JPWO2023106152A5 - - Google Patents

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Publication number
JPWO2023106152A5
JPWO2023106152A5 JP2023566248A JP2023566248A JPWO2023106152A5 JP WO2023106152 A5 JPWO2023106152 A5 JP WO2023106152A5 JP 2023566248 A JP2023566248 A JP 2023566248A JP 2023566248 A JP2023566248 A JP 2023566248A JP WO2023106152 A5 JPWO2023106152 A5 JP WO2023106152A5
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JP
Japan
Prior art keywords
region
trenches
semiconductor device
main surface
impurity region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023566248A
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English (en)
Japanese (ja)
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JPWO2023106152A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/043762 external-priority patent/WO2023106152A1/ja
Publication of JPWO2023106152A1 publication Critical patent/JPWO2023106152A1/ja
Publication of JPWO2023106152A5 publication Critical patent/JPWO2023106152A5/ja
Pending legal-status Critical Current

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JP2023566248A 2021-12-08 2022-11-28 Pending JPWO2023106152A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021199504 2021-12-08
JP2021199503 2021-12-08
PCT/JP2022/043762 WO2023106152A1 (ja) 2021-12-08 2022-11-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023106152A1 JPWO2023106152A1 (https=) 2023-06-15
JPWO2023106152A5 true JPWO2023106152A5 (https=) 2024-08-22

Family

ID=86730224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566248A Pending JPWO2023106152A1 (https=) 2021-12-08 2022-11-28

Country Status (4)

Country Link
US (1) US20240282846A1 (https=)
JP (1) JPWO2023106152A1 (https=)
DE (1) DE112022005320T5 (https=)
WO (1) WO2023106152A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023131415A (ja) * 2022-03-09 2023-09-22 ルネサスエレクトロニクス株式会社 半導体装置
JP2024098458A (ja) * 2023-01-10 2024-07-23 富士電機株式会社 半導体装置
WO2025225319A1 (ja) * 2024-04-23 2025-10-30 株式会社デンソー 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5672766B2 (ja) * 2010-05-17 2015-02-18 株式会社デンソー 半導体装置
JP5811861B2 (ja) * 2012-01-23 2015-11-11 株式会社デンソー 半導体装置の製造方法
JP6283468B2 (ja) * 2013-03-01 2018-02-21 株式会社豊田中央研究所 逆導通ｉｇｂｔ
JP6421570B2 (ja) * 2013-12-20 2018-11-14 株式会社デンソー 半導体装置
JP6763727B2 (ja) * 2016-09-15 2020-09-30 トヨタ自動車株式会社 スイッチング装置とその製造方法
JP2018182254A (ja) * 2017-04-21 2018-11-15 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP7030665B2 (ja) * 2018-09-15 2022-03-07 株式会社東芝 半導体装置
WO2020080476A1 (ja) 2018-10-18 2020-04-23 ローム株式会社 半導体装置

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