KR100200378B1 - 아이씨 핸들러용 디바이스 반송 장치 및 디바이스 재검사 방법 - Google Patents

아이씨 핸들러용 디바이스 반송 장치 및 디바이스 재검사 방법 Download PDF

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Publication number
KR100200378B1
KR100200378B1 KR1019950018531A KR19950018531A KR100200378B1 KR 100200378 B1 KR100200378 B1 KR 100200378B1 KR 1019950018531 A KR1019950018531 A KR 1019950018531A KR 19950018531 A KR19950018531 A KR 19950018531A KR 100200378 B1 KR100200378 B1 KR 100200378B1
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KR
South Korea
Prior art keywords
tray
inspection
magazine
dut
conveyance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950018531A
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English (en)
Korean (ko)
Other versions
KR960001773A (ko
Inventor
히로토 나카무라
요시히토 고바야시
가츠히코 스즈키
Original Assignee
오우라 히로시
가부시키가이샤 아드반테스트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6171911A external-priority patent/JPH0815373A/ja
Priority claimed from JP7090376A external-priority patent/JPH08262102A/ja
Application filed by 오우라 히로시, 가부시키가이샤 아드반테스트 filed Critical 오우라 히로시
Publication of KR960001773A publication Critical patent/KR960001773A/ko
Application granted granted Critical
Publication of KR100200378B1 publication Critical patent/KR100200378B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1019950018531A 1994-06-30 1995-06-30 아이씨 핸들러용 디바이스 반송 장치 및 디바이스 재검사 방법 Expired - Fee Related KR100200378B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP94-171911 1994-06-30
JP6171911A JPH0815373A (ja) 1994-06-30 1994-06-30 Ｉｃハンドラ用デバイス搬送装置
JP95-090376 1995-03-23
JP7090376A JPH08262102A (ja) 1995-03-23 1995-03-23 Ｉｃテスタ用ハンドラにおけるデバイス再検査方法
JP94-090376 1995-03-23

Publications (2)

Publication Number Publication Date
KR960001773A KR960001773A (ko) 1996-01-25
KR100200378B1 true KR100200378B1 (ko) 1999-06-15

Family

ID=26431865

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950018531A Expired - Fee Related KR100200378B1 (ko) 1994-06-30 1995-06-30 아이씨 핸들러용 디바이스 반송 장치 및 디바이스 재검사 방법

Country Status (4)

