KR100225987B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR100225987B1
KR100225987B1 KR1019960064332A KR19960064332A KR100225987B1 KR 100225987 B1 KR100225987 B1 KR 100225987B1 KR 1019960064332 A KR1019960064332 A KR 1019960064332A KR 19960064332 A KR19960064332 A KR 19960064332A KR 100225987 B1 KR100225987 B1 KR 100225987B1
Authority
KR
South Korea
Prior art keywords
power supply
type
power
wiring
cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960064332A
Other languages
English (en)
Korean (ko)
Other versions
KR970053608A (ko
Inventor
도모히로 후지사키
도시카즈 세이
Original Assignee
니시무로 타이죠
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니시무로 타이죠, 가부시끼가이샤 도시바 filed Critical 니시무로 타이죠
Publication of KR970053608A publication Critical patent/KR970053608A/ko
Application granted granted Critical
Publication of KR100225987B1 publication Critical patent/KR100225987B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/998—Input and output buffer/driver structures

Landscapes

  • Design And Manufacture Of Integrated Circuits (AREA)
  • Logic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1019960064332A 1995-12-11 1996-12-11 반도체 장치 Expired - Fee Related KR100225987B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32167195A JP3369382B2 (ja) 1995-12-11 1995-12-11 半導体装置
JP95-321671 1995-12-11

Publications (2)

Publication Number Publication Date
KR970053608A KR970053608A (ko) 1997-07-31
KR100225987B1 true KR100225987B1 (ko) 1999-10-15

Family

ID=18135120

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960064332A Expired - Fee Related KR100225987B1 (ko) 1995-12-11 1996-12-11 반도체 장치

Country Status (4)

Country Link
US (1) US5796299A (enExample)
JP (1) JP3369382B2 (enExample)
KR (1) KR100225987B1 (enExample)
TW (1) TW312849B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321214A (ja) * 1996-05-30 1997-12-12 Mitsubishi Electric Corp 半導体装置
US6118334A (en) * 1997-05-19 2000-09-12 Kabushiki Kaisha Toshiba Semiconductor integrated circuit and power supply routing method and system
US6336207B2 (en) * 1997-05-27 2002-01-01 Matsushita Electric Industrial Co., Ltd. Method and apparatus for designing LSI layout, cell library for designing LSI layout and semiconductor integrated circuit
WO1999054937A1 (en) 1998-04-23 1999-10-28 Matsushita Electric Industrial Co., Ltd. Method of designing power supply circuit and semiconductor chip
US6210339B1 (en) * 1999-03-03 2001-04-03 Endosonics Corporation Flexible elongate member having one or more electrical contacts
JP3372918B2 (ja) * 1999-12-21 2003-02-04 日本電気株式会社 設計支援システム及びセル配置方法
US6667648B2 (en) * 2002-04-23 2003-12-23 International Business Machines Corporation Voltage island communications circuits
US7111266B2 (en) * 2003-11-24 2006-09-19 International Business Machines Corp. Multiple voltage integrated circuit and design method therefor
US7400167B2 (en) * 2005-08-16 2008-07-15 Altera Corporation Apparatus and methods for optimizing the performance of programmable logic devices
US7784010B1 (en) * 2004-06-01 2010-08-24 Pulsic Limited Automatic routing system with variable width interconnect
JP4787592B2 (ja) * 2005-10-14 2011-10-05 パナソニック株式会社 システムｌｓｉ
JP4603030B2 (ja) * 2007-11-12 2010-12-22 パナソニック株式会社 半導体装置
JP5727288B2 (ja) * 2011-04-28 2015-06-03 ルネサスエレクトロニクス株式会社 半導体装置、半導体装置の設計方法、半導体装置設計装置、及びプログラム
GB2526825B (en) * 2014-06-03 2019-01-09 Advanced Risc Mach Ltd An integrated circuit with interface circuitry, and an interface cell for such interface circuitry
GB2526823B (en) * 2014-06-03 2018-09-26 Advanced Risc Mach Ltd An integrated circuit with interface circuitry, and an interface cell for such interface circuitry
CN104764959A (zh) 2015-04-15 2015-07-08 京东方科技集团股份有限公司 点灯治具
CN116882357B (zh) * 2023-09-07 2023-12-19 飞腾信息技术有限公司 芯片缓冲器的布局处理方法、装置、终端设备及存储介质

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129828A (ja) * 1989-10-16 1991-06-03 Nec Corp 集積回路
JPH03263854A (ja) * 1990-03-14 1991-11-25 Fujitsu Ltd ゲートアレイ型半導体集積回路装置

Also Published As

Publication number Publication date
JP3369382B2 (ja) 2003-01-20
US5796299A (en) 1998-08-18
TW312849B (enExample) 1997-08-11
JPH09162294A (ja) 1997-06-20
KR970053608A (ko) 1997-07-31

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