JPWO2024053457A5 - - Google Patents

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Publication number
JPWO2024053457A5
JPWO2024053457A5 JP2024545581A JP2024545581A JPWO2024053457A5 JP WO2024053457 A5 JPWO2024053457 A5 JP WO2024053457A5 JP 2024545581 A JP2024545581 A JP 2024545581A JP 2024545581 A JP2024545581 A JP 2024545581A JP WO2024053457 A5 JPWO2024053457 A5 JP WO2024053457A5
Authority
JP
Japan
Prior art keywords
contact
region
insulating layer
semiconductor device
gate electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024545581A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024053457A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/030991 external-priority patent/WO2024053457A1/ja
Publication of JPWO2024053457A1 publication Critical patent/JPWO2024053457A1/ja
Publication of JPWO2024053457A5 publication Critical patent/JPWO2024053457A5/ja
Pending legal-status Critical Current

Links

JP2024545581A 2022-09-09 2023-08-28 Pending JPWO2024053457A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022143916 2022-09-09
PCT/JP2023/030991 WO2024053457A1 (ja) 2022-09-09 2023-08-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024053457A1 JPWO2024053457A1 (https=) 2024-03-14
JPWO2024053457A5 true JPWO2024053457A5 (https=) 2025-05-21

Family

ID=90191242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024545581A Pending JPWO2024053457A1 (https=) 2022-09-09 2023-08-28

Country Status (4)

Country Link
US (1) US20250203898A1 (https=)
JP (1) JPWO2024053457A1 (https=)
CN (1) CN119856587A (https=)
WO (1) WO2024053457A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3647676B2 (ja) * 1999-06-30 2005-05-18 株式会社東芝 半導体装置
JP2003303967A (ja) * 2002-04-09 2003-10-24 Shindengen Electric Mfg Co Ltd 半導体装置およびその製造方法
JP6830390B2 (ja) * 2017-03-28 2021-02-17 エイブリック株式会社 半導体装置
JPWO2019103135A1 (ja) * 2017-11-24 2020-11-19 ローム株式会社 半導体装置

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