Country Link
US (1) US5772387A (enExample)
KR (1) KR100200378B1 (enExample)
DE (1) DE19523969C2 (enExample)
TW (1) TW287235B (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0143334B1 (ko) * 1995-04-17 1998-08-17 정문술 반도체 소자검사기의 고객트레이 이송장치
CN1084476C (zh) 1995-07-28 2002-05-08 株式会社爱德万测试 半导体器件试验装置及半导体器件试验系统
KR100230070B1 (ko) * 1995-11-06 1999-11-15 오우라 히로시 반도체디바이스 반송장치, 반도체디바이스 자세변환장치 및 반도체디바이스 취출장치
JP3417528B2 (ja) * 1996-04-05 2003-06-16 株式会社アドバンテスト Ｉｃ試験装置
US5909657A (en) * 1996-06-04 1999-06-01 Advantest Corporation Semiconductor device testing apparatus
JPH10163385A (ja) * 1996-12-02 1998-06-19 Mitsubishi Electric Corp Ｉｃ着脱装置及びその着脱ヘッド
JP4020337B2 (ja) * 1997-02-07 2007-12-12 株式会社ルネサステクノロジ 半導体装置の製造方法
TW379285B (en) 1997-07-02 2000-01-11 Advantest Corp Testing device for semiconductor components and the testing trays used in the testing apparatus
DE19733062C2 (de) * 1997-07-31 2002-04-18 Rasco Ag Fuer Automatisierungs Zuführeinrichtung in IC-Handhabungsgeräten, welche elektronische Bauelemente, insbesondere integrierte Schaltungen (IC), aus mindestens einer vorgelagerten IC-Führung aufnimmt und mindestens zwei nachgelagerten IC-Führungen zuführt
US6593761B1 (en) * 1997-11-28 2003-07-15 Kabushiki Kaisha Toshiba Test handler for semiconductor device
JP3809008B2 (ja) * 1998-03-27 2006-08-16 株式会社アドバンテスト カストマトレイストッカ
DE19827458C2 (de) * 1998-06-19 2001-10-11 Helmuth Heigl Vereinzelungsvorrichtung für Bauelemente
US6092966A (en) * 1998-07-22 2000-07-25 Highway Equipment Company Multi-purpose dump unit for vehicles
KR100306301B1 (ko) * 1998-11-17 2001-10-20 정문술 모듈아이씨핸들러에서고객트레이내의모듈아이씨픽킹방법및그장치
DE19921243C2 (de) * 1999-05-07 2002-12-05 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US6264415B1 (en) * 1999-09-30 2001-07-24 Advanced Micro Devices, Inc. Mechanism for accurately transferring a predetermined number of integrated circuit packages from tube to tube
US6371715B1 (en) * 2000-07-03 2002-04-16 Advanced Micro Devices, Inc. Automated tube to tube transfer of a predetermined number of IC packages for various types of IC packages
US6449531B1 (en) * 2000-08-25 2002-09-10 Advanced Micro Devices, Inc. System for batching integrated circuits in trays
DE10128665A1 (de) * 2001-06-15 2003-01-02 Infineon Technologies Ag Verfahren und Vorrichtung zur Bearbeitung von Waferlosen in der Halbleiterfertigung
KR100395925B1 (ko) * 2001-08-01 2003-08-27 삼성전자주식회사 테스트 핸들러의 반도체 디바이스 로딩장치
US6719518B2 (en) * 2001-10-15 2004-04-13 Anadigics, Inc. Portable tube holder apparatus
US6781394B1 (en) * 2001-10-22 2004-08-24 Electroglas, Inc. Testing circuits on substrate
US6861859B1 (en) * 2001-10-22 2005-03-01 Electroglas, Inc. Testing circuits on substrates
US6771060B1 (en) 2001-10-22 2004-08-03 Electroglas, Inc. Testing circuits on substrates
KR100517074B1 (ko) * 2003-06-05 2005-09-26 삼성전자주식회사 트레이 트랜스퍼 유닛 및 그를 포함하는 자동 테스트 핸들러
US7362090B2 (en) * 2005-03-30 2008-04-22 Intel Corporation Automated tray transfer device for prevention of mixing post and pre-test dies, and method of using same
TWI275814B (en) * 2005-07-22 2007-03-11 King Yuan Electronics Co Ltd Electronic component testing apparatus
US7501809B2 (en) * 2005-09-22 2009-03-10 King Yuan Electronics Co., Ltd. Electronic component handling and testing apparatus and method for electronic component handling and testing
TWI424171B (zh) * 2011-06-23 2014-01-21 Hon Tech Inc Electronic component testing classifier
TWI472778B (zh) * 2013-08-30 2015-02-11 Chroma Ate Inc System - level IC test machine automatic retest method and the test machine
CN111942841B (zh) * 2020-08-19 2021-11-30 宁波三韩合金材料有限公司 一种料盘自动上料系统及使用方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715501A (en) * 1984-06-29 1987-12-29 Takeda Riken Co., Ltd. IC test equipment
SU1283043A1 (ru) * 1985-06-18 1987-01-15 Предприятие П/Я Р-6707 Загрузочно-разгрузочное устройство
JPH06102487B2 (ja) * 1985-07-31 1994-12-14 松下電器産業株式会社 部品供給装置
DE3539965A1 (de) * 1985-11-11 1987-05-14 Ueberreiter Ekkehard Vorrichtung zum pruefen und sortieren von elektronischen bauelementen
JP2710850B2 (ja) * 1989-03-27 1998-02-10 キヤノン株式会社 ワーク把持装置、ワーク及びその収納ケース
DE3912590A1 (de) * 1989-04-17 1990-10-18 Willberg Hans Heinrich Geraet zum beladen und/oder entladen von elektronischen bauelementen, insbesondere ic's, auf oder von traegern
DE4015315A1 (de) * 1989-11-29 1991-06-06 Georg Sillner Verfahren sowie vorrichtung zum einbringen von bauelementen, insbesondere elektrischen bauelementen, bevorzugt chips in vertiefungen eines gurtes
KR950001245Y1 (ko) * 1991-09-13 1995-02-24 금성일렉트론 주식회사 핸들러의 디바이스 자동 송출장치
US5330043A (en) * 1993-05-25 1994-07-19 Delta Design, Inc. Transfer apparatus and method for testing facility
US5588797A (en) * 1994-07-18 1996-12-31 Advantek, Inc. IC tray handling apparatus and method

Also Published As

Publication number Publication date
KR960001773A (ko) 1996-01-25
DE19523969C2 (de) 2000-10-26
US5772387A (en) 1998-06-30
TW287235B (enExample) 1996-10-01
DE19523969A1 (de) 1996-01-04

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