Testing and sorting system having a linear track and method of using the same
CN201976264U (en) * 2010-12-23 2011-09-14 大连艾科科技开发有限公司 Heating table applicable to welding and assembly of DIL (dual in-line) shell and butterfly shell internals
TWI589894B (en) 2012-02-10 2017-07-01 伊斯美加半導體控股公司 A nest
CN103424186A (en) * 2012-05-18 2013-12-04 全亿大科技(佛山)有限公司 Light emitting diode detection measuring tool

Also Published As

Publication number Publication date
EP2812713B1 (en) 2015-11-25
KR20140134263A (en) 2014-11-21
TW201333491A (en) 2013-08-16
PH12014501249A1 (en) 2014-09-08
EP2812713A1 (en) 2014-12-17
CN104160288A (en) 2014-11-19
US9523710B2 (en) 2016-12-20
TWI589894B (en) 2017-07-01
PH12014501249B1 (en) 2014-09-08
MY167965A (en) 2018-10-09
WO2013117265A1 (en) 2013-08-15
KR101885686B1 (en) 2018-09-11
US20140375323A1 (en) 2014-12-25

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