KR100239027B1 - 연질 금속 도체 및 그 제조 방법 - Google Patents

연질 금속 도체 및 그 제조 방법 Download PDF

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Publication number
KR100239027B1
KR100239027B1 KR1019950053758A KR19950053758A KR100239027B1 KR 100239027 B1 KR100239027 B1 KR 100239027B1 KR 1019950053758 A KR1019950053758 A KR 1019950053758A KR 19950053758 A KR19950053758 A KR 19950053758A KR 100239027 B1 KR100239027 B1 KR 100239027B1
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KR
South Korea
Prior art keywords
soft metal
layer
metal
particle size
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950053758A
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English (en)
Korean (ko)
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KR960030335A (ko
Inventor
바산트 조쉬 라지브
잠나다스 테좌니 마누
Original Assignee
포만 제프리 엘
인터내셔널 비지네스 머신즈 코포레이션
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Publication of KR960030335A publication Critical patent/KR960030335A/ko
Application granted granted Critical
Publication of KR100239027B1 publication Critical patent/KR100239027B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/42—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a gas or vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/083—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts the openings being via holes penetrating underlying conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/425—Barrier, adhesion or liner layers

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1019950053758A 1995-01-03 1995-12-21 연질 금속 도체 및 그 제조 방법 Expired - Lifetime KR100239027B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/367,565 US6285082B1 (en) 1995-01-03 1995-01-03 Soft metal conductor
US8/367,565 1995-01-03
US08/367,565 1995-01-03

Publications (2)

Publication Number Publication Date
KR960030335A KR960030335A (ko) 1996-08-17
KR100239027B1 true KR100239027B1 (ko) 2000-01-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950053758A Expired - Lifetime KR100239027B1 (ko) 1995-01-03 1995-12-21 연질 금속 도체 및 그 제조 방법

Country Status (6)

Country Link
US (4) US6285082B1 (https=)
EP (1) EP0721216B1 (https=)
JP (4) JPH08236481A (https=)
KR (1) KR100239027B1 (https=)
DE (1) DE69517295T2 (https=)
TW (1) TW351833B (https=)

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Also Published As

Publication number Publication date
DE69517295D1 (de) 2000-07-06
US6335569B1 (en) 2002-01-01
US6030895A (en) 2000-02-29
DE69517295T2 (de) 2000-12-21
JP4215546B2 (ja) 2009-01-28
JP2008182269A (ja) 2008-08-07
US20020096768A1 (en) 2002-07-25
JP5132400B2 (ja) 2013-01-30
JPH08236481A (ja) 1996-09-13
EP0721216A2 (en) 1996-07-10
JP2006066930A (ja) 2006-03-09
KR960030335A (ko) 1996-08-17
JP2004006768A (ja) 2004-01-08
US6285082B1 (en) 2001-09-04
JP4771526B2 (ja) 2011-09-14
EP0721216B1 (en) 2000-05-31
EP0721216A3 (https=) 1996-08-14
TW351833B (en) 1999-02-01

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